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1.开料：CutLamination/Material cutting% e& I: h; ?9 x e' I( Q9 h
2.钻孔：Drilling
) @1 A1 g$ ~' r7 [2 n1 W# u 3.内钻：Inner LayerDrilling
6 y% k0 `% X1 X& q 4一次孔:Outer Layer Drilling
9 l8 h' I9 Y% e1 h X! l( z5 v 5.二次孔:2nd Drilling
+ `3 w' k8 P% y% V& p* A6 d 6.雷射钻孔aser Drilling /Laser Ablation, A& @" [4 C, V+ G: f
7.盲(埋)孔钻孔:Blind & Buried Hole Drilling
" H) `& x% J" ^5 O9 }; D6 k 8.干膜制程：PhotoProcess(D/F)/Dry Film( r! ]3 u& S0 j# u0 |! j3 H! {# ^! H
9.前处理 (Pretreatment)+ U; ^9 f! o4 M4 w. c( K
10.压膜ry Film Lamination
* F5 q' h9 E& k4 T% H9 Y" v# ^& B 11.曝光:Exposure
8 K" a1 q. {% t( K5 r0 v; D 12.显影eveloping
T1 {/ M; g* h8 b 13.去膜:Stripping2 x& ^. x" e) C+ E3 K9 c% R n9 g
14.压合：Lamination1 j# o/ ?( o# ~/ F
15:黑化:Black OxideTreatment
/ L2 \ {) G Q. }0 Q 16.微蚀:Microetching$ L( T* R" Y6 I t' q; w2 t
17.铆钉组合:eyelet+ s8 E7 d+ m; ?) p' N' H: ~
18.迭板ay up6 R) m0 Y! f0 E/ @6 c: D$ D" b
19.压合amination3 w3 {; X( f {4 e
20.后处理ost Treatment
; v1 r- }' c9 K1 f1 Y9 g2 _( Y 21.黑氧化:Black Oxide Removal
3 }0 c, B% C# r7 F 22.铣靶:spot face
; ]/ {* a/ W8 s! {) f 23.去溢胶:resin flush removal
, H) d' }9 ]) k7 i 24.减铜：Copper Reduction
7 h$ t4 t6 J/ i2 @% }$ \ 25.水平电镀：HorizontalElectrolytic Plating
' _: ?9 s3 U' [0 L+ P! o 26.电镀：Panel plating. y# c. l1 I, l, K- O
27.锡铅电镀:Tin-Lead Plating /Pattern Plating1 l% @# `8 W4 `: ]0 l
28.低于 1 mil: Less than 1 mil Thickness+ ^( [' w7 \: `9 J/ X8 H6 L
29.高于 1 mil:More than 1 mil Thickness
' p) P$ L, l+ E/ p7 W 30.砂带研磨:Belt Sanding+ S2 o# D2 B% I- v7 G
31:剥锡铅:Tin-Lead Stripping
$ d( k/ i# ^3 Y" z4 P, ~/ C3 e 32.微切片: Microsection
' X e$ \. d$ k2 ^; |5 j; J 33.蚀铜:Etching% u' @0 c3 e F3 u
34.初检:Touch-up
- z4 y, K! ^6 B 35.塞孔：Plug Hole! A+ M/ Y% h" c6 b) i. z: _: t. m
36.防焊(绿漆/绿油)：SolderMask2 p1 { p9 U- |9 h; S9 ]
37.C面印刷rinting Top Side3 k, c3 H" ~2 o: x: h7 G: U% v
38.S面印刷rinting Bottom Side" G5 y, D2 G6 c
39.静电喷涂:Spray Coating+ w) Z9 h+ N$ C5 l3 I* ]
40.前处理retreatment
8 }" s& [9 ~7 @& e 41.预烤recure
( e1 Q! F$ F6 ]+ Y 42.后烘烤ostcure
. X2 ^/ l8 N8 G) n+ ^0 o 43.印刷:Ink Print2 a! q m9 U% F8 w1 f
44.表面刷磨:Scrub
+ d, l" r# k# x; } 45.后烘烤ostcure' x7 Y/ a; I0 f+ M7 [
46.UV烘烤:UV Cure
& v! u: l( J& J, y1 Z 47.文字印刷rinting of Legend' l$ a. ?+ M% H- L" D: g2 m
48.喷砂umice/Wet Blasting
5 m" j5 T1 L- O 49.印可剥离防焊/蓝胶eelable Solder Mask)/ W2 D7 k" ]/ f: J
50.化学前处理,化学研磨：Chemical Milling0 j4 w l8 r) M! u x
51.选择性浸金压膜：Selective Gold Dry Film Lamination
4 Y' U8 P% g/ Y; z9 Y! O% m 52.镀金：Gold plating
2 s9 q+ M1 H, n 53.喷锡：Hot Air SolderLeveling
5 h x5 A% b# }5 j* j 54.成型：Profile/Form
`1 u! r, z" ]5 r 55.开短路测试：Electrical Testing& e) Y3 W6 r. M+ ~: O
56.终检：Final VisualInspection
% B) z5 w' V2 v; v" S" p$ | 57.金手指镀镍金：Gold Finger6 t, f+ G0 U/ ^2 C
58.电镀软金：Soft Ni/Au Plating& G. t9 X2 s9 L
