PCB专业基材用语

uperrua

0 _1 d/ R0 W; p: ^/ U1、 基材：base material
2、 层压板：laminate
( e: A: p& B2 x  C+ v3、 覆金属箔基材：metal-clad bade material
4、 覆铜箔层压板：copper-clad laminate (ccl)
5、 单面覆铜箔层压板：single-sided copper-clad laminate
: C# }: g! S1 T, K! X6、 双面覆铜箔层压板：double-sided copper-clad laminate
1 i% }1 g3 F0 [$ r" t7、 复合层压板：composite laminate
8、 薄层压板：thin laminate
& T" G: s- M% ~6 m' V9、 金属芯覆铜箔层压板：metal core copper-clad laminate
10、 金属基覆铜层压板：metal base copper-clad laminate
; i1 w# @# o; O: q; [11、 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
& r9 V/ G' x: |, M  V( w) n8 K- L12、 基体材料：basis material
, T& i3 h& Z1 y9 `8 L& D% M7 L13、 预浸材料：prepreg
14、 粘结片：bonding sheet
15、 预浸粘结片：preimpregnated bonding sheer
16、 环氧玻璃基板：epoxy glass substrate
1 z! l. s6 l# s7 {- @9 C8 f4 p% d17、 加成法用层压板：laminate for additive process
18、 预制内层覆箔板：mass lamination panel
' r3 S5 |+ Y+ I3 N" X2 u19、 内层芯板：core material
20、 催化板材：catalyzed board ,coated catalyzed laminate
21、 涂胶催化层压板：adhesive-coated catalyzed laminate
' P+ u% L7 ~3 E6 C4 d6 R, ?22、 涂胶无催层压板：adhesive-coated uncatalyzed laminate
  c) Y) S' D, p* t& M2 a& m23、 粘结层：bonding layer
+ ]8 K% e' E0 f4 G24、 粘结膜：film adhesive
: C; b* g7 o: r3 @25、 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
26、 无支撑胶粘剂膜：unsupported adhesive film
27、 覆盖层：cover layer (cover lay)
- m! e, [  ?* R- v0 E28、 增强板材：stiffener material
29、 铜箔面：copper-clad suRFace
30、 去铜箔面：foil removal surface
31、 层压板面：unclad laminate surface
$ A5 \& d; Y; H# G: C: ^; l32、 基膜面：base film surface
33、 胶粘剂面：adhesive faec
34、 原始光洁面：plate finish
35、 粗面：matt finish
36、 纵向：length wise direction
) L1 L6 W. G) ~/ s/ b37、 模向：cross wise direction
38、 剪切板：cut to size panel
39、 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
8 |. n2 v  v# E7 B5 O* U5 l, m40、 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
41、 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
# {$ z. f  G' s1 R; P$ j' {42、 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
9 F4 p4 q7 o: I6 c; u4 j  O" g5 I0 V43、 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
! W! u  ^9 M! U44、 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
- O8 y- o0 \0 e! g8 o/ u; t' q46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
+ l0 {' C( L9 ]! N5 f48、 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
- K7 n0 F6 s$ f5 U& @  ?/ l4 \49、 超薄型层压板：ultra thin laminate
50、 陶瓷基覆铜箔板：ceramics base copper-clad laminates
" S' b" d! x7 A; r" X( p6 Z51、 紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates
* y+ P8 [  Z/ L6 }8 T5 v! ^

xiaogegepcb

PCB专业基材用语

adogpp

双面覆铜箔层压板：double-sided copper-clad laminate

youOK

基板还这么多词呢，长知识了

啊宝是条小鱼崽

good;P;P