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Standard PCB Layer Stack Up – 4 to 12 Layer
& {' `' A# |. v4 s) A& `: sPre‐Preg Thickness ‐ 1080 = 3.04 mil ‐ 2116 = 4.67 mil ‐ 7628 = 7.68 mil& r/ D- ?0 P0 {0 s; p& O4 y2 J- a
4 LAYER
' W" [6 b) I6 x( l0 f, i5 R/ q# oTop Layer ‐ 18um Copper Foil (plated to 35um+)
* V5 o- ?3 p5 v* r G' @Pre‐Preg ‐ 1 x 1080 + 1 x 7628 D5 a( d( m& b& q% y
Layer 2 & 3 ‐ 1.0mm Fr‐4 Core with 35um/35um Copper
( `! N; C1 P" W: s. A [Pre‐Preg ‐ 1 x 1080 + 1 x 7628$ A3 O/ U- k2 U8 Z D q* [+ H: L; M
Bottom Layer ‐ 18um Copper Foil (plated to 35um+)4 F% Y3 W( @$ r' N& }% U/ k
1.6mm +/‐ 10%' M! u/ ^% h1 z
6 LAYER
0 A' r3 ~% |# F3 q4 n9 A2 h/ G3 iTop Layer ‐ 18um Copper Foil (plated to 35um+)8 p: u- y, c/ I- E, z% G9 ?
Pre‐Preg ‐ 1 x 1080 + 1 x 76284 V+ l C( P4 f" Z$ G, X
Layer 2 & 3 ‐ 0.36mm Fr‐4 Core with 35um/35um Copper
( ]# X O6 X$ n( k5 \- S& v3 W! gPre‐Preg ‐ 1 x 7628
4 o, v s& r. R8 {1 k& CLayer 4 & 5 ‐ 0.36mm Fr‐4 Core with 35um/35um Copper9 c$ i3 @ c0 x+ G7 _* r z# K9 i
Pre‐Preg ‐ 1 x 1080 + 1 x 7628; {) @0 e0 S. N. J3 w- k: Y
Bottom Layer ‐ 18um Copper Foil (plated to 35um+)
6 C' g \- P8 c0 \; F4 x K1.6mm +/‐ 10%
' B0 C, V/ U3 G9 ^3 i- d3 `8 LAYER7 Y. Q7 X. L7 O: a7 I
Top Layer ‐ 18um Copper Foil (plated to 35um+)1 v& e0 a$ s; l/ {0 B
Pre‐Preg ‐ 2 x 2116
* ?' w2 n3 ~4 ELayer 2 & 3 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper
8 a& q5 c( F W ^7 H1 A) cPre‐Preg ‐ 2 x 2116) r! l2 U; o M! ?9 R; m7 b
Layer 4 & 5 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper
# e" \( L: ?3 APre‐Preg ‐ 2 x 2116
& b* @& F/ w$ A& U6 nLayer 6 & 7 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper2 v3 ^& ^& x9 J v7 f& e
Pre‐Preg ‐ 2 x 2116, X1 v; P, l, z
Bottom Layer ‐ 18um Copper Foil (plated to 35um+)/ C$ H$ V) H* V5 E" K* P8 P1 }) P+ c
1.6mm +/‐ 10%4 f8 _8 P& S' Q- b( i: y
10 LAYER
h2 _6 r, g0 ]( }- iTop Layer ‐ 18um Copper Foil (plated to 35um+)
. {' X* G+ D9 M4 }& A( ~Pre‐Preg ‐ 1 x 2116. p7 t/ g7 r2 h7 f! h# n! y
Layer 2 & 3 ‐ 0.18mm Fr‐4 Core with 35um/35um Copper
3 u& j; I' M1 ]Pre‐Preg ‐ 1 x 2116" {/ k1 p0 C( ]" K5 j* ]
Layer 4 & 5 ‐ 0.21mm Fr‐4 Core with 35um/35um Copper
7 ?7 X( r" M; V9 d, @9 q0 _8 ~8 [# bPre‐Preg ‐ 1 x 21166 s7 y) X9 d L$ H9 h- K3 ^, v
Layer 6 & 7 ‐ 0.21mm Fr‐4 Core with 35um/35um Copper
4 f- G* [. }; a6 n$ V3 l+ _8 v8 |1 qPre‐Preg ‐ 1 x 2116
% ]/ Z5 H' @ i5 Q8 A* O. iLayer 8 & 9 ‐ 0.18mm Fr‐4 Core with 35um/35um Copper
8 h3 V7 i3 \/ X/ {9 N, M5 pPre‐Preg ‐ 1 x 2116
; A3 h8 {) g4 H8 _8 j! q- A9 \Bottom Layer ‐ 18um Copper Foil (plated to 35um+)
( H t- w" {8 t: n' [# ^ I. p1.6mm +/‐ 10%: p- @" v/ T; }
12 LAYER) h' U- D$ m9 `7 `
Top Layer ‐ 18um Copper Foil (plated to 35um+)
6 _+ i5 |2 M( ]0 @9 bPre‐Preg ‐ 1 x 2116
* Y) s$ i" A5 Y8 hLayer 2 & 3 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper; j- L& u$ w9 u2 J
Pre‐Preg ‐ 1 x 2116
( ?; j* E% T0 C1 M* H FLayer 4 & 5 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper
; a3 K7 s! t% n" b5 zPre‐Preg ‐ 1 x 2116
! p& y9 c2 Q0 G$ HLayer 6 & 7 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper+ h }( d, G5 @) ]
Pre‐Preg ‐ 1 x 2116
6 V! e2 D5 W# F$ Q: m: k9 MLayer 8 & 9 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper# N* H# n' E/ T2 W* t
Pre‐Preg ‐ 1 x 21160 [# m/ z, Z8 |5 ?% Y# e; e; }9 q
Layer 10 & 11 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper0 O2 b( c1 m# D; y: b
Pre‐Preg ‐ 1 x 2116' z, s: i7 I5 @# q% j/ v! S- J3 Y0 k' Z
Bottom Layer ‐ 18um Copper Foil (plated to 35um+); J, C3 O- w7 @+ X$ d, W
1.6mm +/‐ 10% |
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发表于 2010-4-12 15:12