PCB术语英文对照表

ulppknot · 发表于 2020-3-31 10:00

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PCB专业英译术语

一、综合词汇
1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board: N/ p, V) ~7 P7 s& I
4、印制板电路：printed circuit board (PCB)( ?! I' y9 o' U3 }
5、印制线路板：printed wiring board(PWB)
6、印制组件：printed component
7、印制接点：printed contact0 o) B) G# {! e
8、印制板装配：printed board assembly1 Z9 V- F& ]& f/ V' Y
9、板：board
10、单面印制板：single-sided printed board(SSB)
11、双面印制板：double-sided printed board(DSB)
12、多层印制板：mulitlayer printed board(MLB)# n. t2 V) e, g: H- U8 g
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board% s" p/ t; B3 r* H0 q; A
15、刚性印制板：rigid printed board4 |- F+ g  ^/ m, M8 C
16、刚性单面印制板：rigid single-sided printed borad
17、刚性双面印制板：rigid double-sided printed borad
18、刚性多层印制板：rigid multilayer printed board
19、挠性多层印制板：flexible multilayer printed board
20、挠性印制板：flexible printed board
21、挠性单面印制板：flexible single-sided printed board
22、挠性双面印制板：flexible double-sided printed board% F* N! r  ]& T5 M
23、挠性印制电路：flexible printed circuit (FPC)
24、挠性印制线路：flexible printed wiring
25、刚性印制板：flex-rigid printed board, rigid-flex printed board7 S' V3 w1 |% @
26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
28、齐平印制板：flush printed board, i7 r5 `& Z7 V1 f  n9 h8 ^% O
29、金属芯印制板：metal core printed board) [9 ^1 E4 Q7 d
30、金属基印制板：metal base printed board
31、多重布线印制板：mulit-wiring printed board0 c: Q- V1 F, J: c6 C9 a
32、陶瓷印制板：ceramic substrate printed board
33、导电胶印制板：electroconductive paste printed board4 |# D: N: g/ V1 s
34、模塑电路板：molded circuit board% `) B0 a& g* _8 n/ n9 J& x
35、模压印制板：stamped printed wiring board
36、顺序层压多层印制板：sequentially-laminated mulitlayer
37、散线印制板：discrete wiring board& \/ R# D/ K) E6 w. H1 s
38、微线印制板：micro wire board
39、积层印制板：buile-up printed board  `- |, S$ V, b5 v* o8 Z3 u
40、积层多层印制板：build-up mulitlayer printed board (BUM)9 {4 B, Q8 j* a; _& k4 e: D  M, F
41、积层挠印制板：build-up flexible printed board, j  d" R$ H0 R  i, W; r% K
42、表面层合电路板：suRFace laminar circuit (SLC)" x- S8 |" S1 ]! }$ P
43、埋入凸块连印制板：B2it printed board
44、多层膜基板：multi-layered film substrate(MFS)
45、层间全内导通多层印制板：ALIVH multilayer printed board
46、载芯片板：chip on board (COB)
47、埋电阻板：buried resistance board; y" T& _. d9 Y  y" n
48、母板：mother board
49、子板：daughter board8 m2 I* U3 z6 V* i- n
50、背板：backplane- N# s6 T4 W2 W# b0 \
51、裸板：bare board% t  l- K/ E1 Y
52、键盘板夹心板：copper-invar-copper board2 X  W: T/ q) J9 c
53、动态挠性板：dynamic flex board, C+ X$ h+ j7 {! ]3 i4 S
54、静态挠性板：static flex board
