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1.开料：CutLamination/Material cutting
: h& s$ ^7 `5 \ 2.钻孔：Drilling
/ P6 H) t, J6 ?4 x9 j: I# ~5 Y 3.内钻：Inner LayerDrilling
2 Y0 k( r' P6 S- \ 4一次孔:Outer Layer Drilling* H/ ?0 {! s4 ~* G% H
5.二次孔:2nd Drilling8 J6 B8 Q9 l4 Q* i: S/ s
6.雷射钻孔aser Drilling /Laser Ablation! C% U1 _' _0 ?" a; k% {; _( O
7.盲(埋)孔钻孔:Blind & Buried Hole Drilling* C" V4 J3 R( F( p- O
8.干膜制程：PhotoProcess(D/F)/Dry Film7 Q0 X/ b _7 B7 k% E. {0 q' b
9.前处理 (Pretreatment)4 M0 m4 ?2 G) m
10.压膜ry Film Lamination
: [! s) X# r3 F1 i1 k/ } 11.曝光:Exposure0 y6 d: G7 M+ N7 K
12.显影eveloping0 I& a2 C$ u; o
13.去膜:Stripping( t/ w' h8 `$ k& H% B9 Q& g
14.压合：Lamination
" P. `9 T9 d8 q* y7 t8 z 15:黑化:Black OxideTreatment
* s4 N D0 v1 N3 i. W/ d 16.微蚀:Microetching
: k& a+ R4 d* X7 `/ e; _( W 17.铆钉组合:eyelet
" |" \' Z1 J4 m7 {8 A9 R 18.迭板ay up% S6 `) U" G( }
19.压合amination
% j9 Y1 x" ~, H8 U' m& u4 j 20.后处理ost Treatment4 ]" V4 s; `+ d0 m+ ~* r( M
21.黑氧化:Black Oxide Removal* H. q6 A6 y# p- c( y2 K
22.铣靶:spot face
1 o: H7 v/ G8 M+ c 23.去溢胶:resin flush removal1 ~( i9 j4 P, Y3 a/ m
24.减铜：Copper Reduction
* u' T# h* M" U. }' t# F# i- w 25.水平电镀：HorizontalElectrolytic Plating( ^0 e& j4 [' z: H
26.电镀：Panel plating# o) w: f% O" z$ \ z' c* e" a
27.锡铅电镀:Tin-Lead Plating /Pattern Plating
! P* q$ C+ S# k/ l9 [' k) c 28.低于 1 mil: Less than 1 mil Thickness9 u' j6 G! k! D- V
29.高于 1 mil:More than 1 mil Thickness
% w( t/ U4 R+ |5 Z& T: X& K! n 30.砂带研磨:Belt Sanding) m! n' P( u; m" _. l4 x+ n1 x
31:剥锡铅:Tin-Lead Stripping8 P. w; x. Q; A1 \- H' J. w
32.微切片: Microsection0 @( e( f# ], ~1 |% B
33.蚀铜:Etching' F5 l% i4 t9 X4 U8 y5 _4 @. X
34.初检:Touch-up
. N+ A1 l: V5 i. {& m: u* I 35.塞孔：Plug Hole
3 \7 [: ~: x5 _9 N* @7 U" M: C 36.防焊(绿漆/绿油)：SolderMask* }" B& A' v! W* `. t( s
37.C面印刷rinting Top Side
* e) `0 Y" c8 P' e2 @ 38.S面印刷rinting Bottom Side
) V9 N7 ?0 T" |/ z 39.静电喷涂:Spray Coating
' ~, z: e j$ P9 g+ A* l4 |+ G 40.前处理retreatment
: z) \' s- Q3 T0 y% s 41.预烤recure9 {* q& ~: F% t% X! t' X; ]1 J
42.后烘烤ostcure5 o/ A. v# t2 U' N# p, D& ?( H
43.印刷:Ink Print
! d3 I8 `0 x3 u. g 44.表面刷磨:Scrub. m% {+ W4 @/ b! N/ F
45.后烘烤ostcure
9 i8 u7 T J7 G$ s/ N4 `- [ 46.UV烘烤:UV Cure2 n& N: t! {5 G6 N2 j6 R- v
47.文字印刷rinting of Legend$ ?" D" ?5 H8 [' L8 m$ I
48.喷砂umice/Wet Blasting3 V1 z+ l# E5 s+ t( V
49.印可剥离防焊/蓝胶eelable Solder Mask)8 |1 N4 f% ^9 i
50.化学前处理,化学研磨：Chemical Milling
8 @9 [0 v) s+ @2 z$ g 51.选择性浸金压膜：Selective Gold Dry Film Lamination3 F2 `+ e5 y. k5 R
52.镀金：Gold plating
; I& t0 y- { [# E! }' ]/ ?$ r, P: e 53.喷锡：Hot Air SolderLeveling$ r4 V: V3 g% H5 F# i) N
54.成型：Profile/Form6 D$ ~! {9 o8 ?! m
55.开短路测试：Electrical Testing7 x" V" F4 m+ r. s! f; S
56.终检：Final VisualInspection
+ V; T2 ~& N3 ?4 { 57.金手指镀镍金：Gold Finger5 \! b4 h6 k C+ n: V! V Q2 E. P! D
58.电镀软金：Soft Ni/Au Plating
