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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
# d) B5 H, u9 P. ]* T' s( ?. nRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when
8 ^" J I3 B( y: Kelectrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.
, k9 U0 b5 H( `) ]The dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen
/ j- l) K+ C# Mwhen electrical properties are less critical. |
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