55、可断拼板：break-away planel# d0 ]% e5 v1 l+ k- Z- R- m3 t8 @  @8 _
56、电缆：cable+ r* B+ U( ^  U# g4 J
57、挠性扁平电缆：flexible flat cable (FFC)9 G; D0 l6 t/ o/ T5 q9 c, ~
58、薄膜开关：membrane switch
59、混合电路：hybrid circuit
60、厚膜：thick film
61、厚膜电路：thick film circuit
62、薄膜：thin film" V  f* x+ p; P' [# c. q% _9 E' _
63、薄膜混合电路：thin film hybrid circuit0 M8 a% d+ P# q+ q4 C( ~
64、互连：interconnection, @$ ^" G. W" p( u
65、导线：conductor trace line) Z6 C: G7 S: C7 N
66、齐平导线：flush conductor
67、传输线：transmission line8 F/ |5 M& g* ^1 U4 ]% M! J
68、跨交：crossover  {% b6 J; h2 V  c& ~8 S, T; b
69、板边插头：edge-board contact4 Q1 p) ~# i6 p9 D& [: @  ?+ y$ Y
70、增强板：stiffener
71、基底：substrate
72、基板面：real estate) O( t5 g& b# I, ]( m$ i
73、导线面：conductor side
74、组件面：component side
75、焊接面：solder side
76、印制：printing
77、网格：grid! N. w# b, W' Y1 O# Z
78、图形：pattern
79、导电图形：conductive pattern$ z- L5 x3 n% I( k# ~/ S
80、非导电图形：non-conductive pattern
81、字符：legend
82、标志：mark* l" @8 p5 T1 B% q( @* c: g
6 D8 D* h$ |: }+ Q3 b
二、基材：
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material( D, Q: B/ r9 ^8 X0 H! {
4、覆铜箔层压板：copper-clad laminate (CCL)
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate, _% x( E" `( t; k$ F6 J
7、复合层压板：composite laminate( K! v' A/ j1 Q5 ]6 P7 o5 u
8、薄层压板：thin laminate8 ]( d- F9 W1 R& C; G5 s
9、金属芯覆铜箔层压板：metal core copper-clad laminate7 l1 J& g) x, Q+ q$ Z
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer8 D- n8 P+ n* o! }( ]8 Z! t
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel- y9 \& B$ S1 D: R
19、内层芯板：core material/ q# x' L6 E, N
20、催化板材：catalyzed board ,coated catalyzed laminate
21、涂胶催化层压板：adhesive-coated catalyzed laminate
22、涂胶无催层压板：adhesive-coated uncatalyzed laminate7 w; v4 h/ l0 d7 m) d: D7 r! u
23、粘结层：bonding layer3 I2 P" B. f8 b7 N" P
24、粘结膜：film adhesive
25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film1 R4 T! x% z3 ^: X$ C
26、无支撑胶粘剂膜：unsupported adhesive film
27、覆盖层：cover layer (cover lay)
28、增强板材：stiffener material% u  }2 _( e+ W- Z
29、铜箔面：copper-clad surface
30、去铜箔面：foil removal surface5 i/ I, |. }. @: Z( m) A9 [
31、层压板面：unclad laminate surface1 t; w; d% y' i' Z2 U5 T% \* q0 `
32、基膜面：base film surface
33、胶粘剂面：adhesive faec
34、原始光洁面：plate finish
35、粗面：matt finish% Z$ [& e. c, H$ J
36、纵向：length wise direction7 s; J9 T# T" L( w, }* g2 L- N, \+ h( _
37、模向：cross wise direction
38、剪切板：cut to size panel
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates5 i! ~; `& h# C3 ^- _
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

