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1.开料：CutLamination/Material cutting9 h# n# ^1 g Q3 J; @2 z4 L" E! V
2.钻孔：Drilling8 t% E) r' H7 M% `$ n
3.内钻：Inner LayerDrilling" d7 ]6 _" R7 ~
4一次孔:Outer Layer Drilling
# E$ Q N7 ^8 e 5.二次孔:2nd Drilling
" C7 G/ j* A) Y5 Z: @, U- Y 6.雷射钻孔aser Drilling /Laser Ablation
& l% p& y" G7 G, R9 `8 u H 7.盲(埋)孔钻孔:Blind & Buried Hole Drilling$ v v' Y5 F/ }5 |6 h- k
8.干膜制程：PhotoProcess(D/F)/Dry Film
0 |) G( F2 W' A+ y' X 9.前处理 (Pretreatment)3 d+ F# b9 ]8 @0 d3 E3 v" o
10.压膜ry Film Lamination+ a7 U* J# E& ]+ m
11.曝光:Exposure4 P; y3 r) M# I$ P5 @# q7 b
12.显影eveloping
- _ s2 }7 C2 x 13.去膜:Stripping
J+ ? h/ |. G. K 14.压合：Lamination# g% `) r& S3 }
15:黑化:Black OxideTreatment/ X2 Q! ]- v$ m0 R
16.微蚀:Microetching
: ~, m$ k6 I* j+ i 17.铆钉组合:eyelet
- ?6 }* w) P: I7 } 18.迭板ay up
3 m8 A+ K7 ]" q0 H 19.压合amination
3 @ L+ m1 c+ [& q 20.后处理ost Treatment
$ g5 U3 c: s* j- a 21.黑氧化:Black Oxide Removal# Y/ G! m v8 E2 a# R4 _
22.铣靶:spot face4 ~) X D* ^+ J7 [. T
23.去溢胶:resin flush removal
& n6 B1 n9 k6 | X. Z 24.减铜：Copper Reduction# H$ g2 J! J) z7 k- _4 A8 S
25.水平电镀：HorizontalElectrolytic Plating, T% y# x* `, J
26.电镀：Panel plating ^. X( h/ }* D& y
27.锡铅电镀:Tin-Lead Plating /Pattern Plating
" d8 X! X3 G, {, T8 r 28.低于 1 mil: Less than 1 mil Thickness
2 z2 }4 l5 K {: I 29.高于 1 mil:More than 1 mil Thickness
1 Z' C% E' Y) x7 S 30.砂带研磨:Belt Sanding$ r' F) ^( A# ^1 M' n
31:剥锡铅:Tin-Lead Stripping
$ E% B& U) G7 r 32.微切片: Microsection
% ^3 c4 u) p% l' S7 O8 M 33.蚀铜:Etching
* P; E/ t; Z2 a 34.初检:Touch-up; E; N% k4 s2 x0 [/ e
35.塞孔：Plug Hole
( C: w+ ~& I' i3 Q0 |! X 36.防焊(绿漆/绿油)：SolderMask7 M* q; n- H- p# i& |
37.C面印刷rinting Top Side
0 n9 Z5 M+ {/ Y! [5 x 38.S面印刷rinting Bottom Side. i! P$ X0 a; h3 T
39.静电喷涂:Spray Coating
3 d A" R8 w! m6 Y5 B 40.前处理retreatment
# i7 h/ _7 ?) y 41.预烤recure5 U' h5 ~3 P1 I9 d0 V
42.后烘烤ostcure
+ ~" W8 [' H2 T% b% a) ^ 43.印刷:Ink Print
+ t4 s( }, P ^, s& o7 d3 w# @ 44.表面刷磨:Scrub
( F! f% U$ B, A; M% H- U y/ I9 Q 45.后烘烤ostcure! F9 X& f: n( F8 q! d, f
46.UV烘烤:UV Cure3 ]! w# |5 o4 f) r$ s% g& O
47.文字印刷rinting of Legend8 T6 r/ [. r* ]) M& E
48.喷砂umice/Wet Blasting
0 R E6 e; `+ {9 [' Z 49.印可剥离防焊/蓝胶eelable Solder Mask)
\! p; I* Y o 50.化学前处理,化学研磨：Chemical Milling
& n) D& d1 [5 c) G9 M 51.选择性浸金压膜：Selective Gold Dry Film Lamination" U! i+ o" s& d6 Q5 @8 h! A# |
52.镀金：Gold plating" c6 |1 A4 n" a- f. f/ l M+ f
53.喷锡：Hot Air SolderLeveling; O0 k* L) ? h; I3 P+ y2 y
54.成型：Profile/Form1 Q# b: B* X8 \7 D1 f6 M) ~* ^
55.开短路测试：Electrical Testing
, l4 a. W2 L: z$ \# _" F/ r 56.终检：Final VisualInspection
: K) Z/ X& X& E4 h% O* R 57.金手指镀镍金：Gold Finger
3 Q& ~4 A/ I3 k 58.电镀软金：Soft Ni/Au Plating2 O7 {; }8 j: ]8 x+ s
59.浸镍金：Immersion Ni/Au / Electroless Ni/Au
