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本帖最后由 超級狗 于 2023-5-25 09:56 编辑 6 \9 `. f2 r7 _/ U a6 ^
. G% k) |. ]6 S- b8 M6 r2 L. CTI Implementing Serial Rapid I/O PCB Layout on a TMS320TCI6482 Hardware Design* ]7 f, B$ s2 D
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4.3.3 Interconnect5 I: S+ [( a# ]- {: N
The geometry of the traces to link the transmitter and receiver ends is determined by the placement in the target system. Therefore, it is not possible to specify an exact layout for the interconnect. Instead, the trace may be placed as required, so long as it meets the following requirements:0 w, K& T% v; r# r
- Edge-coupled, matched-length (±50 mils) differential pair.
- No stubs.
- No more than 30 inches (75cm) pin-to-pin, for 8-mil (.2mm) wide traces over FR4 material.
- 100 ohm differential impedance.
- No more than 3 sets of vias (not including via for BGA breakout on transmit end).
- Other signals are separated by at least 2x the differential spacing.
- Internal layers are strongly preferred. Avoid top and bottom layers.
- If connectors are used, they must be of a suitable 100 ohm differential-impedance, high-speed type, and count as 1” of trace for each connector pair.
- If cabling is used, it must be of a suitable controlled-impedance type (100 ohm differential or 50 ohm single ended), and counts as 1" of trace for each 1' of cable.
- If a mid bus probe is used, it must follow both TI’s and the probe manufacturer’s guidelines, and counts as 2” of trace., e9 _2 T6 `6 M6 s+ Q- K% f
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