, V, j* M. o/ b5 U$ s: z
三、基材的材料
1、 A阶树脂：A-stage resin
2、 B阶树脂：B-stage resin  _1 k' f# R4 H: {- i
3、 C阶树脂：C-stage resin, ^5 i5 k0 _! F. T/ |' H$ j
4、环氧树脂：epoxy resin1 d% T, x0 ~6 y' S
5、酚醛树脂：phenolic resin; ]9 A8 A: ~+ j9 y8 G) e* q
6、聚酯树脂：polyester resin
7、聚酰亚胺树脂：polyimide resin
8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin/ F" X4 \. r# o
9、丙烯酸树脂：acrylic resin9 I4 g; E, u7 u
10、三聚氰胺甲醛树脂：melamine formaldehyde resin3 e' [9 g3 X; W8 y, G! _9 z
11、多官能环氧树脂：polyfunctional epoxy resin
12、溴化环氧树脂：brominated epoxy resin! _8 j( W& S1 a2 o
13、环氧酚醛：epoxy novolac% h4 J9 u2 W; `/ V
14、氟树脂：fluroresin: [4 N5 ~  ~9 m" i3 `3 p1 q6 L
15、硅树脂：silicone resin# }( D- m# |9 X  e3 U* @1 w
16、硅烷：silane4 j/ g: P: a3 ~9 I5 \% w
17、聚合物：polymer
18、无定形聚合物：amorphous polymer
19、结晶现象：crystalline polamer5 s4 e% k+ J9 M, @, {
20、双晶现象：dimorphism3 d7 M; D) }$ i& }) h. z' E1 B
21、共聚物：copolymer! F% d6 k9 F- p: y$ o! G5 o
22、合成树脂：synthetic
23、热固性树脂：thermosetting resin
24、热塑性树脂：thermoplastic resin9 L# I5 F( u4 \$ u* D
25、感旋光性树脂：photosensitive resin3 Q- e' o1 G" @2 ~6 @
26、环氧当量：weight per epoxy equivalent (WPE)  g  {- m& S$ S1 T2 x1 @3 }1 \0 t
27、环氧值：epoxy value
28、双氰胺：dicyandiamide: c: z3 i0 M, ?1 V* F
29、粘结剂：binder% A& W5 b) i- j
30、胶粘剂：adesive- k& Y# g7 W% {' F* B
31、固化剂：curing agent
32、阻燃剂：flame retardant6 n, e8 U  {) Q" B% }7 u# H
33、遮光剂：opaquer& |9 F$ _  T  p
34、增塑剂：plasticizers5 t) S" G& i) A" K
35、不饱和聚酯：unsatuiated polyester" o) w$ D( W% g7 F6 C
36、聚酯薄膜：polyester/ u- i1 ^5 }0 P, b  |: I9 _0 p
37、聚酰亚胺薄膜：polyimide film (PI)6 |! H( H2 V" k
38、聚四氟乙烯：polytetrafluoetylene (PTFE)
39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)# Y$ V5 [# w8 K5 i
40、增强材料：reinforcing material
41、玻璃纤维：glass fiber$ N: G5 d8 p1 ~, N0 y( z  m
42、 E玻璃纤维：E-glass fibre
43、 D玻璃纤维：D-glass fibre* Y0 k$ @0 ~: N; T* Z9 o
44、 S玻璃纤维：S-glass fibre# g% E2 d6 Q" G8 u  e. D
45、玻璃布：glass fabric
46、非织布：non-woven fabric8 }: J/ i3 V: B6 r' O
47、玻璃纤维垫：glass mats
48、纱线：yarn7 {6 J" E! Q( B/ f/ g
49、单丝：filament% p7 o& l/ M  ]9 h: Y$ K# I
50、绞股：strand4 a, U0 [( N$ l' B& G
51、纬纱：weft yarn) f# F2 J; X2 H+ g+ n( k
52、经纱：warp yarn
53、但尼尔：denier
54、经向：warp-wise$ z; R. }, L: m# O* q% q2 l8 x
55、纬向：weft-wise, filling-wise
56、织物经纬密度：thread count% T* K% A1 B7 @4 X2 L3 Z3 o
57、织物组织：weave structure
58、平纹组织：plain structure7 U: T0 ~- F2 K
59、坏布：grey fabric
60、稀松织物：woven scrim3 Z6 R) g! y' X* b0 `0 v& W1 {  i& `
61、弓纬：bow of weave' ]$ ]' ?+ e' }5 i) I
62、断经：end missing
63、缺纬：mis-picks
64、纬斜：bias
65、折痕：crease
66、云织：waviness
67、鱼眼：fish eye' @/ N8 X  ?' w3 H: u: C  h: a
68、毛圈长：feather length
69、厚薄段：mark
70、裂缝：split2 z1 J' p  p3 M/ R
71、捻度：twist of yarn( P5 B" D. f1 V7 _
72、浸润剂含量：size content* u4 o" A% w. s) s# [- l
73、浸润剂残留量：size residue+ B6 p: Y6 u' C) I0 r9 H
74、处理剂含量：finish level
75、浸润剂：size
76、偶联剂：couplint agent3 i7 e0 Q; V* K+ B6 p: d
77、处理织物：finished fabric
78、聚酰胺纤维：polyARMide fiber
79、聚酯纤维非织布：non-woven polyester fabric6 t3 |" w$ S" z, M* n6 y5 [5 `' p
80、浸渍绝缘纵纸：impregnating insulation paper; b; C, n2 N7 `2 J
81、聚芳酰胺纤维纸：aromatic polyamide paper
82、断裂长：breaking length' w0 T" Y9 L( ^! i) j% M4 A
83、吸水高度：height of capillary rise$ H: Z; ~4 }4 A: Z5 @( V4 \+ Y+ h! N
84、湿强度保留率：wet strength retention4 F/ H9 r6 U7 m
85、白度：whitenness
86、陶瓷：ceramics
87、导电箔：conductive foil
88、铜箔：copper foil
89、电解铜箔：electrodeposited copper foil (ED copper foil)3 b4 i- L6 ^: a, u
90、压延铜箔：rolled copper foil3 V) }1 t- W, u# W2 A& S) z
91、退火铜箔：annealed copper foil8 v# F; V  o: j) H0 _5 C; H- K
92、压延退火铜箔：rolled annealed copper foil (RA copper foil)7 _7 j7 C/ c/ w! `
93、薄铜箔：thin copper foil
94、涂胶铜箔：adhesive coated foil
95、涂胶脂铜箔：resin coated copper foil (RCC)! h; x# }/ x- V5 e8 }! ^" J" X
96、复合金属箔：composite metallic material
97、载体箔：carrier foil  H% j- Z" M- q& L& H( R
98、殷瓦：invar
99、箔（剖面）轮廓：foil profile4 f" F9 x6 k7 z. |. R
100、光面：shiny side7 N9 ^' k& L, \9 X
101、粗糙面：matte side
102、处理面：treated side
103、防锈处理：stain proofing
104、双面处理铜箔：double treated foil

