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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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& R5 w( F3 Q A+ ~0 w- _0 j6 \1 k2 z | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发% U2 b" S `9 Q+ F# D
目录
, T9 V. q6 i e4 q. \* G# a1 概述(GENERAL)................................................................................................................................ 19 X( r; l3 K$ L- L) q0 y7 h( r
1.1 目的(Purpose)........................................................................................................................... 1
3 E b- d3 ?+ o4 v6 J2 W1.2 范围(Scope).............................................................................................................................. 14 Q4 u4 p( H6 J) S0 j, r
1.3 术语和定义(Terms and Definitions)......................................................................................... 18 j, {5 S% A1 {) D. ?) Y
2 应用文档(Application Documents) ..................................................................................................... 3: f7 U7 {2 _# N! y( j, `
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
3 C0 H5 ^2 E- T7 g8 p1 N$ T2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 31 g, E$ h5 f/ i8 h5 c
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3, U5 z- x% d* P
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
" `- q6 v6 y( R* Z1 Q3 n- F6 A$ W2.5 国际标准化组织(International Organization for Standardization)........................................... 35 C% w7 ]6 d P, r
2.6 参考文档(Reference Information) ............................................................................................ 3
1 }& O: t4 M* ~2 m4 R' q3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3( D8 z& P& b9 w; h, L0 Q
3.1 最初输入(Initial Input).............................................................................................................. 3
& K1 t$ [3 z* C3.2 设计方案(Design Options)........................................................................................................ 3
# t4 D1 k- j& l. C( \! A' G4 M4 C3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 36 I+ O& K! S/ D/ [& t
3.4 电气设计(Electrical Design)..................................................................................................... 3
- `+ X: N3 E x: z" C3.5 机械设计(Mechanical Design).................................................................................................. 3
, J( s1 T w3 ?1 \# e3.6 设计预审(Preliminary Design Review) .................................................................................... 34 y" ~) r4 i u; x
3.7 电路实验板(Breadboard).......................................................................................................... 33 |$ a# T* d& o# |# ]; P7 m
3.8 原型(Prototype)........................................................................................................................ 3
- m* c1 u- _/ T7 y7 b" v+ c3.9 文件编制(Documentation)........................................................................................................ 3/ e. b9 @( k, F7 J
3.10 最终设计评审(Final Design Review)..................................................................................... 3
: w" M/ I# v8 n4 e1 Z- Q" I5 i4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
, p2 _; A( e" T% Y8 W) A6 p4.1 产品特性列表(Design Features Listing) .................................................................................. 5. l0 w' C1 {4 F9 V5 q
4.2 原图(Master Drawing) .............................................................................................................. 5
0 o$ B. E" ]' E" u4.3 原始图形(Master Pattern) ......................................................................................................... 5
" J. q( G3 [1 V( A6 N; [) A5 材料(MATERIALS)............................................................................................................................ 5
* F& J6 e/ U8 V, l+ w ~" ?" p5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
0 }. C9 u: p0 X, r1 r, f8 e" _5.1.1 基材选择(Substrate Selection)....................................................................................... 5% B" V: D/ x% I: I
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 50 Z1 J0 Z) u4 j8 X" J& ^
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6* N1 M1 n8 R2 F, `6 M, {
5.1.1.3 厚度(Thickness) .................................................................................................. 6
& \/ M S% j( n# v$ {5.1.1.4 环境(Environment).............................................................................................. 7
% C& } u- T" J5.1.1.5 成本(Cost) ........................................................................................................... 7! l+ f1 m# p* V/ ?- g9 `( a8 @
5.1.1.6 供应商(Supplier) ................................................................................................. 78 v$ x8 v8 j1 `% A9 R+ d* K
5.2 粘接膜(Bonding Films)............................................................................................................. 7
1 f4 X# r) O3 W4 _0 S5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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, n9 Y% g( m" W) _- o$ U5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
8 s9 D+ ^/ {# T. y3 A8 P8 {1 H8 d$ h7 S; k5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8( Z4 i* n2 I. Y( [/ s2 O. Q
5.3 金属(Metals)............................................................................................................................. 82 n5 _+ a% u5 O- G, b+ }0 i
5.3.1 金属覆层(Cladding) ....................................................................................................... 8
& m5 V! R9 U; ~8 T5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8
5 U8 F: y. h% f, E1 @* f/ } u5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8$ [8 w, D9 ?6 l2 E
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
: n4 X# I3 T$ G$ x2 G1 h5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9$ T& A; Y3 D1 J5 B" ]# c* U& G
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9# E5 M9 V3 {# V
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
% s, n& w; \0 [) g; z+ P5.3.2.4 镀金(Gold)........................................................................................................... 91 Z* e/ d$ x# q( Z3 w$ r: }+ F
5.3.2.5 镀银(Silver) ......................................................................................................... 99 X+ v0 w# ?- P; A" g. h
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
2 @4 I( d& s( Y5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
9 D) n8 O7 E( s7 j3 H9 H4 d, F5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9* F; W" U5 T5 B: B
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9
( f. }8 d4 k1 Y5 B, q2 h5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
2 k" B: H7 d, i5 i1 @2 n5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
) A3 P' o4 T/ b8 T5.4 仿型涂层(Conformal Coating)................................................................................................ 10
- L; e0 V, C \) a4 o+ K8 E5.4.1 一般注意事项(General Caution).................................................................................. 109 x7 o; {! H; d/ Y
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 106 {& g1 _. Z" @$ k! _# c# G
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
' K2 Y" w6 A7 [+ w, N+ O/ w' \7 f6.1 带状线(Stripline) ..................................................................................................................... 11
/ s2 r v( b8 I- J( e4 o: l, Y6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 110 v6 k! F; D) f6 }- Y& Z! f5 T1 `
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11/ n6 U$ t7 ^ d" A
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
5 ~6 N! @! D: Y# C2 e6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12
& O H, b* h' H4 O+ n" m% J6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 125 o- S o4 _/ h
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
8 i9 t% u5 @. o* h7 [6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
0 {: P, T/ a$ ]( `1 Q& ~8 b& \! I6.3 微带线(Microstrip) .................................................................................................................. 13
j- v- E% _* k0 q6 k6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective" H5 C+ E1 Q5 R# B7 R5 Q
Permittivity f Microstrip)................................................................................................................ 13
% T# v; _; T- `# A5 ^4 M& ^6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15
0 @ J8 \3 R/ O6 G7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
: f, i$ ]4 Q# i& L3 j' R% |, q7.1 机械特性(Machined Features) ................................................................................................ 150 z- @7 v- F g* d6 {& @+ @+ ?
