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DRC - (Final DRC)
7 {5 W. }; [1 ~8 |, d -----------------
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5 ~4 h. ?$ m6 t" b5 I$ \6 m 04:46 PM Thursday, April 16, 2015' ]. y( ^0 l6 u4 _
Job Name: E:\WorkSpace\Doppler\Hardware\DS120\PCB\Board1.pcb
y: v9 `$ L+ m' ^6 I0 ` _* O; d1 P F9 I; [, R: n' W" k
6 r9 y) [6 Q' H/ `4 m0 Q! P6 ]# s ---------
+ y1 K' a- V" {1 f T PROXIMITY9 _9 B8 f" j* U8 j
---------
. h) ?* J4 ~* O
+ r! N7 m6 i4 J: A6 U; Y! c' }1 { Use DRC Window : NO" T) @& y9 N ]
" }0 A; X/ X# k9 g, o
7 F+ |9 _. C" g8 e7 W. }! _% E
Disable Same Cell Pad-Pad Checks : NO% ]& T- d% ?# w9 _& _
% e' S0 I r( H# u) _" a9 K
' O. `9 w. _9 C" h4 G, Q6 p
Enable Same Net Pad-Pad Checks : NO3 h) h i2 k/ S8 Q9 ]
) M3 a& O3 U! Y0 G% U6 g" m4 W
( V6 a4 O" M) I2 M
Layers Specifed To Check : Layer 1) z# C' M( V+ E1 F
Layer 2
( N0 r9 `4 Z9 \0 j u% Z' L- A2 \2 k Layer 3
9 E, m/ f7 x% B* c, D Layer 4. D# b3 \+ b5 u
8 S( g. T" b0 ]) L/ b8 i5 y1 [
- y$ u2 N9 m P M L' n; {7 S2 I: c" N: w. Z3 R. O
9 J P+ K5 k1 V- W/ M. E Net Class Clearances And Rules
' C8 ?) w; ]7 z, \: `5 I) W ------------------------------# f) n8 H. B0 Y( c/ J
9 X9 ]3 F5 O3 A" Q
Components Layer 1 TO Components Layer 12 w& S+ Z- j3 ^1 F& K3 U
No Hazards.
! ?% ]# Q, u0 j5 t% ~& L. H, C0 B: K
Traces Layer 1 TO Traces Layer 1
4 T/ q# S2 j. g$ S) s No Hazards.: L0 k5 _) Q. I2 \6 B0 V; z
% L) q- B6 q+ ^- ]" G. Q
Traces Layer 1 TO Part pads SMD Layer 1
6 p, H* q9 _# L O5 Q No Hazards.: P" @# N0 \% H, d. r) ?" L; @
5 Z) O5 `0 O# p" I0 x d
Traces Layer 1 TO Part Pads Thru Layer 17 |0 ?( u$ L) e! {$ r! d: @# ~
No Hazards.! _( ?' h$ k/ P. k, o/ a2 g
6 ?$ h# C* p1 s* C
Traces Layer 1 TO Part Holes Layer 19 K2 }+ V. w3 Q
No Hazards.
1 Z/ U$ P& R* n4 j3 f: H) N4 w* _" }5 K0 S, }0 O1 L
Traces Layer 1 TO Via Pads Layer 1, P' v y' U% Z4 D) a. `7 L6 t
No Hazards.5 W& t. X c7 j( N, [
" U* @2 q5 U: t6 ?4 l
Traces Layer 1 TO Via Holes Layer 1, x4 C0 S. [; L' u6 y# P$ j
No Hazards.
& A6 G3 c; A8 @) b5 B( V4 ^8 f
9 K' I: ~; V( Q# w Part Pads SMD Layer 1 TO Part Pads SMD Layer 18 B& n2 R# v5 c6 o( q% a: ~0 x6 y# `
No Hazards./ Y: [: e" v4 m8 r0 U3 t# d
7 w- f" t4 e# I7 W9 \( \" z! f Part Pads SMD Layer 1 TO Part Pads Thru Layer 1
7 c' y$ c1 s. s; k; x No Hazards.9 o5 r+ h% V7 R) v8 D( ]: v. f2 k# x
: q2 V+ y' ^! Z Part Pads SMD Layer 1 TO Part Holes Layer 1
/ E8 z# E; s, \; p No Hazards.7 N) c: c. d# k
7 I! G3 n! Q& @& v5 X Part Pads SMD Layer 1 TO Via Pads Layer 1; N4 A5 q6 E8 R
No Hazards.* S4 V: C8 q I& u5 Z7 o$ P k) G" {
/ o7 k/ Z- K) d: @ E Part Pads SMD Layer 1 TO Via Holes Layer 13 J6 N5 w0 e$ j! Z$ B) g# d8 k
No Hazards.