四、设计
1、原理图：shematic diagram
2、逻辑图：logic diagram
3、印制线路布设：printed wire layout
4、布设总图：master drawing5 w: r4 A' Y) i
5、可制造性设计：design-for-manufacturability
6、计算机辅助设计：computer-aided design.(CAD)
7、计算机辅助制造：computer-aided manufacturing.(CAM)
8、计算机集成制造：computer integrat manufacturing.(CIM)
9、计算机辅助工程：computer-aided engineering.(CAE)5 N/ {4 Q( b/ v) |, S
10、计算机辅助测试：computer-aided test.(CAT)
11、电子设计自动化：electric design automation .(EDA)% O  n8 g1 D: j; h3 a* N& G
12、工程设计自动化：engineering design automaton .(EDA2)
13、组装设计自动化：assembly aided architectural design. (AAAD)
14、计算机辅助制图：computer aided drawing
15、计算机控制显示：computer controlled display .(CCD)
16、布局：placement& f9 n- C# [& X+ e4 s- A2 L
17、布线：routing2 K4 M3 s" t* H# _$ b: L
18、布图设计：layout
19、重布：rerouting
20、模拟：simulation$ \% d% q: |' d
21、逻辑模拟：logic simulation
22、电路模拟：circit simulation% R& r4 M3 f" C/ X6 r, [
23、时序模拟：timing simulation
24、模块化：modularization6 N7 h1 A" v! a3 b7 d
25、布线完成率：layout effeciency
26、机器描述格式：machine descriptionm format .(MDF)
27、机器描述格式数据库：MDF databse# q0 B3 d* R$ ?
28、设计数据库：design database
29、设计原点：design origin
30、优化（设计）：optimization (design)$ w% U( z! _9 m0 k) v; s
31、供设计优化坐标轴：predominant axis$ G5 j$ n5 T' J3 f5 F% G1 _+ ~
32、表格原点：table origin
33、镜像：mirroring4 J; L% C  H3 U' p& o
34、驱动文件：drive file
35、中间文件：intermediate file
36、制造文件：manufacturing documentation( C4 C# ^& i& |6 X
37、队列支撑数据库：queue support database7 D+ s# u- F* j# z
38、组件安置：component positioning
39、图形显示：graphics dispaly
40、比例因子：scaling factor& F& J# E& r  |9 [
41、扫描填充：scan filling
42、矩形填充：rectangle filling, @0 u' n1 b) q% f$ r+ T1 X
43、填充域：region filling! D0 t6 p* B) [) \- \
44、实体设计：physical design! K* F5 K' c* C% M
45、逻辑设计：logic design  h6 N( r3 w& W* W9 J( S  r
46、逻辑电路：logic circuit
47、层次设计：hierarchical design
48、自顶向下设计：top-down design' C0 G* B/ i: E4 _
49、自底向上设计：bottom-up design
50、线网：net' \3 c6 U. \. m5 r2 N( B9 S
51、数字化：digitzing
52、设计规则检查：design rule checking
53、走（布）线器：router (CAD)( B2 T3 Q4 ]% c! V  O( y
54、网络表：net list9 s# a% ]7 x, Z8 H, s
55、计算机辅助电路分析：computer-aided circuit analysis1 A! a7 l4 m4 Y5 h/ G6 N. _
56、子线网：subnet$ n+ `( T0 |8 j: W) a
57、目标函数：objective function+ e0 _  h" n& I0 h7 L9 }
58、设计后处理：post design processing (PDP)
59、交互式制图设计：interactive drawing design
60、费用矩阵：cost metrix5 {6 m: o- b# o: i, T
61、工程图：engineering drawing
62、方块框图：block diagram
63、迷宫：moze
64、组件密度：component density
65、巡回售货员问题：traveling salesman problem
