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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
" w$ D% @* O+ \/ f. \! x7 PRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when
1 J; c4 s; [: [electrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.. F; g3 g2 E$ G- I% R: {6 Y/ H4 G3 g
The dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen
( z, G" t" D' hwhen electrical properties are less critical. |
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