( B8 E6 I) F0 f 60.喷锡:Hot Air Solder Leveling
- J5 P' _0 t; A+ v1 [8 E! X 61.水平喷锡:HorizontalHot Air Solder Leveling
& q9 N( z5 R: | H4 T# u 62.垂直喷锡: Vertical Hot Air Solder Leveling
; d- ?' B8 a7 [* W, R+ o 63.超级焊锡:Super Solder
2 r. R$ U6 I- G 64.印焊锡突点:Solder Bump
9 b* ?, i3 D. E8 V 65.数控铣/锣板：N/C Routing/Milling4 F9 M- B+ s7 F- \+ a
66.模具冲/啤板：Punch9 \5 K( c. P6 e- N W4 A
67.板面清洗烘烤：Cleaning & Backing9 X5 m: H! T7 O
68.V型槽/V-CUT： V-Cut/V-Scoring
* o* }* Q& y5 w3 t; F- n9 H! J( Z 69.金手指斜边：Beveling of G/F
% Z- ]* \; w$ ?- l% g; q 70.短断路测试Electrical Testing/Continuity & Insulation Testing
; t: T6 k9 ]) @. K0 X 71.AOI 光学检查：AOI Inspection
/ Z4 q% P+ @5 o 72：VRS 目检：Verified & Repaired! W8 z k r8 V% s, p6 o Z" Q1 U
73.泛用型治具测试：Universal Tester$ B5 e% {8 {7 ~* K$ r& ~5 i' V* [
74.专用治具测试：Dedicated Tester
- @, l* X2 l% i& s* I7 g3 A 75.飞针测试：Flying Probe
% f& e. G+ i$ w0 J3 N) e- i 76.终检：Final Visual Inspection. a$ J2 w' S( m" [# n
77.压板翘：Warpage Remove' f. D) \; L+ x$ @
78.X-OUT 印刷：X-Out Marking# U* h, w# L" d( k7 u5 b: a. B
79.包装及出货：Packing& shipping
W% r/ y# a0 P. q 80.清洗及烘烤： Final Clean & Baking
& ` L3 O+ n: t+ `$ a" ~ 81.铜面保护剂：ENTEK Cu-106A/OSP
) ~7 X( h& D- W; _+ `/ S 82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test
5 S' o3 x: ?; P1 C 83.冷热冲击试验:Thermal cycling Testing
" F2 {, N( p4 z4 j( A 84.焊锡性试验:Solderability Testing* J6 y% \/ I; S5 \5 K: P
85.雷射钻孔aser Ablation
' t, C/ c- @4 ^; o 86.雷射钻Tooling孔aser ablationTooling Hole6 x+ M& K' c8 _. O
87.雷射曝光对位孔aser Ablation Registration Hole" C% y' ^. K- w9 h. }, T! X
88.雷射Mask制作aser Mask7 ^/ D+ G( M6 O3 r4 }
89.雷射钻孔aser Ablation
2 ~ g& X# b2 D+ R 90.AOI检查及VRS:AOI Inspection & Verified & Repaired4 S8 L. Z0 ]9 o* G. c
91.除胶渣esmear
9 m& X8 L' R! G$ ]& Z: B8 B 92.专用治具测试edicated Tester
6 A; i P3 c. u- L) Q 93.飞针测试:Flying Probe
9 R: N5 X. H: X7 b4 N) l 94.压板翘: Warpage Remove
! ^1 B; l" W! {7 P0 O 95.底片：Ablation
' g9 O& f' M. W) @ 96.烧溶：laser)( \! N* A& Y# I
97.切/磨：abrade" {: w6 k' U( r5 G1 n' h2 {
98.粗化：abrasion
" H1 N" G' A' J9 K 99.耐磨性：absorption resistance% m! { B- d- m) u/ ]
100.允收:ACC /accept4 {8 x( h6 f$ [8 _' N# R8 v i E
101.加速腐蚀:accelerated corrosion test6 s. k, t! I ?" F
102加速试验:accelerated test
8 p% |2 `: A! [0 C6 L& p 103.速化反应:acceleration
6 X9 C2 V6 H( o& q* }# \* _ 104.加速剂:accelerator
+ E9 [) L7 V# ~' O6 I7 g 105.允许：acceptable1 ^$ a" E) h6 o% K; {9 s4 V# Z
106.活化液：activator
( n- S; g7 o; ]. m 107.实际在制品：active work in process+ Z% v$ | j7 m) z4 s( ~" v2 P/ Y
108.附着力：adhesion* R6 K4 {& W- c0 Q8 p+ P
109.黏着法：adhesive method
) z% R3 {4 r" r z 110.气泡:air inclusion
1 e# D, J1 M' J1 K6 d3 z 111.风刀：air knife
( n- X. k/ P4 W) y5 H6 i 112.不定形的改变：amorphous change F/ j( Q# n3 H& I7 K4 J
113.总量：amount
$ h4 w3 G: f- C* a' j 114.硝基戊烷：amylnitrite
