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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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| 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发, `' l$ Z; w) \; E; n8 v, ~
目录' L7 n4 l! e' r6 B" |
1 概述(GENERAL)................................................................................................................................ 1' W; r+ \) d, f# }+ k
1.1 目的(Purpose)........................................................................................................................... 1
/ R- Q$ [6 h7 P2 x9 \* z- U1.2 范围(Scope).............................................................................................................................. 1
+ S# f- {7 {6 I* `# X% y1.3 术语和定义(Terms and Definitions)......................................................................................... 1
1 t7 H8 C+ M; v7 D( ?; ]4 P) @; {( }2 应用文档(Application Documents) ..................................................................................................... 3
# {9 g% |0 g9 _4 U0 o( {7 o2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
v2 L6 n- E8 s" E& u2 ]2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
* f' h2 ^ z3 T; [, S8 q% L/ m2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
2 L( U7 \- @6 F% C* o% m" r @2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 37 R5 }. }# T# L6 a, O. {+ \
2.5 国际标准化组织(International Organization for Standardization)........................................... 3- K2 \$ f8 V5 j: Z
2.6 参考文档(Reference Information) ............................................................................................ 3! a U1 q! x! M9 B; g$ h, O' n s
3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
2 ]4 |- c% q5 T1 X: \" {3.1 最初输入(Initial Input).............................................................................................................. 37 _7 `/ D4 m5 `( v2 y6 O! W: } o
3.2 设计方案(Design Options)........................................................................................................ 3 ?& J7 X/ r9 o+ G5 J, J9 H# \
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3
& @. N; [8 D0 Y# v. J3.4 电气设计(Electrical Design)..................................................................................................... 3
0 n0 i; y; u" ^% B. s+ T: {4 n3.5 机械设计(Mechanical Design).................................................................................................. 3
6 K3 e4 o1 t) ]3 C% R3.6 设计预审(Preliminary Design Review) .................................................................................... 3
4 A$ R/ o* h& Z& X4 U3.7 电路实验板(Breadboard).......................................................................................................... 3
5 N& ~$ x4 X1 w2 i$ T1 f5 m3.8 原型(Prototype)........................................................................................................................ 3
- N: `. L/ Y3 E0 j3.9 文件编制(Documentation)........................................................................................................ 3
' l: @) q- J, H7 h* ]3.10 最终设计评审(Final Design Review)..................................................................................... 3
$ @" T5 w7 v% t4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5' }1 X0 T( x+ Y5 ]) `
4.1 产品特性列表(Design Features Listing) .................................................................................. 5
) x3 j7 e, G/ ~0 ?% o \+ P4.2 原图(Master Drawing) .............................................................................................................. 51 ~* V, e* N# x! o( V
4.3 原始图形(Master Pattern) ......................................................................................................... 55 T9 Y; O6 w; O" G6 P5 [$ d; V2 A
5 材料(MATERIALS)............................................................................................................................ 5/ }+ r% \+ W7 G
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5+ u& I. N6 @3 N, g3 U
5.1.1 基材选择(Substrate Selection)....................................................................................... 5
& J) T: X" E& C! y9 j- C# `3 l5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 53 {. u9 W3 p- y8 z$ |6 h
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 69 @) D) S3 J: q* F2 J" v
5.1.1.3 厚度(Thickness) .................................................................................................. 6+ `0 ]3 _0 R0 W
5.1.1.4 环境(Environment).............................................................................................. 7/ S! D+ T* y* U
5.1.1.5 成本(Cost) ........................................................................................................... 7( J, G) Q) S% }+ ]1 W
5.1.1.6 供应商(Supplier) ................................................................................................. 7
8 d# v. {/ b; v( T5.2 粘接膜(Bonding Films)............................................................................................................. 7) z a A3 g6 x0 a/ X! E! {" o$ u" s
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7* I Y7 p. z/ ]3 {
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5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
5 y! |7 Q. G' H5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8/ X, ]6 P+ Q& E2 U. L
5.3 金属(Metals)............................................................................................................................. 8' u7 D- G1 G) `* _" L' ]( ?1 X
5.3.1 金属覆层(Cladding) ....................................................................................................... 8
: W4 _! P$ [- ^5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8: U5 h+ F" Z( @" n! e
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 85 [ t- z: D# G7 x
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
' y, ~, C; G/ e0 J5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
. K0 r. j" ]' `* ~; E k$ V5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9' d# Y" G, J \
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
' l) A% b' R1 o+ e4 u, B5.3.2.4 镀金(Gold)........................................................................................................... 9. j( w/ x4 H. g1 R( ^+ K1 W: d' p
5.3.2.5 镀银(Silver) ......................................................................................................... 90 q I: z# ?5 ~- w
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
8 M! }8 d0 V/ K4 C* y5 g5.3.2.7 焊料镀层Solder Coating...................................................................................... 9) }, q. D7 R9 u5 n$ d% j9 l
5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9: u& z4 R) j! q0 A; {
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 97 n0 `3 L. H$ Z5 |
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9. @0 i7 K' ~8 W
5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
8 n' ?) s0 N9 M& @1 g% R5.4 仿型涂层(Conformal Coating)................................................................................................ 104 \- F$ F9 i- @$ K$ p2 @) }
5.4.1 一般注意事项(General Caution).................................................................................. 10
# X& d) B/ t) a9 V5 O5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10
% x- C1 @' X4 Q" r. R; M; T- m6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
