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Layout Guidelines and Topology:7 Y* f9 M* X$ m* k5 @
The following are the routing guidelines followed for DDR memory inteRFace section:
$ d/ s0 m/ Y9 F4 }* f% e$ F# [* ?1. Controlled impedance for single ended trace is Z0 = 60 ohm.
6 J, u4 Y3 o" b+ c* L, ~( \2. DQ, strobe, and clock signals are referenced to VSS.
$ B: R& {3 _: S* a2 {# G3. Address, command, and control signals are referenced to VDD.
$ k( k* s* X: c u, ^' n, B4 S4. The length of address, command, and control signals are matched to clock with +/- 100 mil: ?* I: ^$ a( a
tolerance./ u9 j( Q& s: b$ v& A$ p) Z
5. DQ <0..7> & DM signals are length matched with respect to DQS with +/- 100 mil tolerance' o% ~4 g$ q" P: M: X$ Y7 t& O5 Z
(byte lane).! T+ S% @0 D2 M1 |3 H* _: {) |8 d
6. Each byte lanes are routed on same layer.: x/ c9 ~, ]7 C, Y* F/ E+ c! ~% H* j
7. Byte lane to byte lane is matched to clock with +/- 500 mils.
' B5 l% ^$ h s8. CK & CK# are matched with +/- 30 mil and are routed as diff pair with 120 ohm differential4 M" C4 q1 d2 D& W
impedance.6 Q$ h. G5 x g g. D% b- P; \
9. Clock - pair to pair matching tolerance is +/- 30 mil.3 o: M5 r& w0 A4 V0 @( A% y
10. Trace to trace spacing is 2X and signal group to group spacing is 3X.; ?- i9 T; D! v6 j9 _7 n7 Z+ r6 {8 q. J& h
11. DQS signals are routed in the middle of the byte lane (DQ<0..7>).
: D3 U$ C: b9 _9 ~7 F) I$ I12. Clock trace split point to DRAM is less than 1 inch.: {) e: ^1 L# R; m6 O
13. VTT and VREF islands are separated with the minimum spacing of 150mils.9 k7 e6 @! |2 m- e7 E
14. VTT island width = 150 mil min.; 250 mil preferred.
7 ^7 i, Z& \+ |- s, O15. VREF signal is routed with 20–25 mil minimum trace.
& P j: D) Y" B/ ]" v& D% p15. All signals are routed with minimum of 3X spacing between other signals
/ m1 I* T" c0 z7 {. K16. Layer biasing is followed for dual strip layers.
6 M5 a. q4 `' v$ K1 ]$ RFigure 1 shows the data bus topology and figure 2 shows the address/control bus topology. |
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