IPC-2252射频/微波电路板设计指南

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IPC-2252射频/微波电路板设计指南 IPC 2252射频微波电路板设计指南.pdf (1.51 MB, 下载次数: 440) 2010-11-30 12:42 上传 点击文件名下载附件 下载积分: 威望 -5

由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发 8 Y, N# ~( X# M8 G* M/ d! n; a目录 1 概述(GENERAL)................................................................................................................................ 1 1.1 目的(Purpose)........................................................................................................................... 1 & T( @$ g1 Q. X1 C1 M; p1 W, Y# ]1.2 范围(Scope).............................................................................................................................. 1 - V$ s: j; ]- I, ], y) {, N" ]! ^$ K1.3 术语和定义(Terms and Definitions)......................................................................................... 1 2 应用文档(Application Documents) ..................................................................................................... 3 ' X% G# U  m9 Q. p. q4 W4 U2.1 国际互联与封装协会(IPC) ...................................................................................................... 3 2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3 2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3 2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3 5 w: V+ k! p- A( \; ~2.5 国际标准化组织(International Organization for Standardization)........................................... 3 ; `) C& X) t; {* F0 L, O5 L2.6 参考文档(Reference Information) ............................................................................................ 3 3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3 # a# g7 h4 q; Y/ i3.1 最初输入(Initial Input).............................................................................................................. 3 1 k. h; y+ T% b# ]$ o3.2 设计方案(Design Options)........................................................................................................ 3 3 w; k+ Q* d) C  `3 o: [7 M3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3 & H1 ^2 U' j) E3.4 电气设计(Electrical Design)..................................................................................................... 3 " N% l4 k, `! l2 u: z' k. e3.5 机械设计(Mechanical Design).................................................................................................. 3 5 o' ?) w; s3 ?1 P0 i1 C: G3.6 设计预审(Preliminary Design Review) .................................................................................... 3 3.7 电路实验板(Breadboard).......................................................................................................... 3 . P$ p$ R) d3 b5 }- N! O3.8 原型(Prototype)........................................................................................................................ 3 + a3 C1 ~" R2 I9 C( c3.9 文件编制(Documentation)........................................................................................................ 3 " y4 ~( i( [* D$ z3.10 最终设计评审(Final Design Review)..................................................................................... 3 4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5 ! ]) _; L& W% O1 H4.1 产品特性列表(Design Features Listing) .................................................................................. 5 3 t' V2 E- Y1 S, V0 M7 e. q6 G! K1 M  x& R$ R4.2 原图(Master Drawing) .............................................................................................................. 5 4.3 原始图形(Master Pattern) ......................................................................................................... 5 2 t* V8 ]" R2 L" I5 材料(MATERIALS)............................................................................................................................ 5 & b* Y7 E8 |' i5 Y& F5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5 0 N3 S, o; u, a8 k1 U0 {- P5.1.1 基材选择(Substrate Selection)....................................................................................... 5 5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5 1 s5 z& [! v0 m6 p0 _6 J! j, x5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6 5.1.1.3 厚度(Thickness) .................................................................................................. 6 5.1.1.4 环境(Environment).............................................................................................. 7 5.1.1.5 成本(Cost) ........................................................................................................... 7 5.1.1.6 供应商(Supplier) ................................................................................................. 7 5.2 粘接膜(Bonding Films)............................................................................................................. 7 " W) \- v' @7 w5 f8 N- G) t6 {1 Z5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7 I ( \! D8 s% b/ v% QJuly 2002 9 E' S) T. Y/ M* c; w* k  F9 i5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7 ! M/ q. J* u4 Q! j5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8 5.3 金属(Metals)............................................................................................................................. 8 6 Q- Q% }& d8 `; n" g" o5.3.1 金属覆层(Cladding) ....................................................................................................... 8 5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8 5 q* q: T0 I  d  ^$ A- W, l) Q$ _5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8 5.3.2 金属镀层(Metal Plating) ................................................................................................ 8 5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9 5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9 5.3.2.3 镀镍(Nickel) ........................................................................................................ 9 + j/ E# w# g/ r' x$ o( D5.3.2.4 镀金(Gold)........................................................................................................... 9 5.3.2.5 镀银(Silver) ......................................................................................................... 9 . h; t1 }: i: T+ F1 [5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9 ; {. E  m# ]2 [1 k9 {# a1 J5.3.2.7 焊料镀层Solder Coating...................................................................................... 9 5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9 ) a7 s! K, E* g! Z" c- ~5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9 3 _" z* `3 V5 ]- H- }5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9 5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10 5.4 仿型涂层(Conformal Coating)................................................................................................ 10 0 b0 t% ~" M  G, s# U. M# }5.4.1 一般注意事项(General Caution).................................................................................. 10 , n( ?