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1 D9 s9 w7 X9 h+ j6 Q% C 1. 板：board
! i2 Z* H) s' j5 y8 B2 ?6 h 2. 印制板：printed board/ b6 e. L, d7 I5 y8 f% U" i" a
3. 印制电路：printed circuit" x7 A+ t; W5 S, Y0 o1 \
4. 印制线路：printed wiring! E# b" _; I! [0 k, l6 ]
5. 印制线路板：printed wiring board(PWB)
; O$ J+ N$ l+ \, h" e8 Q 6. 印制板电路：printed circuit board (PCB)' o3 l& @; Q& Q. @# n. O, {
7. 印制接点：printed contact; e* c+ e0 _1 f0 o# [
8. 印制组件：printed component7 o# j' W# H, X/ F. u
9. 印制板装配：printed board assembly" F# X3 u/ S% o; s9 C1 i9 {6 u& w3 z
10. 单面印制板：single-sided printed board(SSB)+ M* s/ I, _& O7 j2 x$ e
11. 双面印制板：double-sided printed board(DSB)& i, z% w' J( g2 B
12. 多层印制板：mulitlayer printed board(MLB)6 d! z# x) h, x. {$ `) u1 u
13. 多层印制电路板：mulitlayer printed circuit board. ~0 j1 |1 R- @; c# k
14. 多层印制线路板：mulitlayer prited wiring board3 h; h4 Z) n7 s% x! t+ f6 @
15. 刚性印制板：rigid printed board( Y1 O5 a+ z& E, {# H' i
16. 刚性单面印制板：rigid single-sided printed borad, T: D9 K* e$ ?5 V
17. 刚性双面印制印制板装配：printed board assembly9 P7 E8 H7 ~2 x% ]
18. 刚性多层印制板：rigid multilayer printed board
& W! i8 S7 A$ M- e' l4 E9 R 19. 挠性多层印制板：flexible multilayer printed board
1 R5 b) F: g5 w6 y 20. 挠性印制板：flexible printed board
0 I. K j9 o: V8 `. g6 x2 @ 21. 挠性单面印制板：flexible single-sided printed board; V+ U9 X; C4 \' S+ x
22. 挠性双面印制板：flexible double-sided printed board+ `/ u. p+ F/ P4 P& F0 d. q' _6 C
23. 挠性印制电路：flexible printed circuit (FPC)
# O- V) m! ~; G, I# ] 24. 挠性印制线路：flexible printed wiring2 X% e ^0 r3 V0 n. q6 a
25. 刚性印制板：flex-rigid printed board, rigid-flex printed board3 }; w6 Q8 r; i& n$ t5 V( ?8 Q" u
26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
4 e7 U1 y8 I l0 I9 X- L 27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board6 z& V s8 _& ?