* f% b# G9 S/ y% I. }( b X+ q& b& Y" ^- N" j' E6 B @
Part Pads Thru Layer 1 TO Part Pads Thru Layer 1
# `' |* E7 r- o) y+ p8 @! ~: p No Hazards.% i, P; ~0 q+ L' ?) O, i, X5 E
5 j0 d8 r! {+ w; v+ o8 ]9 ?* y- ?6 q7 E
Part Pads Thru Layer 1 TO Part Holes Layer 1
! u0 u* N7 U `9 h No Hazards.
, \8 n. c' g- E% a) {- k+ R. ^8 _
Part Pads Thru Layer 1 TO Via Pads Layer 1
4 [$ H3 {* W5 \/ r' v5 i No Hazards.5 ], r( k2 S' U5 O. V& L
4 n9 f4 Z$ M0 p7 V/ K2 X Part Pads Thru Layer 1 TO Via Holes Layer 1
! g" o$ i5 l2 Z9 c% ?. G No Hazards.
1 y0 ~/ n* F; l/ B, ^6 e9 I- v8 G- @+ O1 q0 z. D" X
Part Holes Layer 1 TO Via Pads Layer 1# V. G; O: T% _8 C& v
No Hazards.
+ G; a' N3 U+ ~) R, |
. U* b/ D3 V- N; ]( A0 N w" U Part Holes Layer 1 TO Via Holes Layer 1, l5 J0 u# a3 u) o! k8 N
No Hazards.% R7 n" n" t, z6 @$ f. c2 b5 d# k
, ?, e' N& Q% r/ z/ ? Via Pads Layer 1 TO Via Pads Layer 1# z- k- m' r: R" [) F- B
No Hazards.& E9 N: K- D& X0 X1 Q8 c& {8 t; C- d0 z
) u* [, N' Q, j' `3 M3 N. Z Via Pads Layer 1 TO Via Holes Layer 1
, E" Y% M# ?0 e- j/ O( w9 g7 l No Hazards.* [3 ~7 x# S3 a/ e2 c
- }4 H# O9 |4 P; Z' C
Via Holes Layer 1 TO Via Holes Layer 1
5 Z1 f2 d% }( ` No Hazards.
& X1 l1 ~& I- ]& y2 d2 e( Y" ?3 @7 }/ ^& L( S% j) @
Part Pads Thru Layer 2 TO Part Pads Thru Layer 2! C* m8 x0 X8 y* H+ W% v
No Hazards.
5 Z, T# V6 _# w7 S3 a3 S4 [1 c; \! F5 m
Part Pads Thru Layer 2 TO Part Holes Layer 2
9 F6 L; I7 x; E( l L No Hazards.
* f7 X, g1 z/ m( h6 L I7 V6 o0 y% ^( J9 y& Q
Part Pads Thru Layer 2 TO Via Pads Layer 2
: `, _3 `: {' u* U& n t6 h No Hazards.% y S9 k7 h8 C5 y: F( j
, t) ?6 |( j0 L' N Part Pads Thru Layer 2 TO Via Holes Layer 2, l" q0 v* `1 Q1 {2 V& c m+ m
No Hazards.
2 K, e: f. ^5 e$ B/ t' P" d. n* B+ T: _4 l6 ~8 U1 W
Part Holes Layer 2 TO Via Pads Layer 2, Z' p2 j% a" b
No Hazards.( c2 [( J; [ m: g" `4 X
8 F. a. H L+ x
Part Holes Layer 2 TO Via Holes Layer 2
! v2 q8 B% q2 V! h No Hazards., b, j2 S5 N5 S& t* ]% ?& Y
" t- ?" Q/ T6 r- g1 L$ @( D9 s Via Pads Layer 2 TO Via Pads Layer 24 d& P; P% T) v" E: A; Q
No Hazards.- D4 q$ Q* Z( Q* z: u3 k9 s8 `
. d; O* j1 e$ `7 n4 |' X. _$ Z
Via Pads Layer 2 TO Via Holes Layer 22 M+ c7 v% N: D* F
No Hazards.0 k( u9 L, m* [) p {
4 r: t* S/ L9 d' O7 e
Via Holes Layer 2 TO Via Holes Layer 2) {5 X! r0 X- e" R9 D
No Hazards.