66、自由度：degrees freedom
67、入度：out going degree
68、出度：incoming degree) E' L" o- d) V. b
69、曼哈顿距离：manhatton distance
70、欧几里德距离：euclidean distance
71、网络：network
72、阵列：array
73、段：segment& \) A: u( @3 g  k
74、逻辑：logic
75、逻辑设计自动化：logic design automation5 j9 q0 C3 i) \6 S
76、分线：separated time, _4 T  }3 S2 I9 p! V2 k! D
77、分层：separated layer
78、定顺序：definite sequenc$ @8 f! J- _9 q; B
' g% E. Q. A0 K' ]4 ?
五、形状与尺寸：
1、导线（信道）：conduction (track); F/ `" u/ w" q3 v+ Y  ]
2、导线（体）宽度：conductor width7 }( {5 `1 r6 [' L
3、导线距离：conductor spacing
4、导线层：conductor layer; ]' U7 M; y* l7 E
5、导线宽度/间距：conductor line/space+ m; |1 g" F& _7 e! s; B/ Q( T
6、第一导线层：conductor layer No.17 B. L0 Z8 [: Z8 k, d6 N
7、圆形盘：round pad
8、方形盘：square pad! q0 p- Z5 s) b7 x/ M2 e6 |- k
9、菱形盘：diamond pad# w6 }) r/ F! e& Z% v
10、长方形焊盘：oblong pad
11、子弹形盘：bullet pad
12、泪滴盘：teardrop pad3 x  F. w' q8 T2 p. ^; U
13、雪人盘：snowman pad
14、 V形盘：V-shaped pad) n3 g( q( t4 e- M2 F2 m5 H
15、环形盘：annular pad+ S4 k4 f8 Q. e+ X
16、非圆形盘：non-circular pad& N( B3 r' P9 }9 Y: B) f) b
17、隔离盘：isolation pad
18、非功能连接盘：monfunctional pad0 Y/ _, h' z; _! O* `& d0 n, Q6 N
19、偏置连接盘：offset land
20、腹（背）裸盘：back-bard land
21、盘址：anchoring spaur
22、连接盘图形：land pattern# H! T/ G3 a5 c: P% {* A$ o6 g
23、连接盘网格阵列：land grid array$ b8 }+ @; A0 C& {8 O2 w6 g' a/ `
24、孔环：annular ring; A6 ?; }: f5 E  ?
25、组件孔：component hole% _# u+ t' W$ X9 [3 }
26、安装孔：mounting hole$ M3 l2 }$ ?4 q
27、支撑孔：supported hole
28、非支撑孔：unsupported hole* p  L: p" E) }2 Q& a' Q! g2 e
29、导通孔：via
30、镀通孔：plated through hole (PTH)
31、余隙孔：access hole9 a8 ~/ A3 V$ O3 n8 V: O
32、盲孔：blind via (hole)" S- W" ?4 T2 J4 Z
33、埋孔：buried via hole5 x0 [5 p# b6 x: a
34、埋/盲孔：buried /blind via" L  ^  r  j! f- x4 Q. Q
35、任意层内部导通孔：any layer inner via hole (ALIVH)
36、全部钻孔：all drilled hole
37、定位孔：toaling hole3 {+ j0 C) H8 _
38、无连接盘孔：landless hole2 ?4 v$ e: B0 c" ^% ]- w  X: i, l
39、中间孔：interstitial hole
40、无连接盘导通孔：landless via hole0 C5 h: T' G5 P6 z  i  O
41、引导孔：pilot hole) t2 G# G, U# x& m( O& k5 s
42、端接全隙孔：terminal clearomee hole8 S$ K2 ?/ O& j2 m
43、准表面间镀覆孔：quasi-interfacing plated-through hole: k; V6 r3 n% g- p. o% u# [  y
44、准尺寸孔：dimensioned hole
45、在连接盘中导通孔：via-in-pad
46、孔位：hole location/ Q$ R; Z, n0 E% N& o! b% c
47、孔密度：hole density
48、孔图：hole pattern
49、钻孔图：drill drawing
50、装配图：assembly drawing8 g$ |) s+ ]+ T
51、印制板组装图：printed board assembly drawing
52、参考基准：datum referan
8 n* ~% k0 P8 x  ~/ f0 z. m1 d

