Mechanical via split into Stacked via?

karpcb15

We proposed the stcakup to manufacturer is  4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 , mechanical via from layer 1 to 4.
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but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias My Question is why manufacturer changed mechanical via to stacked via? cost also increased increase while using stacked vias?

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gavinjzz

各位都是外国人么，装逼都说英语

karpcb15

oh..

tencome

那是因为钻孔时，孔尺寸小于100um时，必须使用激光钻孔。
而激光钻孔时，不能钻太厚的板子。    所以要分开钻。

钻孔尺寸大于等于100um时，就是用机械钻孔，就是一次性从第1层钻到第4层。

karpcb15

  B1 f) ^1 `3 d9 h6 d7 [, k谢谢

kkk228

谢谢楼主