[allegro16.3][6层]EP4CE30_55F23核心开发板（EP4CE30_55F23+IS61C25616+网口+USB...

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[allegro16.3][6层]EP4CE30_55F23核心开发板（EP4CE30_55F23+IS61C25616+网口+USB）原理图和pcb文件 8 u% V2 Y( `1 h) h1 F 文件描述： 1. 作品用途：P4CE30_55F23核心开发板 2. 软件版本：allegro16.3 3. 层数：6层 4. 用到的主要芯片：EP4CE30_55F23+IS61C25616+网口+USB 5. PCB尺寸：100*70 MIL 作品截图如下： 顶层截图： 底层截图： 4 B5 T% p. K4 ^# o: J' F 全层截图： BOM： Bill of Material Report (Condensed) SYM_NAME COMP_DEVICE_TYPE COMP_VALUE COMP_CLASS QUANTITY REFDES 名称 类型 属性 类别 数量 位号 402 CT41-0402-2R1-50V-104K_0402_0.1 0.1uF IC 4 C48; C49; C50; C51 603 CT41-0603-2R1-50V-104K_0603_0.1 0.1uF IC 39 C3; C5; C8; C10; C11; C12; C13; C18; C19; C21; C24; C29; C30; C31; C32; C33; C35; C36; C37; C38; C39; C40; C41; C44; C45; C52; C53; C55; C56; C58; C59; C61; C62; C64; C65; C67; C68; C70; C75 603 CC41-0603-CG-50V-471J_0603_470P 470pF IC 1 C28 603 CC41-0603-CG-50V-220J_0603_22PF 22pF IC 2 C46; C47 603 RMK1608-240J_0603_24R 24R IC 2 R1; R2 603 RMK1608-103J_0603_10K NU 10k NU IC 1 R3 603 RMK1608-510J_0603_51R 51R IC 2 R4; R7 603 RMK1608-102J_0603_1K 1k IC 3 R5; R29; R48 603 RMK1608-103J_0603_10K 10k IC 9 R10; R30; R43; R44; R45; R46; R47; R49; R50 603 RMK1608-752J_0603_7.5K 7.5k IC 1 R11 603 RMK1608-472J_0603_4.7K 4.7k IC 8 R12; R13; R17; R18; R19; R26; R28; R32 603 RMK1608-000J_0603_0R NU 0R NU IC 2 R14; R15 603 RMK1608-682J_0603_6.8K 6.8k IC 1 R21 603 RMK1608-101J_0603_100R 100R IC 3 R22; R23; R31 603 RMK1608-222J_0603_2.2K 2.2k IC 2 R24; R25 603 RMK1608-104J_0603_100K 100k IC 1 R27 805 EMK212BJ106KJ-B-16V_0805_10UF 10uF IC 19 C1; C4; C6; C7; C9; C20; C22; C23; C25; C34; C42; C43; C54; C57; C60; C63; C66; C69; C76 805 BLM21P221SGPT_0805_2A 2A IC 7 L2; L3; L4; L5; L6; L7; L8 805 RMK2012-499F_0805_49.9R 1% 49.9R 1% IC 4 R6; R8; R9; R20 1206 LED_1206_1206_LED LED IC 5 V1; V2; V3; V5; V6 1806 BLM41P600SPT_1806_4A 4A IC 1 L1 BUZZER BUZZER_BUZZER_BUZZER BUZZER IC 1 P2 CRYSTAL CRYSTAL_CRYSTAL_24MHZ 24MHz IC 1 D32 CY7C68013-56LFC CY7C68013-56LFC_CY7C68013-56LFC CY7C68013-56LFC IC 1 D27 EPCS-16 EPCS64SI16N_EPCS-16_EPCS64SI16N EPCS64SI16N IC 1 D15 FBGA484 EP4CE30_55F23_FBGA484_(S1+S2+S3 EP4CE30_55F23 IC 1 P1 HDR80_2X15 HDR80_2X15_HDR80_2X15_HDR80_2X1 HDR80_2X15 IC 1 X12 HDR80_2X20 HDR80_2X20_HDR80_2X20_HDR80_2X2 HDR80_2X20 IC 1 X3 HDR80_2X40 HDR80_2X40_HDR80_2X40_HDR80_2X4 HDR80_2X40 IC 2 X1; X2 JTAG100_2X5 JTAG100_2X5_JTAG100_2X5_JTAG JTAG IC 2 X8; X9 JTAG100_2X5 JTAG100_2X5_JTAG100_2X5_LED LED IC 1 X11 LQFP-48 DM9000AEP_LQFP-48_DM9000A DM9000A IC 1 D29 OSC-5X7MM CMO AMC-25MHZ_OSC-5X7MM_CMO AMC CMO AMC-25MHz IC 2 D16; D30 PCT0001-01 PCT0001-01_PCT0001-01_RJ45 RJ45 IC 1 X16 PTH05050 PTH05050WAS_PTH05050_PTH05050 PTH05050 IC 1 D5 RAPC712 CONN_JACK_PWR_RAPC712_CONN_JACK CONN_JACK_PWR IC 1 X10 SOIC-8 CY2305SZI-1_SOIC-8_CY2305SZI-1 CY2305SZI-1 IC 1 D2 SOIC-8 24LC64-ISN_SOIC-8_24LC64-ISN 24LC64-ISN IC 2 D9; D31 SOIC-8 MIC5209-2.5BM_SOIC-8_MIC5209-2. MIC5209-2.5BM IC 1 D17 SOT23 MMBT3904_SOT23_NPN NPN IC 1 D28 SOT223 ADP3339AKC-3.3_SOT223_ADP3339-3 ADP3339-3.3 IC 1 D6 TAJB TAJB336M016R_TAJB_33UF 33uF IC 2 C26; C27 TAJDE TPSY107M016R_TAJDE_100UF 100uF IC 1 C14 TAJDE TAJE227M016R_TAJDE_220UF 220uF IC 1 C15 TAJDE TAJE477M010R_TAJDE_470UF 470uF IC 2 C16; C17 TSOP-II-44 IS61C25616AL-10TLI_TSOP-II-44_I IS61C25616 IC 1 D11 USB_B USB_B_USB_B_USB_B USB_B IC 1 X13 附件： 原理图和PCB文件如下： 游客，如果您要查看本帖隐藏内容请回复

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