4 |6 e: k# d; C# b* V; O6 [* B7 g6.1 带状线(Stripline) ..................................................................................................................... 11
S( q' u8 Y8 }3 z0 A6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
" W- {3 {: f0 r6 r; E6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11% J! p; e* A Q! m0 D0 G) Y
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
0 U4 t" h* ?) k9 X5 q* f) O! k6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 127 H! J; M f8 F! E) F6 I/ [2 _
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12/ E; r9 d. I' F
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
7 ?$ P8 R2 l: z* x+ t1 _4 b6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
4 f. Y; d8 ?8 F1 o& F- J* z8 R6.3 微带线(Microstrip) .................................................................................................................. 13: C4 x; l2 l! C# W" Q3 d; ]
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective
" p1 ?3 b! @/ QPermittivity f Microstrip)................................................................................................................ 13
* S2 A ?+ @. l6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15* i1 ~; ]" X1 K n
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15- ^( {% q. L9 T2 i5 J. o' f
7.1 机械特性(Machined Features) ................................................................................................ 15* k9 A6 k' Z. x. A& J$ U1 R
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 151 c6 I0 V$ K9 |. U
7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16 U; c7 G4 b2 l& I' |
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 178 x0 c6 h# \! P; a' M
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) F& n/ o! t2 C* p/ N7.1.3 非金属化孔(Unplated Holes)....................................................................................... 170 A: H3 E* I# d% [6 L9 ~
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 185 e: c' q1 t3 f' Q1 G* W: ^1 I
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18; ?* L/ e: ]2 u2 l! O
7.1.6 外形(Periphery)............................................................................................................ 18
2 ~2 n" m ^! u% I3 T$ u4 i+ d) p7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
6 X7 e) Q; E6 M) ]: n+ T7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18# @% s3 I; T( } y
7.2 出图(Imaging) ......................................................................................................................... 18
" ~0 o2 n; p4 d7.2.1 底片(Artwork).............................................................................................................. 19. Y: S4 K( s/ @0 T
7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19
" ?: O8 G5 ]) P, ^1 W9 V7.2.3 环孔(Annular Rings) .................................................................................................... 19; l5 I: v) X! A8 }& @
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
3 ]/ `" Q; r% H8 L4 u& A7.4 金属化(Metallization) ............................................................................................................. 19
8 d* F9 q1 g( o7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
8 [. S) E# K# F1 u3 K/ y2 m7.4.2 镀铜(Copper Plating) ................................................................................................... 19: R# y% K5 p/ i8 m' ^/ f& Q: m4 Z
7.5 蚀刻(Etching) .......................................................................................................................... 20
* T; ~( ]/ y* f, F% i* Q, f7.6 粘接(Bonding)........................................................................................................................ 20
5 W% X' v6 X0 f. G2 v3 B2 b7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
2 l' H. [, ]4 J* ?8 m) H7.8 测试(Testing).......................................................................................................................... 21; r) i$ w( R2 |3 R& E9 j& F# \
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
: Z. S) g7 f/ V8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 219 f+ `3 X9 W j- T0 t
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
7 g8 T; Z1 q* }: T$ {% S) j, |, V8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21+ ?6 a! r# L ]& x5 D( S
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 215 j% e7 l* N- f/ h. x: J
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 226 m, K3 s; ]) j! M
8.1.4 软钎焊（Soldering）................................................................................................... 226 j" ^0 _; i9 N4 Q5 ^* m
8.1.4.1 温度警示（Temperature Caution）.................................................................. 226 J0 a( m' I8 j2 T$ X
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22
: Y, T. O' p, F( n0 A( D8.2 连接器安装（Connector Attachment） ................................................................................. 22
+ k& X/ o3 d, ?& A* i) ?5 K! o8.2.1 边缘连接器（Edge Connector） ................................................................................ 223 I0 N" z6 d6 Z% ~
8.2.2 表面连接器（SuRFace Connector） ............................................................................ 23; l7 a! l) j0 ~; \9 ^ |# w
8.3 器件安装（Device Attachment）........................................................................................... 23" F! B9 X( H1 u0 f
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
) d6 `6 B$ V& P* m( U! o8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23' z& Y. d/ v8 K- v( H
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 236 P4 J* r. |1 K5 w$ b
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24+ D- b9 F( ^4 u$ G
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 241 Z+ j( O1 `0 B; I5 C$ d* i/ C* ]
8.3.1.5 软钎焊（Soldering）........................................................................................ 24$ o! u% {* u, L$ B3 [
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
7 G! F& Y6 U5 S+ |1 k8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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1 R. B( z- U7 |# i9 \4 w8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24) I1 `. ]( F6 x# r
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
% S$ I/ C3 N; \8.3.3 器件安装（Device Attachment）................................................................................ 24+ y4 v$ ^+ p' _: c) v P
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
" X ^( F" W+ T+ [8 z8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
. o7 n3 M8 z# ^2 E1 M0 {8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
. A) t( B) [* e; A2 K. G( M4 p8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25" ^! z# u, s$ p/ J
8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
6 j c4 U( l& T9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25
3 d/ I% A8 G$ H% D$ i+ S9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25- c; F. v: W4 }4 @ A/ D
9.2 可靠性（Reliability）............................................................................................................. 9 w- H; b4 U2 }4 g
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发表于 2010-11-30 12:42
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