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1. 板：board' f3 c* h7 q8 F; \
2. 印制板：printed board
/ y# g. V* w7 z 3. 印制电路：printed circuit$ L0 |& t/ ~2 q, q* e# u
4. 印制线路：printed wiring
; Z$ x9 G: d1 q8 f$ o; b9 [ 5. 印制线路板：printed wiring board(PWB). s' K0 n$ O8 ?0 {
6. 印制板电路：printed circuit board (PCB)
) X% M+ f* S) {2 q4 `! Q& i 7. 印制接点：printed contact
4 t6 p- s0 w* {; i* C 8. 印制组件：printed component7 t7 G1 Q3 d" b) k4 g
9. 印制板装配：printed board assembly
* \6 e7 k3 k9 d 10. 单面印制板：single-sided printed board(SSB); l: N" `# s) j- R6 d
11. 双面印制板：double-sided printed board(DSB)
: H; a" z2 z" R1 k 12. 多层印制板：mulitlayer printed board(MLB)
0 T( ]# Q0 j+ w9 |0 q1 i* Z 13. 多层印制电路板：mulitlayer printed circuit board6 H# P; i4 c( y$ `+ c0 S
14. 多层印制线路板：mulitlayer prited wiring board; c" ~& {: Y; Q5 l
15. 刚性印制板：rigid printed board4 h- r3 U$ {& E; u4 d
16. 刚性单面印制板：rigid single-sided printed borad
2 m& X8 G7 ]9 D! b" T4 f 17. 刚性双面印制印制板装配：printed board assembly( Z7 }; Z- z1 c. Q1 z4 v: F
18. 刚性多层印制板：rigid multilayer printed board
. u8 T4 h4 o; ^; S6 d, l 19. 挠性多层印制板：flexible multilayer printed board
. @1 E2 e) ]" a% ]2 f3 k9 E8 z' ?# q 20. 挠性印制板：flexible printed board( t' P' U6 ?- O& l( e q5 \
21. 挠性单面印制板：flexible single-sided printed board
+ h; n) I. ~& X0 e; \4 s5 x$ g 22. 挠性双面印制板：flexible double-sided printed board
( w3 r8 S6 g0 W5 w- G 23. 挠性印制电路：flexible printed circuit (FPC)4 B" f' V( u# u) ]8 \" @/ |) o
24. 挠性印制线路：flexible printed wiring8 C, l8 u) _1 E5 p) q8 @$ T
25. 刚性印制板：flex-rigid printed board, rigid-flex printed board1 @% P" h2 U; F) u& g. _: s
26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed" u1 ^- Q) ~2 x: H8 B+ h
27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board: {8 m1 G4 B3 Z+ g. Z) ^
28. 齐平印制板：flush printed board
+ b6 D6 ~3 x. s$ b4 u8 A' m' {, f 29. 金属芯印制板：metal core printed board
+ _7 a' B& j3 }6 q& ~! {& R r 30. 金属基印制板：metal base printed board
1 ^. J+ A, D' R2 X 31. 多重布线印制板：mulit-wiring printed board
' |, j- q8 s. {1 U 32. 陶瓷印制板：ceramic substrate printed board* K, @8 Y4 @" G
33. 导电胶印制板：electroconductive paste printed board
# X! y6 G5 `( l( Q4 F; L6 } 34. 模塑电路板：molded circuit board
# M; x3 `7 i* p" R! u# T 35. 模压印制板：stamped printed wiring board* i5 W9 N( e8 [: t2 {
36. 顺序层压多层印制板：sequentially-laminated mulitlayer: R% {( R) V4 L- Q
37. 散线印制板：discrete wiring board
1 Q' V2 }, j) s 38. 微线印制板：micro wire board' L2 W, `1 j+ h# K3 F' Y @ l
39. 积层印制板：buile-up printed board
% K& f6 F# o5 h: O' V) y. ~ 40. 积层多层印制板：build-up mulitlayer printed board (BUM)( F- K8 h- t4 u/ ?& s# p' R u5 q+ N' ^/ b
41. 积层挠印制板：build-up flexible printed board
: k3 G( ^ N: W9 J 42. 表面层合电路板：suRFace laminar circuit (SLC)0 h4 g, h9 [" s" P! J
43. 埋入凸块连印制板：B2it printed board x& q& f; S0 X
44. 多层膜基板：multi-layered film substrate(MFS)
; o' B3 ?/ h/ N3 u6 s' |5 r1 T" K2 m 45. 层间全内导通多层印制板：ALIVH multilayer printed board
4 @5 r9 g1 u8 f! ]$ G/ b* i 46. 载芯片板：chip on board (COB)& B$ B- ]% G" I. U. b7 k T1 U; B
47. 埋电阻板：buried resistance board
" A4 m. ]% M. C 48. 母板：mother board# L" z! X& g& w- @
49. 子板：daughter board, `4 }8 \" T$ C; }
50. 背板：backplane
% y/ ^* P) z+ u" c" ~8 q! t 51. 裸板：bare board
& g) R2 s: q8 u 52. 键盘板夹心板：copper-invar-copper board/ M3 P0 m, M0 p4 ?+ B5 R* F* x
53. 动态挠性板：dynamic flex board
8 _% O5 @8 c | 54. 静态挠性板：static flex board5 A( v. m7 c1 |2 B/ x, Y1 }9 g
55. 可断拼板：break-away planel9 ? D9 x( H8 D7 `9 D
56. 电缆：cable
9 j- _, d; j- f) P$ C 57. 挠性扁平电缆：flexible flat cable (FFC)
: G" `& Q; V5 P1 ~" P2 e% ` 58. 薄膜开关：membrane switch
( V2 a! N6 p. N! N; W2 ~/ V6 O' f 59. 混合电路：hybrid circuit
4 \+ W' m# r* I4 m |; F 60. 厚膜：thick film4 b5 K1 F2 j6 [
61. 厚膜电路：thick film circuit
) S z: T0 K& y) w& b+ f% F0 ~ 62. 薄膜：thin film5 r9 M4 U+ G* ^9 I: @
63. 薄膜混合电路：thin film hybrid circuit6 D5 F% r4 L% d( [* G
64. 互连：interconnection7 @- c' n3 K m7 G% G2 a* q3 \
65. 导线：conductor trace line
8 B" |) [5 f1 P) }+ { 66. 齐平导线：flush conductor6 R7 A+ K D" a' {
67. 传输线：transmission line) m* J$ p! L- u% K9 m+ X. ~- |
68. 跨交：crossover
- `6 F9 s9 J" M# r, g/ p 69. 板边插头：edge-board contact
! m' e* T. A" S% g/ h: } 70. 增强板：stiffener
% r0 B* l. @# Z' g4 N 71. 基底：substrate
; ~0 }0 t) O* W& H9 a, t& Z 72. 基板面：real estate- _3 E: m# l Y: l2 J7 K
73. 导线面：conductor side' E: u: Q" j- |# k' q
74. 组件面：component side T3 w' L1 o/ v8 d6 N' Y
75. 焊接面：solder side
3 N/ N7 m3 W; ^1 e* n8 f 76. 印制：printing
; x1 j$ l* N1 y1 P. U 77. 网格：grid* i8 z% W: ?7 ^( i& X
78. 图形：pattern( O+ l* y* D9 ~# ?6 R% I, C1 i
79. 导电图形：conductive pattern5 \$ A- l! Z8 h6 X, K) B' G4 N w
80. 非导电图形：non-conductive pattern- W7 v7 |+ U* n
81. 字符：legend
: l5 K4 v- {/ f7 r( U 82. 标志：mark |
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发表于 2021-7-7 10:12
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