59.浸镍金：Immersion Ni/Au / Electroless Ni/Au, b+ v: Y6 t o& ?/ i( y7 X: \
60.喷锡:Hot Air Solder Leveling
, M9 X+ v% k% G 61.水平喷锡:HorizontalHot Air Solder Leveling+ D) M& |9 n- Z9 [. S! K$ S
62.垂直喷锡: Vertical Hot Air Solder Leveling
( i- q( r# V: C4 R2 N8 \ 63.超级焊锡:Super Solder
2 g' z- h0 X3 t3 \/ a8 h W 64.印焊锡突点:Solder Bump* o- R! l( l$ |- D6 m' G1 F; m
65.数控铣/锣板：N/C Routing/Milling! x0 Y% D8 k# z2 N
66.模具冲/啤板：Punch
7 f: L# L0 \& Q! d 67.板面清洗烘烤：Cleaning & Backing# v# g8 Q# [, t4 j/ M
68.V型槽/V-CUT： V-Cut/V-Scoring
+ i7 M1 Z t% K% }! m' h 69.金手指斜边：Beveling of G/F
2 G$ l: s1 t3 [5 t0 r 70.短断路测试Electrical Testing/Continuity & Insulation Testing( K" v5 r8 I8 R
71.AOI 光学检查：AOI Inspection
- R; P" a+ V8 p 72：VRS 目检：Verified & Repaired2 U3 G* I* @& a' w% d
73.泛用型治具测试：Universal Tester
/ P" ]! ^ r# q& B' ?6 o a9 L 74.专用治具测试：Dedicated Tester
) k- Y5 M' \% V, r* T 75.飞针测试：Flying Probe
2 e' ^, s- c9 E5 T2 C1 P* G+ v" G 76.终检：Final Visual Inspection
0 E, h! f! p' t 77.压板翘：Warpage Remove% V! U, d9 B" M; A% }
78.X-OUT 印刷：X-Out Marking* c4 A0 W9 U+ ?
79.包装及出货：Packing& shipping
' j9 r% ` H& [/ Y; h% G 80.清洗及烘烤： Final Clean & Baking
! g' b+ Q9 ^' o+ N 81.铜面保护剂：ENTEK Cu-106A/OSP. T5 ^. [ \" C. L+ N* y2 b4 f$ n
82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test2 s) F5 e3 Y( C# I: ^0 b8 Q
83.冷热冲击试验:Thermal cycling Testing
& `0 D* I C5 h$ q' a0 l- n 84.焊锡性试验:Solderability Testing
w$ R# t$ [* |# d0 U0 o 85.雷射钻孔aser Ablation
( d$ S$ A- {" m7 A 86.雷射钻Tooling孔aser ablationTooling Hole" `: y" w4 `2 Q8 w; @; k- @
87.雷射曝光对位孔aser Ablation Registration Hole, o1 ~6 h! W n8 l+ h
88.雷射Mask制作aser Mask9 E" L% @: P9 H/ f
89.雷射钻孔aser Ablation
2 a0 z. G/ s6 `7 O' b, B 90.AOI检查及VRS:AOI Inspection & Verified & Repaired
4 c3 p1 L: ?* A% `$ C. L 91.除胶渣esmear% \1 \9 Z. V; j* X+ D3 ^
92.专用治具测试edicated Tester
$ `. `$ Q1 g( P: H- Y 93.飞针测试:Flying Probe
6 I/ \* R7 g5 g i& K) | B 94.压板翘: Warpage Remove
% X6 G) C: `/ @: L 95.底片：Ablation6 _+ j7 U3 V8 y) [
96.烧溶：laser)- \1 `5 l* e+ |/ u+ Y1 O- `+ X2 d4 I7 |# y
97.切/磨：abrade2 H, A0 I" r& b4 B* s7 `4 e: ^9 m
98.粗化：abrasion7 m! N1 e$ {, z& ]
99.耐磨性：absorption resistance
/ K6 N8 C! e" H! Z) r" h" O 100.允收:ACC /accept7 r/ O. s! Q1 W3 B, Y9 `5 \
101.加速腐蚀:accelerated corrosion test
# l) |" u6 u) n5 w 102加速试验:accelerated test
2 m. C% Y/ X& n; D/ U 103.速化反应:acceleration
# C. V3 r6 C' o 104.加速剂:accelerator
0 W5 i6 V% ^& e* T& X6 ^1 ? 105.允许：acceptable7 H) P# C: F. A
106.活化液：activator) U& n. L9 A3 J" T8 o
107.实际在制品：active work in process
0 E/ S- Q; g5 ` 108.附着力：adhesion
( j7 s# `# u& Q( ~- F8 K; N9 o4 _ 109.黏着法：adhesive method
3 ? d8 K F# w2 O0 ~ 110.气泡:air inclusion
' h' x t! x1 p: l- u9 l: b z' \ 111.风刀：air knife
- L5 [, I$ ?9 R 112.不定形的改变：amorphous change5 ]3 m) c" l$ |5 [' t1 ?. d Z
113.总量：amount
. w% o$ Y6 }5 V: ]8 P 114.硝基戊烷：amylnitrite
3 x5 j* E) ]6 h- D. Q# p0 A' V 115.分析仪：analyzer
