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你好，6 @1 ]1 S0 |3 u( X. ~, [3 V9 `0 P: t
在阅读了关于新推出的隔离设计流程和可信路由技术的xapp1086后，出现了一些问题。
7 E: D0 A% A) j5 z a将控制路径（例如加热器控制）和保护路径（例如温度监控）集成到同一芯片（比如说Zynq）并实现单一误差容限当然是很好的。: q+ B) n; p& w; ?
但是，控制系统和保护系统必须是独立的，如果电源是共用的，则情况并非如此。2 V* @. t2 @, F/ P3 Y
在这种单芯片实现中，您如何处理过压/欠压瞬态或EMC / ESD易感性？+ Z$ d/ x7 ~: X, N, B4 u1 ` L
我们可以借鉴哪些参考设计？9 v0 v6 ~) o8 o; {
Maurizio Bianconi7 f7 S; s! |9 o8 a' ]+ U
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以上来自于谷歌翻译
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以下为原文
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7 s; s- h5 X" o5 f! K- k2 Q7 G* vHello,
0 a* M7 D6 J& Uafter reading xapp1086 about the newly introduced Isolation Design Flow and Trusted Routing technology, a few questions have popped up. It would be certainly nice to integrate the control path (e.g. heater control) and protection path (e.g. temperature supervision) into the same chip (let's say a Zynq) and achieve single error tolerance.
2 f' F+ x& t# F Q' i8 O9 gHowever, the control system and the protection system are required to be independent, which seems not to be the case, IF the power supplies are shared. How do you go about supply overvoltage/undervoltage transients or EMC/ESD susceptibility in such single-chip implementations? Are there any reference designs we can draw on?9 ]% s: {3 ?$ b) {! g: r5 z
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Maurizio Bianconi
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发表于 2020-3-26 09:40
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反对！