5 D5 M, b( [- [; x6 B 115.分析仪：analyzer; U+ o8 \9 {6 {% P, Y
116环状垫圈;孔环annular ring
% P, j3 W" A8 o R/ S 117.阳极泥：anodeslime (sludge)
6 W& n: F2 \% [) ` 118.阳极清洗：anodizing
$ s ~" H2 O9 A0 R3 J 119.自动光学检测：AOI/automatic optical inspection
2 a- G) L4 m8 Y5 ] 120.引用之文件：applicable documents* N# ?3 e. R' t2 Z$ n- A$ C
121.允收水平抽样：AQL sampling2 K% q" z: I1 u+ P1 e0 m
122.液态光阻：aqueous photoresist$ u5 Q7 {% U0 q0 L
123.纵横比(厚宽比)：aspect ratioAs received
" P- I; F. q l) P) y4 a 124.背光：back lighting
1 U8 Z" V9 k h& b1 j H 125.垫板：back-up
q* r- [6 S0 c1 \ 126.预留在制品：banked work in process! O4 Z2 I C6 x) |6 W6 ~- b! k8 b# A
127.基材：base material
5 L1 V( p' G; \& t 128.基准绩效：baseline peRFormance; Y4 t; q8 ^) d
129.批：batch% a" L @# X0 V6 z/ j
130.贝他射线照射法：beta backscattering$ j, D6 R6 f" I5 w7 p
131.切斜边;斜边：beveling
! E7 p0 M( \4 g& T2 K; L+ p 132.二方向之变形:biaxial deformation; h/ W4 @( ^. W
133.黑化：black-oxide
1 W) [# p2 b1 _+ F: Z% ^2 g 134.空板：blank panel
: B. S4 G7 b& @% d2 j8 O7 X7 d Q# b 135.挖空:blanking
" l' P' F' e3 [4 J# W# Y- ] 136.弹开:blip2 e, J" X, W* f% R
137.气泡:blister blistering9 b( t2 b6 [% ]
138.吹孔:blow hole, x. z t$ `4 j7 f3 C
139.板厚错误:board-thickness error7 N! j5 m% S) m
140.黏结层:bonding plies
v, I+ h( X2 m0 Z( ` 141.板弯:bow ; bowing
' E) l. e3 A, k( }: u* O 142.破空:break out
# ~$ a8 W2 Q6 _2 T 143.搭桥;桥接：bridging
* G: o5 y. A- N2 s 144.接单生产：BTO (Build To Order)
6 p. _& p- Y+ z, P 145,.烧焦：burning2 V; X4 g; b, d( N7 `1 U
146.毛边(毛头)：burr
7 c; f5 G8 e; q, q: s5 x4 Z9 t- P 147.碳化物：carbide
$ f8 R/ E, Y$ H- m) Z8 y. j 148.定位梢：carlson pin E3 K* c" ]+ D; J5 F
149.载运剂：carrier
' A% V& V5 o' L9 q" Q 150.催化：catalyzing, m# a* K6 Z' i3 P3 }% B
151.阴极溅射法：catholicsputtering0 j4 R# u" j/ J9 M" K
152.隔板;钢板：caul plate& H2 Z0 M/ t4 K1 I
153.校验系统之各种要求：calibration system requirements* W0 ?( A& R) F) ^5 V) r6 m8 ^& t
154.中心光束法：center beam method
: C, h4 j$ W$ m0 y0 ~* t/ V 155.集中式投射线：central projection; V V' p; J8 \2 k
156.认证：certification
, g' ^! s' p o0 ^" r' j 157.倒角 (金手指)：chamfer chamfer0 U4 }# o& A2 }
158.切斜边;倒角：chamfering
( |% d( d0 \) x 159.特性阻抗：characteristic impedance
8 S; K6 W, m9 y& }, C 160.电量传递过电压：charge transfer overpotential
' L0 D1 p4 ~' n S 161.网框：chase
, n2 F; g% b0 E 162.棋盘：checkboard( W$ w$ u3 }- b6 F+ e% ~* u1 E
163.蟹和剂：chelator* P8 C/ t2 O8 s9 D8 m
164.化学键：chemical bond
9 x5 p) [# Y; C" d- \# e 165.化学蒸着镀：chemical vapor deposition
" a# |) j7 @; d" o: @' p: F 166.圆周性之孔破：circumferential void8 C) {) {: i7 z& L/ B2 ]
167.包夹金属：clad metal
5 p0 w* b. R2 I# T. l7 k9 A 168.无尘室：clean room
) Q/ e, V/ e' Z6 k4 M, b 169.间隙：clearance" q D+ F2 w5 b4 r$ B
170.表面处理：Coating/Surface Finish |
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发表于 2020-8-13 13:30
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