|
Layout Considerations Topics4 X, w; Q& D" u8 w: ]$ n
• Noise Coupling Mechanisms; Q8 j3 Y$ G7 q5 o' a: w
• Locating the high di/dt loops. ~5 u; H7 k9 e X
• “Ground rules”
/ w7 U5 O- F% D$ L5 N; U• Copper Requirements For High Current Paths
3 o! w3 ^ Q4 Q, u" ]5 ~• Component Placement Strategy, [, L$ w8 [) Z4 r: }- F6 b
• Gate Drive Layout Requirements" O7 V9 e/ n& i( N m1 E" J5 T6 f9 I
• Power FETs and Decoupling6 C& S* H. S0 z# S) {
• Switch Node design
5 n, U9 X9 Z7 m- E; K4 S, v• Output Capacitors
$ Z) F% `. m8 d& |% E• Control Circuit Consideration
% M; V! `6 d, y3 w5 j• Noise considerations3 s; I7 L0 v, S1 b, L1 k* A9 R
• Thermal Considerations |
|