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
/ D( P3 c- p( b* }( w8 H7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 160 m3 D/ J; v3 d. m( j3 v- Q
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17, a, t h3 B }* x) F
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& q2 Y, m7 c2 v3 `1 o3 }, j0 ?7 @7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
) m: x5 V) A, N9 g7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18% q- Z2 {9 s4 K' j7 W1 K
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
2 [8 o N8 a; V4 z, W" a7.1.6 外形(Periphery)............................................................................................................ 18
: m1 m j# V* n! `% |$ s* I$ p7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
! j" o! | H2 t! W7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18$ F3 b K* I! a" ~& U) C; G! i8 X1 U
7.2 出图(Imaging) ......................................................................................................................... 18
2 q4 {8 G0 K9 I }, J7.2.1 底片(Artwork).............................................................................................................. 19
7 B/ T0 o8 Y( l+ z5 ?7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 197 E$ s. {, J' U! @
7.2.3 环孔(Annular Rings) .................................................................................................... 193 ]) Z( a o! T3 a2 I$ a
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19' C9 A5 S7 a7 H" O: v# ^7 a
7.4 金属化(Metallization) ............................................................................................................. 19' w! `! c( x; T* w
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 195 I- {% s a) j4 l
7.4.2 镀铜(Copper Plating) ................................................................................................... 19' t. x% ]2 m- x$ [: C/ H
7.5 蚀刻(Etching) .......................................................................................................................... 20# F& L# W, n5 G; U
7.6 粘接(Bonding)........................................................................................................................ 20, v, }. t+ d4 \4 J
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21' G- i; \- k i, s' t/ |
7.8 测试(Testing).......................................................................................................................... 21
# ]* E+ D4 d, n. z8 I" n8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
( J3 C* k! e. @; O8 g, P' I8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21- B8 w. Q: }$ g' N9 l3 h2 ]
8.1.1 机械固定（Mechanical Mounting）........................................................................... 214 l' q, t7 n2 s, _5 K& d% T
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
4 X& \8 n c/ y' w0 e* E+ N. G8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 215 C. _" L2 C) J, _* G4 ?
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22- F# `0 h F7 z2 s# D' j
8.1.4 软钎焊（Soldering）................................................................................................... 22
, ]5 T+ e: [# ^( f8.1.4.1 温度警示（Temperature Caution）.................................................................. 22 M5 {7 ~" d3 z, h% s; u7 n1 N
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22
9 [3 t9 g5 Q T) j8.2 连接器安装（Connector Attachment） ................................................................................. 22- _- C- o2 R. L# ]6 G0 i
8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
* v2 l, Z$ u6 q. Y4 [) R8.2.2 表面连接器（SuRFace Connector） ............................................................................ 23$ |7 c- ]. S" z! D# ?
8.3 器件安装（Device Attachment）........................................................................................... 23
4 ~, G+ k- l5 ?# O% r) R8 g8.3.1 焊接连接（Welded Bonds）....................................................................................... 23# ~* ]7 t( n; h9 M* c0 B0 x
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
4 S. |8 \# C0 e3 z, E8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23
6 b1 P. ?+ k" Y8 V$ }8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
7 a0 d% V8 O5 ^ T# I9 K, P8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
9 F( D: ?; ~! B( ]3 F q8.3.1.5 软钎焊（Soldering）........................................................................................ 24) N" O3 O% j! L) Z# f3 w- V& Q
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 248 L6 t9 Z& O1 Q9 x' _
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24) c8 N5 X5 H0 s8 S% J4 X+ d
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24# G3 a& r ?+ ~* `2 l6 B6 t* V& H
8.3.3 器件安装（Device Attachment）................................................................................ 248 ], i6 `/ r4 P1 N- w! y0 f8 q; m' c
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 249 ?$ G- D" S4 R6 a2 ~
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
' C- f: K' {- k1 S3 x9 J2 O7 }1 g3 N) @8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25* d6 D! d' ]/ ]" T" H4 Y1 G
8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 250 i4 }4 k4 Q1 R- j! d" ~7 ?& z
8.3.3.5 再流焊（Solder Reflow）................................................................................. 25. S) N4 P( J% |: r3 u! D4 m- K
9 质量保证（QUALITY ASSURANCE） .......................................................................................... 251 W# c, n; I' N T) R$ s
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
, @5 Y# [1 _ H* r' Y/ T9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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