2 a- B- G8 }9 [ 116环状垫圈;孔环annular ring
$ Z0 S$ S( Q, z7 I8 x) F 117.阳极泥：anodeslime (sludge)
7 m/ ~+ y. [9 i. w0 a) } 118.阳极清洗：anodizing
& b! P7 V+ c- ?, P! N% j 119.自动光学检测：AOI/automatic optical inspection2 k) m3 Q- ^' ]# n' v$ C e8 D
120.引用之文件：applicable documents
3 E4 o$ K! ~; t( [+ J 121.允收水平抽样：AQL sampling" O) F( k! L* v, p# [+ M/ h% m
122.液态光阻：aqueous photoresist! D- ]0 v1 z2 O
123.纵横比(厚宽比)：aspect ratioAs received
( X6 X- W3 f, f a5 L2 s 124.背光：back lighting. O6 K+ P3 k* ]4 \6 V0 ?6 O
125.垫板：back-up( f/ w8 ~: B( K2 I
126.预留在制品：banked work in process
V6 p2 s% i ]5 u5 C& w% S 127.基材：base material
; |) ^, g: h0 o( ^4 A$ Q! _ 128.基准绩效：baseline peRFormance
- n* I6 A% ?+ I, j) l' E 129.批：batch
. f6 }, c$ i' ]* b% A 130.贝他射线照射法：beta backscattering
( V* {! O& x+ ^ 131.切斜边;斜边：beveling
0 Q8 s$ ?+ y( x7 i& ?) _ R. t 132.二方向之变形:biaxial deformation* O9 v9 f" a% N+ g7 i
133.黑化：black-oxide
3 f0 B* y& T1 f3 r9 D% f6 Z# @ 134.空板：blank panel$ H* _' p2 b/ k$ k. {, e$ G4 D
135.挖空:blanking/ ^5 b" ^. l | X V y
136.弹开:blip
' G: N- J& x& h: i1 n: L9 O/ U* I+ s 137.气泡:blister blistering
+ N! ] J# n3 g4 i 138.吹孔:blow hole
& W7 Y: Q! O. Z9 l9 m2 w 139.板厚错误:board-thickness error) o- R0 ?9 s* b: K$ R' D# R+ m
140.黏结层:bonding plies `5 ^7 ]3 A! D
141.板弯:bow ; bowing4 q9 l7 q3 J0 Z9 R. ^( T& M
142.破空:break out1 `; s2 H+ [: {1 l c9 R- e$ @# T
143.搭桥;桥接：bridging! I: w* M4 _' G; C; c- b
144.接单生产：BTO (Build To Order)
! O0 y3 m6 m" v3 L- ^# {5 [- k: _" |/ p 145,.烧焦：burning$ ` n1 D3 Q6 X, i
146.毛边(毛头)：burr
& q3 t r4 h- u' g! W2 W$ C 147.碳化物：carbide
4 l }, G* ^) O% H/ l 148.定位梢：carlson pin
/ w" t- O/ \+ I4 o+ d 149.载运剂：carrier
7 ^" V6 B7 X0 ?3 z 150.催化：catalyzing
2 Q, w& @9 u/ j) o: H 151.阴极溅射法：catholicsputtering6 ]' y% U, p5 I# d" b
152.隔板;钢板：caul plate! _! y8 B P3 l9 U4 ^2 q! f
153.校验系统之各种要求：calibration system requirements
" T" U5 n) C" @. s. Z! n 154.中心光束法：center beam method# i. c" D6 J) G2 N
155.集中式投射线：central projection
; u4 d7 R9 F4 R* Q2 D 156.认证：certification
, m9 E4 y$ q" A' h 157.倒角 (金手指)：chamfer chamfer4 p- h( A& u. }) M- m* X7 X% H
158.切斜边;倒角：chamfering5 U: h* I+ p" C
159.特性阻抗：characteristic impedance8 C) m' _# @% t4 K2 \% p- {) `
160.电量传递过电压：charge transfer overpotential
8 l& j1 s/ _0 b( M& Z 161.网框：chase
2 _2 |; x+ I* Z9 j) T 162.棋盘：checkboard8 g4 j' z5 ?$ l5 l+ n; d: W
163.蟹和剂：chelator9 [7 c6 U$ a# Q0 t+ {2 G
164.化学键：chemical bond6 M1 u2 x& v. V1 ^% Y
165.化学蒸着镀：chemical vapor deposition
; U: ~# T' R( U 166.圆周性之孔破：circumferential void
$ X( D* }' k% |! g 167.包夹金属：clad metal' u0 |$ h5 a' w5 X- W; Q
168.无尘室：clean room3 {9 i2 B0 A: q2 T6 m/ m4 a; m
169.间隙：clearance: d& p+ y% G" c$ R
170.表面处理：Coating/Surface Finish |
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发表于 2020-8-13 13:30
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