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PCB设计中专业英译术语之基材：5 \* x+ y& X8 Q: W* b# A, i
1. 基材：base material
( k8 V8 L! n. ?. z7 l% M 2. 层压板：laminate
, ?' Z5 w& \5 t: q' Z, f8 j( t 3. 覆金属箔基材：metal-clad bade material
# { {% t6 f3 q+ s4 \4 Q/ o# X* p 4. 覆铜箔层压板：copper-clad laminate (CCL)
_. ^# M5 J; m: C+ {- _+ _ 5. 单面覆铜箔层压板：single-sided copper-clad laminate
" j: [& J6 S8 U) V 6. 双面覆铜箔层压板：double-sided copper-clad laminate
, W4 Y9 K& k7 ~6 C; x2 E' b 7. 复合层压板：composite laminate
+ o' F4 H5 h6 B 8. 薄层压板：thin laminate/ b# Y* V) O& c
9. 金属芯覆铜箔层压板：metal core copper-clad laminate! \1 L$ D/ I" z( i8 t
10. 金属基覆铜层压板：metal base copper-clad laminate' S+ x$ n$ e* ^7 C6 f
11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
& O$ H e+ r: w+ H9 o/ l2 |- T 12. 基体材料：basis material
: m8 z. a0 T" O/ i2 B. l( ~ 13. 预浸材料：prepreg
. ~) |' z! n4 p: Z/ ]3 ~ 14. 粘结片：bonding sheet
+ _- d5 W* W; ^ 15. 预浸粘结片：preimpregnated bonding sheer
7 I, C/ Q8 s/ Q7 i. I+ K: x; I 16. 环氧玻璃基板：epoxy glass substrate
: T4 E# v5 F& w 17. 加成法用层压板：laminate for additive process
2 Z2 w" L3 O3 ~1 ?5 @2 v 18. 预制内层覆箔板：mass lamination panel3 v' P' s- i/ r) ]
19. 内层芯板：core material- r3 V* C3 W" z) K
20. 催化板材：catalyzed board ,coated catalyzed laminate) Z! k, E* a$ g
21. 涂胶催化层压板：adhesive-coated catalyzed laminate0 _0 K. K8 n/ d8 E9 y; P$ i
22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate+ n, i- {/ M1 ], ^
23. 粘结层：bonding layer- y& P2 D3 }# B* v2 @* H% k2 E/ c
24. 粘结膜：film adhesive
( [0 d/ j; X; ]/ K! t" s 25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film) L6 ?( c6 }9 ~8 c( i7 [( l
26. 无支撑胶粘剂膜：unsupported adhesive film# w1 u: N9 W- D2 f% q. V% Q
27. 覆盖层：cover layer (cover lay)7 M/ T" }. E3 @9 j3 a* Y$ W
28. 增强板材：stiffener material! C8 c, W! v: o8 ~* i
29. 铜箔面：copper-clad suRFace5 i# E: T6 w. b0 \% Y
30. 去铜箔面：foil removal surface! x' E9 c4 c; G6 S
31. 层压板面：unclad laminate surface* F7 H: b; S. z# u7 u
32. 基膜面：base film surface
) z( ]. a& s, H7 m* L 33. 胶粘剂面：adhesive faec4 H' x6 l# m; W+ V) ~
34. 原始光洁面：plate finish. c& \" z4 u6 D' m0 I# N$ }
35. 粗面：matt finish
, ^7 S( @& e5 |6 O9 ~ 36. 纵向：length wise direction% H! t8 |+ p+ O
37. 模向：cross wise direction* b# s. I: ]+ ^+ T
38. 剪切板：cut to size panel
3 T7 h/ U) l a- f5 R 39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
$ ?* j7 q: p9 B; t 40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)5 e- R; e- I) t5 C q
41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates! M8 ~' G* P S8 e
42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates9 L# ?! C, ]- e; r4 Q" d' L8 P5 P3 D
43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
2 ~3 ~' p9 N9 P& Q9 w& C 44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates# E( b% q! v$ @" R; e
45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
6 U2 q. w C T, Z" ]) Q N 46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
3 }5 b8 ]" }# H. c 47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates8 @! w( i* H1 f3 m; b, V/ M2 C
48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
6 e( k% n4 K! u1 l 49. 超薄型层压板：ultra thin laminate' e. }0 @% v- ]" f* m5 ?6 f
50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates" }7 I* B' u8 Z5 {4 J: r1 A. U* W
51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates |
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发表于 2021-7-5 10:50
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