六、流程
( j/ n- U" h8 m( c5 j9 N
: b+ {; T4 [, I" D
1.开料：CutLamination/Material cutting
2.钻孔：Drilling
3.内钻：Inner LayerDrilling
4一次孔:Outer Layer Drilling
5.二次孔:2nd Drilling / y- P2 `& P! }2 H
6.雷射钻孔

aser Drilling /Laser Ablation * O, f0 h5 K7 k; ~9 j k6 G! t% b9 h2 O
7.盲(埋)孔钻孔:Blind & Buried Hole Drilling
8.干膜制程：PhotoProcess(D/F)/Dry Film& H& C3 v/ K6 I" A& }1 J
9.前处理 (Pretreatment)7 m( g, Q; I" ~6 Y9 v9 x
10.压膜

ry Film Lamination
11.曝光:Exposure
12.显影

eveloping ( H4 S9 Q4 C1 a9 D! \
13.去膜:Stripping 0 y$ |) a5 W! L- U
14.压合：Lamination
15:黑化:Black OxideTreatment + }; W6 j$ p3 H- p& K' q
16.微蚀:Microetching
17.铆钉组合:eyelet ( q+ z8 D+ A4 `* n& E5 q. m4 y) i
18.迭板

ay up 9 H( T2 D5 X7 N( W: i
19.压合

amination
20.后处理

ost Treatment    / q! V) Q* N1 c9 B5 y0 L7 d4 w) y
21.黑氧化:Black Oxide Removal
22.铣靶:spot face
23.去溢胶:resin flush removal$ p5 a  M& @" l( ]) m
24.减铜：Copper Reduction/ I: h; a2 X' O: u4 T
25.水平电镀：HorizontalElectrolytic Plating
26.电镀：Panel plating
27.锡铅电镀:Tin-Lead Plating /Pattern Plating ( a% A) z6 V2 u  N4 o
28.低于 1 mil: Less than 1 mil Thickness
29.高于 1 mil:More than 1 mil Thickness
30.砂带研磨:Belt Sanding  ; P% n" ?7 ]) e& z
31:剥锡铅:Tin-Lead Stripping
32.微切片: Microsection
33.蚀铜:Etching
34.初检:Touch-up. L* l( c  `. N  @4 \
35.塞孔：Plug Hole6 h5 r& J6 v% R- }6 ]/ B
36.防焊(绿漆/绿油)：SolderMask- c) t4 }3 u5 H/ B5 }% Q5 F# q
37.C面印刷

