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本帖最后由 mytomorrow 于 2019-8-2 15:00 编辑 ! w2 S2 p( l! V! a' k& K
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General Description& g: I5 g' @5 x$ x# X3 ~
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AGM FPGA devices are targeted to high-volume, cost-sensitive, applications, enabling system designers N4 y" `" I- R4 l' t- S4 N
to meet increasing peRFormance requirements while lowering costs. The SRAM-based FPGA device, its! n N% @; q# l5 R) U. p7 }
low cost and optimized feature set makes ideal solutions for a wide array of automotive, consumer,4 t/ w+ z9 o$ U4 Z8 I! i
communications, video processing, test and measurement, and other end-market solutions. AGM FPGA) t. W+ }$ W2 W! k
device family provides the ideal solution for your high-volume, low-power, and cost-sensitive applications.
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Features
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High-density architecture with 6K to 10K LEs
2 @: g& h9 f! W0 C M9K embedded memory blocks, up to 414Kbits of RAM space
. [0 I0 z( l% }8 b/ G5 K5 L3 ` Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit
9 k9 o; s2 R) S, N6 hmultipliers
1 [0 K" A3 o% l. [. T Provides 2 PLLs per device provide clock multiplication and phase shifting* C/ c% I2 J: }' r: \. H
High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
+ g- x! r& @% W+ ?! E2 Z Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL( t9 ~6 ^$ G8 \% h- k, m4 J) V6 U
General package options, LQFP and FBGA.$ X8 T/ c) A& i m+ q( K
Flexible device configuration through J
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Most of our FPGA chips pin to pin compatible with Altera chips.0 `6 J) D: H5 B# m! U3 O
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