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[仿真讨论] SI9000 11.04发布,增强了铜箔表面粗糙度选项!

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1#
发表于 2011-5-26 11:41 | 只看该作者 |只看大图 回帖奖励 |倒序浏览 |阅读模式

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本帖最后由 stupid 于 2011-5-26 11:43 编辑
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( e  p% G4 k9 Y. v3 J. {Polar enhances Si9000e transmission line field solverColin Holland
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Polar Instruments has added enhanced modeling of both the drum and matte suRFaces of copper layers in high-speed PCB stack-ups to the Si9000e PCB transmission line field solver.3 s  i4 |' i8 s2 A( O
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Copper surface modeling adds an extra dimension to the accuracy of insertion-loss management across a range of frequencies, which is particularly important for the fabrication of multi-GHz PCBs. ! ~5 P( Q7 L4 t: h2 }
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The enhanced Si9000e system gives PCB fabricators the ability to provide advanced control of insertion losses and to combine lower material costs with higher manufacturing yields.
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* V) c2 i  F! FThe matte surface of copper layers in PCBs is chemically treated to give greater adhesion to the dielectric layers in PCB stacks. At low frequencies, surface roughness has no affect on PCB performance because the current is able to penetrate below the surface of the copper layer. $ Q, @8 C3 [4 V' ?

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However, in high-speed PCBs, a ‘skin effect’ causes most of the current to flow along the surface, following the rough contours of the copper and therefore increasing both the distance and resistance. The amount of attenuation is determined by a combination of the roughness of the matte copper surface and by the frequency of the PCB. 3 d/ x& k& p2 p5 P1 K
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In addition to modeling transmission line losses on both the smooth and treated sides of the copper layers, and importing material Er and Tan delta over multiple frequencies, the Si9000e’s powerful boundary-element method (BEM) field solver models over 100 PCB transmission line structures.
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The Si9000e can help designers to predict impedance, attenuation, RLGC, and s-parameters with frequencies ranging from a few kHz up to the point where the line ceases to operate in TEM mode, which is typically around 100GHz. The system allows users to explore ‘what if’ scenarios for rapid simulation of the impact of different materials and geometries. 1 ]+ D$ j0 X/ W+ W8 S, J3 r

: [4 c" e( Q' X- fBy interfacing with Polar Speedstack layer stack-up system, Si9000e also allows designers to accurately document complex stackups in minutes. - }! q6 j: A; G3 R, E/ `1 k
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The Si9000e can be used in pre-layout design, reference chipset stackup design and post-layout modeling of impedance and insertion loss by PCB fabricators
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2#
发表于 2011-8-21 22:52 | 只看该作者
顶顶顶顶顶顶
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  • TA的每日心情
    郁闷
    2025-4-28 15:02
  • 签到天数: 13 天

    [LV.3]偶尔看看II

    3#
    发表于 2011-8-22 10:46 | 只看该作者
    ding!!!

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    4#
    发表于 2011-9-6 16:46 | 只看该作者
    有11。04的下载吗5 e3 J: V' L+ @7 R3 _9 Q

    8 p3 {1 V* w% K% k$ @$ X刚看了下的确不错,好像还加了 via stub的计算
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    5#
     楼主| 发表于 2011-9-7 09:11 | 只看该作者
    szc1983 发表于 2011-9-6 16:46 6 |( a; `9 v' q0 s$ B8 J* z
    有11。04的下载吗( A7 _; K  T& J' G

    5 K: x: ~# f) w刚看了下的确不错,好像还加了 via stub的计算

    7 Q0 [1 n9 X9 K" O  g4 DVia stub,定性大于定量。

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    6#
    发表于 2011-11-24 02:03 | 只看该作者
    Thanks Thanks

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    7#
    发表于 2011-12-5 18:29 | 只看该作者
    哪里有下的?

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    8#
    发表于 2011-12-7 14:21 | 只看该作者
    不错,学习了

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    9#
    发表于 2013-1-4 14:37 | 只看该作者
    真想來用看看

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    10#
    发表于 2013-1-10 09:47 | 只看该作者
        那可以下载
  • TA的每日心情
    开心
    2023-11-30 15:49
  • 签到天数: 1 天

    [LV.1]初来乍到

    11#
    发表于 2013-2-12 20:18 | 只看该作者
    感觉不错啊。

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    12#
    发表于 2013-2-17 20:21 | 只看该作者
    不错

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    13#
    发表于 2013-7-18 19:04 | 只看该作者
    哪里下载!
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