2 W3 q S, C& R' _ 59.浸镍金：Immersion Ni/Au / Electroless Ni/Au
& z: J J4 n8 e: U1 B; \ 60.喷锡:Hot Air Solder Leveling
4 c# d4 ~$ K G2 I 61.水平喷锡:HorizontalHot Air Solder Leveling
) A$ U( r/ w* i G 62.垂直喷锡: Vertical Hot Air Solder Leveling
5 |4 }: u1 v! p* d$ g# Q6 n 63.超级焊锡:Super Solder+ ^8 e1 s! C" Y: q
64.印焊锡突点:Solder Bump5 V6 W8 |" [4 ?# q2 N2 a) s+ h
65.数控铣/锣板：N/C Routing/Milling
: p) \- F$ x8 t9 a" u7 ], X+ }1 B& ? 66.模具冲/啤板：Punch
: x6 O! y; h% F' J. O- `8 O; | 67.板面清洗烘烤：Cleaning & Backing" {" u6 a1 g* k6 R5 \$ @
68.V型槽/V-CUT： V-Cut/V-Scoring
* k2 Z, {8 U9 s7 y 69.金手指斜边：Beveling of G/F
Z- q5 G3 h2 J0 O; r# F! B" c 70.短断路测试Electrical Testing/Continuity & Insulation Testing! L- V1 m4 S% u2 \4 o$ I% h
71.AOI 光学检查：AOI Inspection
" H3 O# U4 H' Z8 B6 Y% I 72：VRS 目检：Verified & Repaired% D. C, I: `1 u0 w/ \; X( y
73.泛用型治具测试：Universal Tester& w" B$ P# b' i, Q8 k; _# R5 O
74.专用治具测试：Dedicated Tester
" o1 e) f6 g# u4 ]4 a+ f 75.飞针测试：Flying Probe
% K2 m8 J! Q0 U, R, U% k 76.终检：Final Visual Inspection# D0 z3 Y9 z) ?9 f7 `
77.压板翘：Warpage Remove/ C8 Y/ s5 y4 t( \
78.X-OUT 印刷：X-Out Marking+ s0 [9 T4 F4 j1 U5 y2 C$ f
79.包装及出货：Packing& shipping
( U0 M# P7 v! [3 j 80.清洗及烘烤： Final Clean & Baking
" W; \6 B7 m6 F* m 81.铜面保护剂：ENTEK Cu-106A/OSP- u+ D9 \) U( N& z+ `: J
82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test: D. q7 H, j) M8 t8 d, a
83.冷热冲击试验:Thermal cycling Testing
# F, J1 r) A# d7 H6 Z5 l5 H2 y 84.焊锡性试验:Solderability Testing
4 Y9 h" E8 ]" [# t# K: ~* A 85.雷射钻孔aser Ablation3 h( t$ C( F1 I+ W% Q: u
86.雷射钻Tooling孔aser ablationTooling Hole) l. y: X3 V! j0 d7 F+ {# _: X+ ~
87.雷射曝光对位孔aser Ablation Registration Hole4 u X; z2 r& S5 _" } ^
88.雷射Mask制作aser Mask
3 s4 C. o( E- Z2 \& X4 k3 [" I* m2 g 89.雷射钻孔aser Ablation
+ I n- g& L7 j' z 90.AOI检查及VRS:AOI Inspection & Verified & Repaired8 x9 p' B4 H/ U
91.除胶渣esmear, l3 X& @/ Z) Q
92.专用治具测试edicated Tester
% u: n! p) ]& ]7 y5 e; }1 J" G# _ 93.飞针测试:Flying Probe
$ o; c7 n! v( W4 r* `! K; m8 R 94.压板翘: Warpage Remove
: l) _+ P, }3 c# v 95.底片：Ablation
& a. `' K) l8 `" S% V) W4 X 96.烧溶：laser)+ d, s) i# ^/ r" W
97.切/磨：abrade
, T9 Q7 ?3 {# ?3 a 98.粗化：abrasion- ^& B7 S; ~2 Z, i
99.耐磨性：absorption resistance2 [0 H. J. Z: V) h* y
100.允收:ACC /accept
9 X8 g# c/ j- X) \# S 101.加速腐蚀:accelerated corrosion test
5 Q" @2 x; l- H 102加速试验:accelerated test
( a+ y* o9 X, M 103.速化反应:acceleration, _5 n0 H0 u- h
104.加速剂:accelerator, v' f% b2 q- C" I' J" X
105.允许：acceptable
" l4 J. s2 |" h# K: T" v4 N 106.活化液：activator8 ^& V+ J: J% T( D
107.实际在制品：active work in process6 Q0 s- H) ]4 u& g
108.附着力：adhesion$ }0 v- \7 Q: J2 ]
109.黏着法：adhesive method
- A5 C; v/ h3 ^- U9 h: D8 e0 s 110.气泡:air inclusion# }8 _) u4 _# D3 {/ z/ x: X
111.风刀：air knife+ Q6 P, D- w# C( r
112.不定形的改变：amorphous change; G) ^" G+ ~9 u$ ?' W/ J4 g
113.总量：amount6 [) p7 t) ~3 L, u, q. U