rinting Top Side
38.S面印刷

rinting Bottom Side ' A  |1 Q& A: x! ^
39.静电喷涂:Spray Coating
40.前处理:Pretreatment  # U3 Q$ ]$ l3 A( h4 U7 y8 B6 f2 e+ N
41.预烤:Precure; c# h9 h" ^+ o3 M) x' u
42.后烘烤:Postcure
43.印刷:Ink Print) P6 ]  V% S# M" t1 h2 c
44.表面刷磨:Scrub
45.后烘烤:Postcure
46.UV烘烤:UV Cure  8 L; d, U. a% C
47.文字印刷:Printing of Legend
48.喷砂:Pumice/Wet Blasting
49.印可剥离防焊/蓝胶:Peelable Solder Mask)7 x! w: R! Y* H2 @( |
50.化学前处理,化学研磨：Chemical Milling 2 j0 i0 }9 I' S. d# L
51.选择性浸金压膜：Selective Gold Dry Film Lamination( M6 V$ ^# X) y" q( G5 i; H
52.镀金：Gold plating8 N  I# I4 n, Y) {$ m; R
53.喷锡：Hot Air SolderLeveling) l- F. V* g3 D3 i9 c
54.成型：Profile/Form
55.开短路测试：Electrical Testing
56.终检：Final VisualInspection( \2 W+ y5 l  u
57.金手指镀镍金：Gold Finger . @. b4 W; r4 m  Y" J. d7 q2 k( ?
58.电镀软金：Soft Ni/Au Plating8 r+ g' B# S' P( ?6 Y
59.浸镍金：Immersion Ni/Au / Electroless Ni/Au. o) P$ w' }8 v
60.喷锡:Hot Air Solder Leveling
61.水平喷锡:HorizontalHot Air Solder Leveling ( P$ U( ^& ^+ z9 z
62.垂直喷锡: Vertical Hot Air Solder Leveling
63.超级焊锡:Super Solder. b6 O( Z: _1 l  J7 Y
64.印焊锡突点:Solder Bump, ^0 ?, a9 ~  Q( a0 m! q
65.数控铣/锣板：N/C Routing/Milling; Q0 L* h" a, `9 N
66.模具冲/啤板：Punch
67.板面清洗烘烤：Cleaning & Backing
68.V型槽/V-CUT： V-Cut/V-Scoring
69.金手指斜边：Beveling of G/F
70.短断路测试Electrical Testing/Continuity & Insulation Testing
71.AOI 光学检查：AOI Inspection/ K2 m+ z- U! W* n4 E
72：VRS 目检：Verified & Repaired
73.泛用型治具测试：Universal Tester
74.专用治具测试：Dedicated Tester3 d' {7 g( |' a) G  }
75.飞针测试：Flying Probe; w! ]2 ^. K) l) F3 o
76.终检：Final Visual Inspection ' O( c' B2 ?5 M6 b1 J5 R6 r
77.压板翘：Warpage Remove
78.X-OUT 印刷：X-Out Marking
79.包装及出货：Packing& shipping) c; ~+ l* `' S1 q
80.清洗及烘烤： Final Clean & Baking 1 B# r# V2 ]" R/ o, m. c9 I5 z! z% J
81.铜面保护剂：ENTEK Cu-106A/OSP) \& v1 m; h- Y' K1 r
82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test
83.冷热冲击试验:Thermal cycling Testing
84.焊锡性试验:Solderability Testing 8 z, Q' q6 y" M# I) u
85.雷射钻孔:Laser Ablation 5 M* z. a1 {: `6 t0 j3 c3 g
86.雷射钻Tooling孔:Laser ablationTooling Hole3 y/ L2 X) A8 I  c' h
87.雷射曝光对位孔:Laser Ablation Registration Hole
88.雷射Mask制作:Laser Mask
89.雷射钻孔:Laser Ablation) U& ^3 c. r  n4 Q
90.AOI检查及VRS:AOI Inspection & Verified & Repaired  4 h& r# \1 \* d; C4 y6 t6 a% b& b
91.除胶渣