28. 齐平印制板：flush printed board
* Z- L4 `: k: ^1 E 29. 金属芯印制板：metal core printed board
1 E- w' |8 R2 r 30. 金属基印制板：metal base printed board2 `" B3 i8 p3 i, J# j) @$ ?
31. 多重布线印制板：mulit-wiring printed board
) J1 t, ?+ Y3 S; d/ o. S 32. 陶瓷印制板：ceramic substrate printed board
/ A# @* Y1 s1 F0 d" V% X' | 33. 导电胶印制板：electroconductive paste printed board
& H) W4 ^' Q" A; K) w5 } 34. 模塑电路板：molded circuit board
* z$ S1 `: I+ z+ T5 A 35. 模压印制板：stamped printed wiring board6 X. `8 M) `- ?8 u
36. 顺序层压多层印制板：sequentially-laminated mulitlayer2 ?/ U. k! d: C/ [$ g( h$ s, c
37. 散线印制板：discrete wiring board4 D" @8 n* B% K& V% C
38. 微线印制板：micro wire board
# U7 E- m4 A# ]* H# O- ? 39. 积层印制板：buile-up printed board
1 A; E, K$ ^3 F3 b# v$ V; L 40. 积层多层印制板：build-up mulitlayer printed board (BUM)
- H* ^2 u9 H$ y( V' c: z* U) ~; x; y 41. 积层挠印制板：build-up flexible printed board
/ n( ~+ i) b6 m0 k" ~, w0 s 42. 表面层合电路板：suRFace laminar circuit (SLC); u& |! T: |9 @5 o
43. 埋入凸块连印制板：B2it printed board3 |2 D7 B! M% K5 H* B* \3 I" E
44. 多层膜基板：multi-layered film substrate(MFS)# v, _, C+ O' X h0 s
45. 层间全内导通多层印制板：ALIVH multilayer printed board1 C" c, D9 [/ N( h9 D: C. t
46. 载芯片板：chip on board (COB)4 ~' L. r5 F5 o5 }) a
47. 埋电阻板：buried resistance board
1 }1 H4 `9 |) r 48. 母板：mother board6 S* k6 I4 v5 I5 A0 K4 }% F
49. 子板：daughter board6 U( ~, N' h6 a6 S( {
50. 背板：backplane8 a6 r8 g5 T8 Y
51. 裸板：bare board; z- F5 ^$ Y# A& F4 S
52. 键盘板夹心板：copper-invar-copper board& ], X+ G% Q! A( m7 Q
53. 动态挠性板：dynamic flex board4 n$ P: d! m5 h
54. 静态挠性板：static flex board
9 m6 i% w* W, X" p ?: |& D 55. 可断拼板：break-away planel! I0 ^. l& {1 {" \" j
56. 电缆：cable
% D) y C6 p, ?' |5 c% I 57. 挠性扁平电缆：flexible flat cable (FFC)0 t2 K' _% F% e+ t& A, ~4 t# ~) i& q
58. 薄膜开关：membrane switch, C6 T7 ]6 d9 ^$ [" T2 |( M
59. 混合电路：hybrid circuit6 |) L# u. i( P" z" e* Q
60. 厚膜：thick film
, g# M' N" r4 a 61. 厚膜电路：thick film circuit9 k# E# l G( P- v# Q) [/ b' f
62. 薄膜：thin film5 J+ S) y; W# T/ P' ]* U* f- J6 ~
63. 薄膜混合电路：thin film hybrid circuit* Y. F9 P* d' `
64. 互连：interconnection
, \: w+ n( I) I1 Z% T: G) ] 65. 导线：conductor trace line
4 L3 I! ^( T: g 66. 齐平导线：flush conductor
+ U1 }. w; y$ q* Z, v( B 67. 传输线：transmission line5 {1 M3 C' K/ C! Q W7 R/ i
68. 跨交：crossover, x3 q' U5 c& l; h% m9 q
69. 板边插头：edge-board contact" C$ @6 O1 E0 V- D( z/ [: S2 J
70. 增强板：stiffener
! P* g* O5 f5 `: q7 r0 C" x( l7 f 71. 基底：substrate
& K8 |( [ n* K4 R& a) ?7 T 72. 基板面：real estate4 p {6 c% k+ @- L, K* |
73. 导线面：conductor side
( F) G. w) G+ F* r 74. 组件面：component side/ s3 A- i# b3 l% ^$ t$ D
75. 焊接面：solder side2 Z% B0 Y4 h) E% a
76. 印制：printing
$ }1 {' P( S& f% ^, [ 77. 网格：grid
: b. c, N5 C6 Z 78. 图形：pattern7 Q3 B- ]6 y7 G- B$ _& D0 i
79. 导电图形：conductive pattern/ ~! z0 _* C/ @9 b! u2 }/ p
80. 非导电图形：non-conductive pattern
/ X: t2 J: S5 A* @. T: @4 V) r! M 81. 字符：legend+ H$ q9 n, s" D8 b
82. 标志：mark |
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发表于 2021-7-7 10:12
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