TA的每日心情 | 开心 2021-12-17 15:14 |
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签到天数: 31 天 [LV.5]常住居民I
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1. Do not use thermal relief connection to the VIN and the GND pin. Pour a maximized copper area to the GND pin and the VIN pin to help thermal dissipation. 2. Input capacitor should be connected to the VIN pin and the GND pin as close as possible.
' Z; M( O" n% T* V. ^# K$ D3. Make the current trace from LX pins to L to Co to the GND as short as possible.+ r' f' C: g w6 [
4. Pour copper plane on all unused board area and connect it to stable DC nodes, like VIN, GND or VOUT. # ~# D5 D/ Y: E T( _
5. Keep sensitive signal trace such as trace connected with FB pin and COMP pin far away from the LX pins.
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