esmear
92.专用治具测试:Dedicated Tester" A3 U7 s6 M9 E; a
93.飞针测试:Flying Probe2 ~  z0 r% Y5 v+ o; F
94.压板翘: Warpage Remove  7 x, \# t% l* X; q0 _
95.底片：Ablation
96.烧溶：laser)
97.切/磨：abrade                            : M9 s* z- D- r1 _/ l
98.粗化：abrasion  ' ^4 O. G; R8 x* e( Y# F
99.耐磨性：absorption resistance
100.允收:ACC /accept       ' A8 X! w# S' _  g* D2 w. b
101.加速腐蚀:accelerated corrosion test
102加速试验:accelerated test
103.速化反应:acceleration                            4 @1 P7 P" R# B
104.加速剂:accelerator                $ |0 O' Q6 ^. a/ Q" L/ w) M
105.允许：acceptable
106.活化液：activator
107.实际在制品：active work in process
108.附着力：adhesion
109.黏着法：adhesive method       ( P6 W( p2 Z0 g6 m/ A
110.气泡:air inclusion
111.风刀：air knife
112.不定形的改变：amorphous change
113.总量：amount
114.硝基戊烷：amylnitrite
115.分析仪：analyzer ( T5 p0 R4 v8 M  \/ G% ^& f  }( s
116环状垫圈;孔环annular ring
117.阳极泥：anodeslime (sludge)       8 o. x+ F: h" I! l
118.阳极清洗：anodizing & x: b. P* D; B: j) g
119.自动光学检测：AOI/automatic optical inspection
120.引用之文件：applicable documents
121.允收水平抽样：AQL sampling
122.液态光阻：aqueous photoresist
123.纵横比(厚宽比)：aspect ratioAs received
124.背光：back lighting    / D+ b; m* |3 P% C5 s2 h+ @
125.垫板：back-up
126.预留在制品：banked work in process       2 o/ b, e1 k" @. N$ H$ I
127.基材：base material
128.基准绩效：baseline performance
129.批：batch
130.贝他射线照射法：beta backscattering 1 y1 \" T' A( l: ]7 P2 ]
131.切斜边;斜边：beveling
132.二方向之变形:biaxial deformation
133.黑化：black-oxide                            ' S% G! I% t$ S# Z" B1 O. t2 s
134.空板：blank panel  4 S/ `! t' Y! Z9 s* g3 v
135.挖空:blanking
136.弹开:blip    2 `" V4 E% a$ ?& x- E! V( E8 q
137.气泡:blister blistering                         ! W& [$ V* S# Y9 F
138.吹孔:blow hole   u. I- l7 ^  V2 r9 B& k
139.板厚错误:board-thickness error 1 l9 e- J% C0 I; |, s
140.黏结层:bonding plies       ; ]1 ?$ l- k$ Y# s/ J) |
141.板弯:bow ; bowing
142.破空:break out
143.搭桥;桥接：bridging    / N  T$ W( ]2 @- d  g$ a
144.接单生产：BTO (Build To Order)
145,.烧焦：burning                : H" d; L! J- D2 l7 N
146.毛边(毛头)：burr
147.碳化物：carbide
148.定位梢：carlson pin                            - ^/ T$ H, X* M$ x
149.载运剂：carrier
150.催化：catalyzing
151.阴极溅射法：catholicsputtering             ; t/ A# U% q, i! W1 C- y
152.隔板;钢板：caul plate
153.校验系统之各种要求：calibration system requirements       * b7 B2 U$ m4 Z: h) p
154.中心光束法：center beam method       ( g8 M4 @, H$ r) A) ]
155.集中式投射线：central projection
156.认证：certification
157.倒角 (金手指)：chamfer chamfer
158.切斜边;倒角：chamfering
159.特性阻抗：characteristic impedance
160.电量传递过电压：charge transfer overpotential ) C' R) z: x/ V& g3 O
161.网框：chase
162.棋盘：checkboard       * T9 r+ D) Z, j- I% i. y7 t# \
163.蟹和剂：chelator
164.化学键：chemical bond    4 C% i9 c1 F  N! v$ z  W4 c3 {
165.化学蒸着镀：chemical vapor deposition       ; {. f9 C8 y& O2 T+ \5 N2 o" Z" \4 d% ?: x
166.圆周性之孔破：circumferential void    $ A& D! J& r8 k* A7 R- X
167.包夹金属：clad metal
168.无尘室：clean room                   : d' I& L+ Q1 F" i
169.间隙：clearance
170.表面处理：Coating/Surface Finish

NNNei256 · 发表于 2020-3-31 18:49

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