# B% m; D* o5 w' x5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10 - s& Y- P2 M7 y7 N6 L7 s6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10 $ H+ D( M5 B* j. A& R% i4 q. H( H6.1 带状线(Stripline) ..................................................................................................................... 11 + a/ W" f) [$ y3 o6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11 $ k/ t" |9 m  `0 a6 E6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11 6 k3 Y) `, _( I' @. g: M! _6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12 6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12 $ w. W/ O  K4 v' w+ f6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12 + \$ G( G- J. O# ~4 c" c8 t$ Y- ?9 r6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12 " T0 O3 h+ C1 T; e/ ?& a* r' ^; a6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13 , G* H# a* q: }3 y6.3 微带线(Microstrip) .................................................................................................................. 13 6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective 1 E# h% P2 y$ J4 D: LPermittivity f Microstrip)................................................................................................................ 13 6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15 7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15 7.1 机械特性(Machined Features) ................................................................................................ 15 9 y4 g0 L7 s" c. x( v/ A7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15 / ^# j) J6 y8 C2 a2 Z: l) C7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16 7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17 $ e+ o; f* t5 @II ) k7 e, n+ K' Z+ v* bIPC-2252 7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17 7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18 7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18 7.1.6 外形(Periphery)............................................................................................................ 18 9 C9 A- i# r. I% L( I% ]2 a1 x7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18 7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18 8 [. x; u- d, q* y2 T/ w9 K7.2 出图(Imaging) ......................................................................................................................... 18 1 o/ E% S3 h$ G" @4 s5 Z7.2.1 底片(Artwork).............................................................................................................. 19 1 D( o4 Y, I3 ^$ `. J7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19 7.2.3 环孔(Annular Rings) .................................................................................................... 19 7.3 PTFE活化(PTFE Activation) ................................................................................................... 19 ! c) X" ?2 A+ U7.4 金属化(Metallization) ............................................................................................................. 19 % k; I& K; K: z1 p/ [7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19 7.4.2 镀铜(Copper Plating) ................................................................................................... 19 7.5 蚀刻(Etching) .......................................................................................................................... 20 7.6 粘接(Bonding)........................................................................................................................ 20 ' O/ T9 I$ R" P7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21 7.8 测试(Testing).......................................................................................................................... 21 8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21 8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21 8.1.1 机械固定（Mechanical Mounting）........................................................................... 21 . X, V1 T5 f1 V; ?0 [8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21 , c* V6 d+ u3 \' ~1 _( ~6 V8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21 8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22 8.1.4 软钎焊（Soldering）................................................................................................... 22 8.1.4.1 温度警示（Temperature Caution）.................................................................. 22 0 z& ]3 n  }+ q* N" i- Z8.1.5 直接粘结（Direct Bonding）...................................................................................... 22 9 z5 D* n9 l% `# m0 _8.2 连接器安装（Connector Attachment） ................................................................................. 22 * e) Z! S% N- g7 M" H8.2.1 边缘连接器（Edge Connector） ................................................................................ 22 8.2.2 表面连接器（SuRFace Connector） ............................................................................ 23 ; E) d/ e- U" J1 g; N+ ~8.3 器件安装（Device Attachment）........................................................................................... 23 8.3.1 焊接连接（Welded Bonds）....................................................................................... 23 , y$ ]3 ~. t2 K; z% o% ]7 r8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23 2 ]- f+ i8 {3 {1 s8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23 8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24 - ^) s: o" \) ^, K  g" k8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24 2 {  A, J0 l( K8.3.1.5 软钎焊（Soldering）........................................................................................ 24 8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24 . W: n8 `: m7 f! p1 w' m" C# ~8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24 # \  D9 g" D$ F% f$ kIII 6 B. Z' y: ]* ^/ ^. K4 e+ nJuly 2002 ; A  Q0 O) u' o' o3 x7 h7 Z8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24 8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24 9 w& B: C0 P# Q. W+ C8.3.3 器件安装（Device Attachment）................................................................................ 24 ' ^# I( U* G: \8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24 8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25 8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25 ; l) o  r9 M- y8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25 $ `# V6 j0 O9 I* _( Z8.3.3.5 再流焊（Solder Reflow）................................................................................. 25 9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25 9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25 - t, v, h4 J$ G7 Y, n8 Q+ M9.2 可靠性（Reliability）............................................................................................................. . 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黑月

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liqiangln

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beihaifuyao

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lequwudi

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