最新拿到一家IC厂家的推荐设计文件3 @, T5 L+ t" I8 A% U: {
发现里面的大封装电容的两个焊盘全部贴的很近，1206封装的电容，焊盘间距大概只有10mil左右。3 X9 ~- }: p+ J2 s
The +V and GND traces between the capacitors should be as close to each other as possible.so that the gap between the two nodes is minimized.+ U# q$ {: s" I- N1 ~( z
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这样处理的意义何在？. z8 u/ I- `6 q+ [
减小ESR吗？
/1 
发表于 2012-9-21 15:35
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淘帖
支持！
反对！