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PCB设计中专业英译术语之基材：
- O9 G6 d" n3 w* E: Z0 V; w 1. 基材：base material( M: @1 T* c4 b: i- c8 r
2. 层压板：laminate
: y4 X& v4 [/ `8 D 3. 覆金属箔基材：metal-clad bade material
' @6 ^3 J! ~& w 4. 覆铜箔层压板：copper-clad laminate (CCL)
8 q: p/ t% n$ w. t% c* q) `: N0 C 5. 单面覆铜箔层压板：single-sided copper-clad laminate
3 B: i* y( J" |' \4 K, g2 L5 B 6. 双面覆铜箔层压板：double-sided copper-clad laminate
( X A8 G6 M$ H6 F7 Q. K 7. 复合层压板：composite laminate& [4 \6 I# B+ E
8. 薄层压板：thin laminate6 K' R/ j0 ~. O+ e; b$ i3 v
9. 金属芯覆铜箔层压板：metal core copper-clad laminate2 W+ X- c: g4 B V) }: I% U
10. 金属基覆铜层压板：metal base copper-clad laminate2 l4 a/ n i5 _/ j& w
11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
, T9 p, T' R' p! m7 I7 r 12. 基体材料：basis material- |8 D3 F: w Y! ^
13. 预浸材料：prepreg! ^: ~% P* H& B) C
14. 粘结片：bonding sheet
6 N7 |$ }8 [9 d+ X 15. 预浸粘结片：preimpregnated bonding sheer
) j" @9 v5 S, z% [2 l8 M 16. 环氧玻璃基板：epoxy glass substrate1 P( d! N c. F K
17. 加成法用层压板：laminate for additive process
9 c' |, A; Y" w# h: U 18. 预制内层覆箔板：mass lamination panel! r; O- E- ^0 r& L; e
19. 内层芯板：core material
- r0 r- N8 @& j2 A 20. 催化板材：catalyzed board ,coated catalyzed laminate! N" ~* f& t2 O7 X- C
21. 涂胶催化层压板：adhesive-coated catalyzed laminate+ S* x& R" f' Y1 ~
22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate
0 O, h2 V8 ^1 z6 v9 r0 f( w 23. 粘结层：bonding layer E. c" N" H2 ?2 O8 c& `) d
24. 粘结膜：film adhesive5 Q( B w& [. [. s9 r
25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film; ` A" c8 r5 W$ k/ a9 i
26. 无支撑胶粘剂膜：unsupported adhesive film
3 M# M {5 B! @3 d+ d4 y+ e 27. 覆盖层：cover layer (cover lay)+ B/ F* Y! q. ]6 J7 E
28. 增强板材：stiffener material; u8 O7 J/ u; S$ G( g! }4 F) O; A
29. 铜箔面：copper-clad suRFace
2 z4 \9 a9 z y/ w8 {% g9 m' _ 30. 去铜箔面：foil removal surface3 Z3 _. M3 K$ ~& v& m
31. 层压板面：unclad laminate surface6 E& x/ \4 Y! E3 p7 @' M7 B
32. 基膜面：base film surface. M" J! A/ c, w( E5 r/ a
33. 胶粘剂面：adhesive faec) L! _1 H- \( f5 b2 M9 x3 u" w2 ]
34. 原始光洁面：plate finish4 \1 s$ E/ ~5 q" n8 T: F6 i
35. 粗面：matt finish
+ [7 ~0 h9 W: t1 i* D 36. 纵向：length wise direction* g5 h+ ]; C- ]( K- m: u
37. 模向：cross wise direction
6 Z7 R2 x0 q: b* F( M b 38. 剪切板：cut to size panel
% C& m$ H) K, B7 z 39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL); C! x) M, f; ?# g# N
40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
/ ]+ k( G$ h5 @: d1 F- p 41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates" Y7 ?, Z/ Y) }/ \% P
42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
0 h# B5 A4 q/ J: p0 V 43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates ~7 G( g, Y; o1 d) M
44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates, B( M, p6 R. c! C8 \+ L
45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates* x6 P2 s. W7 V" d
46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates; C. T9 @2 q! m
47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates, r& s) r% T0 T( [4 R
48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
) e" N4 ]4 @$ v6 o, n0 m3 X 49. 超薄型层压板：ultra thin laminate2 U; ~0 P) u) K' P
50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates( a! X! z1 a5 [) h0 Z! c) O
51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates |
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发表于 2021-7-5 10:50
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