[AD 10][2层] stm32F407+RA8875原理图和PCB源文件

Hol_mes23

作品名：[AD 10][2层] stm32F407+RA8875原理图和PCB源文件
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# T2 E- `: _' |# w5 S3 b/ d" V文件描述
3 l9 F' C5 G6 j, z& E/ G( @( m' [1. 软件版本：AD 10
2. 层数：2层板
! _9 k6 \2 @& @0 A- P+ l3. 用到的主要芯片：STM32F407ZET6
! I# K. Q/ u- ?3 f  e1 z4. PCB尺寸：246.6mm*148.4mm

# i# U! p$ A' X作品截图如下：
顶层截图：


底层截图：

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$ a3 s: p; v" Y  ?! R" a' s全层截图：

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叠层信息截图如下：

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* A7 p- I! |/ M' o+ d; gBOM：

Comment（属性）	Designator（位号）	Footprint（封装）	Quantity（数量）
BAT3V	BAT1	BATT_N	1
104	C1, C7, C9, C14, C15,  C16, C17, C18, C19, C20, C21, C34, C37, C38, C63, C65, C69, C70, C73, C77,  C78	C0402	21
10	C4, C5, C6	C0603	3
105	C8, C79, C80, C81,  C84	C0603	5
225	C10	C0603	1
225	C11	C0402	1
104	C12	C0805	1
1uF	C13	C0603	1
6P	C29	C0402	1
22P	C31, C32, C74, C75	C0603	4
106	C39	C0402	1
106	C60	C0805	1
104	C67, C68	C0603	2
220U	C90	CAP_RB 17	1
220U	C91	CAP_RB 18	1
220U	C94	C1206B	1
C105	CA1, CA3, CA4	C1206	3
C105	CA14	C0805	1
C104	CL1, CL3, CL4, CL5,  CL8, CL10, CL11, CL22, CL23, CL24, CL25, CL26, CL27, CL32, CL33, CL35, CU1,  CU2, CU3, CU4, CU5, CU6, CU7, CU8, CU9, CU10	C0402	26
C104	CL2, CL6, CL9	C0603	3
C475	CL7	CAP_RB 11	1
C475	CL18	C0805	1
C22	CL19, CL20	C0603	2
C104	CL21	C0805	1
ET0700B3DMA	CN4	FPC-40-0.5	1
C107	CV1	CAP_RB 03	1
BYV55	D2	SOT-23	1
1N4007	D5	DO-214AC,SMA	1
D5.7V	D6	DO-214AA,SMB	1
D Zener	DA9	D1206	1
1N5819	DA11, DA12	D1810(SMB)	2
SS14	DL1	SOD123	1
LED_D	DL20	SS1209-B4C	1
100uF	EA1	CAP-RB.2/.4-黑	1
470uF	EA2	CAP-RB.1/.25-蓝	1
100uF/16V	EA5	CAP_RB 10	1
HR911105	EARTHNET1	RJ45 - DL	1
电流互感器	H1	HGQ	1
CT07	H2	HX2.54-4	1
JK2H	J1, J2	SIP2	2
USB	J3	USB3.0 H	1
TF卡	J4	TF	1
Relay	K1	JDQ-HF32F	1
Relay	K3, K4, K5, K6	G5LE-1-5VDC	4
100uH	LA1	L-12*12mm-S	1
22uH	LL1	L7163	1
MIC	MIC2	MIC1	1
HX2.54-2P	P1, P3	HX2.54-2	2
Header 4	P2, P12	HX2.54-4	2
HEAD2*22	P7	HDR2X22	1
HP2.0-3P	P8	HX2.54-2	1
HP2.0-3P	P9	Hx2.0-3P	1
Header 8X2	P11	HDR2X8	1
DJ6112	PA1, PA12, PA13,  PA14, PA15, PA16, PA17	DJ6112	7
DJ6112	PA2	HX3.96-3	1
Header 6	PA3	HX3.96-6	1
Header 4	PA4	HX3.96-4	1
Header 4X2	PA6, PA7	HDR2X4	2
Header 8X2	PA8, PA10	IDC2.54-16	2
Phone_Jack	PH1	EARPHONE-SMT	1
Header 30	PL1	FPC-30	1
Header 4	PL2	FPC-1MMS-08P	1
Header 12	PL5	FH12A-15S-0.5SH	1
Header 11	PP1	PAM8610	1
R103	R1, R2, R3, R4, R5,  R6, R8, R16, R34, R36, R50, R55, R63, R64	R0603	14
R102	R7	R0603	1
R511	R9, R24	R0603	2
R100	R10, R11	R0603	2
R000	R12, R13, R14, R15,  R17	R0603	5
12V/0.5A	R18, R26	R1206	2
R202	R20, R21, R22, R23	R0603	4
R100	R25	R1206	1
R101	R27, R28	R0402*4	2
R22	R29, R30, R31, R66,  R67, RL1, RL2, RL12, RL?	R0603	9
R473	R32, R33, R60	R0603	3
R203	R39	R0603	1
R681	R40, R42	R0603	2
R472	R41, R57	R0603	2
R472	R44	R0603*4	1
49R9	R49	R0603*4	1
RL102	R56, R65	L0603	2
1R0	R58	R0603	1
R102	R59	L0805	1
R102	RA2, RA4	R0805	2
R101	RA3, RA5, RA6, RA7,  RA8, RA9	R0805	6
471D20	RA18	CAP_CBB0.4	1
SHT2x	RH1	SHT2x	1
5R1	RL17	R0805	1
100R	RN1, RN2, RN3, RN4,  RN5, RN6, RN7, RN8, RN9, RN10, RN11, RN12, RN13, RN14, RN15, RN17	R0402*4	16
KEY_M	S1, S2, S3, S4	SW-SMD2*4	4
Trans	T2	共模电感 7*8	1
TFT_LCD	TFTLCD1	HDR2X17	1
STM32F407ZET6	U1	LQFP144	1
IS62WV51216	U6	TSOP80P1176-44	1
MPU6050	U7	QFN24	1
3525A	U11	GD6500	1
WM8978	U12	QFN32	1
W25X16	U16	SOIC-8	1
LAN8720	U17	QFN24	1
Optoisolator1	UA2, UA3	DIP-4	2
LM2575S-5.0	UA5	TO-263-5	1
ULN2823LW	UA6	LW18_N	1
RA8875	UL1	LQFP-100	1
MC74VHC1G125DFT1	UL2, UL6	SOT23-5	2
SN74CBT3257PWLE	UL3	TSSOP-16L	1
W25Q64	UL4	SO-8	1
GT811	UL5	QFN40 D50-0.4	1
PT4110	UL9	SOT-89-5	1
Jumper	W?	RAD-0.2	1
XTAL3	X3	OSC_HC49l	1
XTAL3	XL1	OSC_5032	1
8M	XY3	OSC_32768B	1

0 Y, P4 c/ N% \7 U+ i附件：
: }7 m9 E# E3 g# G4 p9 ~- a原理图和PCB源文件如下：
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