Both TH and Blind/Buried Via together?

karpcb15

I designed  4 layer substrate using both Through hole (L1-L4) and Blind(L1-L2 , L3-L4) , buried vias(L2-L3) . Is this possible to Manufacturer?

xyylucky

这样做的话，怎么压板啊？想不出来。
如果是埋孔加通孔，L1+（L2+L3)+L4这样压，还可以。
要不改成6层板，问问工厂能不能按假6层做。
0 \8 P7 B/ A, c1 d8 w6 Q& R

karpcb15

We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.
0 j. T& [+ m) R* y( ~" a& m- ]/ u
but Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias
2 v5 g3 D+ i% P! T$ A
1 ~* A5 n$ k% s$ }My question is why manufacturer changed mechanical via to stacked via?

cost also will increase while using stacked vias?
, R" a7 y! `! U" `

xyylucky

工厂有没有给你们提供叠层结构，工厂有没有说，他们修改的原因， 另外提出问题的人是你们公司的PE 工程师还是硬件工程师？

xyylucky

在我的认知里，想不出用什么工艺来实现，抱歉。

zltwin

博运发

kentwong2018

Yes ... It's a normal layer stack-up(1+2+1).