114.硝基戊烷：amylnitrite" @- a. l, C0 b& P+ \
115.分析仪：analyzer$ V( e; n6 R P
116环状垫圈;孔环annular ring
$ \, o8 k8 X; W 117.阳极泥：anodeslime (sludge)
. {& T2 }# I* \1 F9 s1 | 118.阳极清洗：anodizing+ D2 I* r9 u+ e6 u9 m% x9 R% L! c
119.自动光学检测：AOI/automatic optical inspection c& V( y0 j9 X
120.引用之文件：applicable documents
8 x- b& k# M' v: e 121.允收水平抽样：AQL sampling
5 Z/ o( e: N8 i% x( b1 U0 c" x 122.液态光阻：aqueous photoresist9 Y. A1 A u5 b- c' `4 j
123.纵横比(厚宽比)：aspect ratioAs received/ S/ U5 ~3 u0 B. l4 r1 A
124.背光：back lighting+ |; {% z+ U5 }* l
125.垫板：back-up: Q) w2 [. `- b4 ~
126.预留在制品：banked work in process0 V: o/ P4 R i2 e+ _5 |5 ^! z- x; |
127.基材：base material) w) ?+ C+ }$ g: B2 Q# ?0 V v
128.基准绩效：baseline peRFormance* p! |1 i8 {2 C E
129.批：batch
1 t6 X, w' {4 G( S C( ^ 130.贝他射线照射法：beta backscattering
, b: k* }7 e# t+ F6 r 131.切斜边;斜边：beveling! w, _! L" i* o& ^* v
132.二方向之变形:biaxial deformation- f0 S4 {9 J$ {# ^ b3 b+ q6 @
133.黑化：black-oxide
& U, t( J7 F) t 134.空板：blank panel4 z! [. }3 V6 Q& E8 t/ P
135.挖空:blanking
4 K5 x7 d& M4 v* h1 h 136.弹开:blip
! r5 C4 ^' E b' _4 q/ S% U! { 137.气泡:blister blistering1 X( `- l0 z* @/ ^- N z
138.吹孔:blow hole$ i$ S3 f, q: i( v) p& \
139.板厚错误:board-thickness error" E6 q1 n/ ?* V# J# n
140.黏结层:bonding plies" V' u, d# V% T# k6 w' l7 }
141.板弯:bow ; bowing
6 M K$ M$ y$ R H7 Y$ i; t 142.破空:break out( F! j- \0 A8 N. X6 q
143.搭桥;桥接：bridging' w t/ N3 [; `% u
144.接单生产：BTO (Build To Order)$ c) v/ v! a& N% Q, I& m; A
145,.烧焦：burning
. V& M& ~7 Q/ a 146.毛边(毛头)：burr
1 W8 u: H8 C. u- x* Y 147.碳化物：carbide
: i; s$ X! d9 j8 A4 @7 u h+ c 148.定位梢：carlson pin
4 \5 N: g& L+ T6 _: E+ d( l 149.载运剂：carrier' V" I5 A4 _7 x3 o+ a( m1 R5 k
150.催化：catalyzing# a+ A% ?- }7 u0 R! |
151.阴极溅射法：catholicsputtering" {0 y R, }7 Z- E" Y
152.隔板;钢板：caul plate
6 F8 x3 F( @1 h: _- G9 r 153.校验系统之各种要求：calibration system requirements, h# J8 Z4 Y% J4 A
154.中心光束法：center beam method
# p ]+ }" ]6 w; c4 m 155.集中式投射线：central projection
8 K+ R) }- ?, z/ x+ g4 ` 156.认证：certification
9 }) n, n' ^& H) z: F; j" |3 a6 } 157.倒角 (金手指)：chamfer chamfer3 b2 s3 s! c% ?
158.切斜边;倒角：chamfering
4 ]6 X2 N; R5 Z 159.特性阻抗：characteristic impedance
3 J9 h' R. o# ]+ h5 ^8 | 160.电量传递过电压：charge transfer overpotential
; M) v a+ p) j, s1 A 161.网框：chase% _9 z5 v# ~6 G. ]7 g: g# B
162.棋盘：checkboard
' U) x u, M, N 163.蟹和剂：chelator7 W9 }1 A0 a1 I& ?& J+ ^. G
164.化学键：chemical bond- t2 C& y: F6 u5 K
165.化学蒸着镀：chemical vapor deposition$ B& e' o* V3 Y2 `. Q$ @" e
166.圆周性之孔破：circumferential void3 v4 }/ |/ Y# m# r! b/ }% R
167.包夹金属：clad metal4 \' S/ g. R' g6 f
168.无尘室：clean room8 x+ x4 m3 n& O u0 q# X5 `) g! n. a
169.间隙：clearance
0 Y7 w( z7 x9 d7 b5 H/ H 170.表面处理：Coating/Surface Finish |
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发表于 2020-8-13 13:30
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