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*.GTL TopLayer顶层走线# B3 a3 J2 H U; m* i a
*.GBL BottomLayer底层走线
. X3 ?; j3 s$ \, N! W *.GTO TopOverlay顶层丝印字" c* F3 F+ Y) B; N
*.GBO BottomOverlay底层丝印
2 ~5 I& F0 l0 |' c! a: \2 H *.GTS TopSolder顶层阻焊
( a" V5 I3 B# Q% @! l' k2 ^& `* J6 e *.GBS BottomSolder底层阻焊
+ P/ k& ~, U. S *.GTP TopPaste顶层贴片钢网
0 E1 a. ?# _ ]0 E5 [0 A *.GBP BottomPaste底层贴片钢网
4 q0 e2 S9 h/ i* h! g; q *.GPT Top Pad Master顶层主焊盘
0 J# O; |- k/ J) b, E: i4 j *.GPB Bottom Pad Master底层主焊盘; ~# m9 n6 ^/ V6 |3 O
*.G1,*.G2,.. MidLayer1,2,..内层走线
$ P/ i7 `: P |5 G *.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,..
! _7 d. C7 ~4 f$ k$ X, G4 ]! z *.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,..9 Y! S7 ?% R8 J8 S
*.GKO KeepOutLayer禁止布线层(可做板子外形)0 p) w2 m1 v0 ~: P8 z U( v
*.GG1 DrillGuide钻孔位置层6 _0 Q9 s X8 d, K; F
*.GD1 DrillDrawing钻孔图层 *drill 钻孔文件
/ |$ k$ J- o! j *.TXT 分孔图表5 H# W4 N- r/ Y; A' f3 A$ B7 P
*.APR 光圈表文件
3 f% c" H. Y; U$ I C3 u: S0 |# k *.DRR 钻孔报告文件
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