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Mechanical 1 (M1):Board outline (it is not recommended to use just the keep-out layer, since that can be used for other things also).建议作为板框层使用,不用做禁布层或其他用途$ R4 { l: w& x& I8 w: S
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Mechanical 2 (M2):PCB notes and comments for the PCB manufacturer/assembler (included in Gerber output).需要PCB生产或装配知悉的注释和要求,生成Gerber时输出此层
$ c0 {8 C8 b) ^& s0 H5 g' B# iMechanical 3 (M3):General notes and comments that the PCB manufacturer/assembler does not need to know about (not included in Gerber output).不需要PCB生产或装配知悉的注释和要求,生成Gerber时不输出此层
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% U3 R& c2 V: y9 R' \( V DMechanical 11 (M11):Top layer dimensions (paired with M12).顶层尺寸标注
- v- F1 `9 U* [. C, A2 `! [Mechanical 12 (M12):Bottom layer dimensions (paired with M11).底层尺寸标注8 J9 M, B( Z. j: T! O/ R |
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Mechanical 13 (M13):Top layer component body information (3D models and mechanical outlines, paired with M14).顶层元器件实体尺寸信息(3D模型和机械边框,与M14层相对)
7 ]. U3 A, }3 i( C ^Mechanical 14 (M14):Bottom layer component body information (3D models and mechanical outlines, paired with M13).底层元器件实体尺寸信息(3D模型和机械边框,与M13层相对)* s- m+ ~# n4 w% O
; U) X8 J: h. q' d; G1 aMechanical 15 (M15):Top layer courtyard and assembly information (paired with M16). This normally includes a cross-hairs at the origin of the component.顶层元器件实体占位和装配信息(与M16相对),一般也包括圆心标注的十字准线! l; ^7 c/ n$ J+ J$ i
Mechanical 16 (M16):Bottom layer courtyard and assembly information (paired with M15). This normally includes a cross-hairs at the origin of the component.底层元器件实体占位和装配信息(与M15相对),一般也包括:原点标注的十字准线+ d; s v. D2 K/ l* A8 R" X
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