( S+ v+ Z- P8 X& _7 Z: p/ R2 e# n( v+ [: t
Traces Layer 3 TO Traces Layer 30 P* A7 ~& U" ?& @0 H3 j
No Hazards. s& n& H$ v* o# Y; I3 Q
8 R1 ?# a8 q+ i5 }
Traces Layer 3 TO Part Pads Thru Layer 3( p9 M1 K" H4 m- ~
No Hazards.$ q- \1 X! w: W) [
. d; l/ W" d# j( N7 T' \# h
Traces Layer 3 TO Part Holes Layer 3
& n9 D* U9 ?+ z, B6 W No Hazards.$ u; W5 h+ ~% _, b
8 D; @; S7 L2 A3 T/ @6 z8 q% q
Traces Layer 3 TO Via Pads Layer 3
8 r' ^& p$ |' P( G& Y0 `: ]0 ` No Hazards.* q9 _% N! A+ r5 X# `
; Y" \$ z& ?1 P7 @$ [/ ?: l1 D# _4 h0 M Traces Layer 3 TO Via Holes Layer 33 Y6 U) _; o1 M5 t! N1 J8 g
No Hazards.$ r5 ^* @1 N& P; Y- m
1 Y6 e2 ~0 }' b& X% {7 e. | Part Pads Thru Layer 3 TO Part Pads Thru Layer 3" Q3 s% H X- Q7 l- F3 u" s
No Hazards.
k8 k& s. g2 u% s1 F9 N7 |* ^5 v% P; }1 R- B6 j/ e
Part Pads Thru Layer 3 TO Part Holes Layer 3
* I0 e& W( \: F No Hazards.2 Q0 R7 [& I: X* y
s k2 j# J1 \7 y0 D
Part Pads Thru Layer 3 TO Via Pads Layer 3# D+ O$ F3 D9 t5 y; H
No Hazards.
1 h' K/ A' F. ~- @% _- v# K8 b: t# x
Part Pads Thru Layer 3 TO Via Holes Layer 3
1 B" w0 O9 g- [1 X9 S2 Z No Hazards.
& Q% N9 D2 r# a
3 q8 r0 h7 `$ T* ?4 Q) | Part Holes Layer 3 TO Via Pads Layer 3
; [ J8 y. W8 B1 {0 M( T$ C No Hazards.
8 Z" l- z. e7 A+ \# B2 X; ^& \
1 ~# p' L' y5 F9 i! L) Q; i Part Holes Layer 3 TO Via Holes Layer 3$ ~+ y5 ?5 ~" R$ E- z
No Hazards.
M' H7 y$ \, n) ]$ i& d
1 U4 ~( T& W# O% X1 i, ^$ ?: | Via Pads Layer 3 TO Via Pads Layer 3
5 p/ [4 B2 T/ o; w3 d2 N No Hazards.9 `+ E( I/ o$ M: }
/ J" [$ c7 w- ~, W! [6 k" D Via Pads Layer 3 TO Via Holes Layer 3* o% ~1 B! J# {* Y
No Hazards.
+ ~6 W& G2 C2 p, |% ~* k/ ]: g' r9 O. c! V; Q/ E' u
Via Holes Layer 3 TO Via Holes Layer 3
7 z$ h! q, K2 O- a! ^) b' x No Hazards.5 J* t: A" x1 V9 U; h1 Q2 }. E7 j
1 y% _. \6 X% S3 p0 Y5 G' ]8 M Components Layer 4 TO Components Layer 4
; R/ z6 Z! O A5 { T No Hazards.5 z; {. e) q3 @ R9 q% l
* s7 g* G0 p* p% t1 q Traces Layer 4 TO Traces Layer 4. C) f- r" b. R$ b" n
No Hazards., z% r5 J3 r" Q1 l o; @
2 z. j7 O2 X& w. w# q Traces Layer 4 TO Part Pads SMD Layer 4; f: L! t8 H1 h8 K% A
No Hazards.
$ m `; ?3 k5 S1 ^! R* z4 V: m" f1 r/ j0 ~. h" K* ?
Traces Layer 4 TO Part Pads Thru Layer 4, j- f" p0 N- d
No Hazards.
7 e$ y8 w2 U- P2 f
/ D2 S0 J. P: Z* }' T3 v% @' u# x, W Traces Layer 4 TO Part Holes Layer 4
6 C) u# ]% W: D4 Z. c- w2 ] No Hazards.
6 j4 i2 A8 ]% H, L( L8 m
- @' k' b7 g0 v. I( E Traces Layer 4 TO Via Pads Layer 4
8 {& Q7 `9 U2 }2 ~% a No Hazards.
8 @, f8 p: d0 ?& ?) |2 C5 r1 d5 v7 n) _- a2 z: b6 v# V
Traces Layer 4 TO Via Holes Layer 4& g n9 R# q' {8 C- V
No Hazards.! M" b* P' x$ e3 E
: s! T0 F. m# e5 E& T7 C5 K4 E
Part Pads SMD Layer 4 TO Part Pads SMD Layer 4
6 `" N6 U+ W2 G2 D, c; K No Hazards.
/ E3 F! C( f6 [1 N" v% x% d1 H# j# P! `5 L, `" m" U
Part Pads SMD Layer 4 TO Part Pads Thru Layer 4
! Y1 p/ G6 ?, _, _3 V No Hazards.
* t* ^' G7 v+ w' Q% n$ Z2 s* j& {7 L2 j7 g' a" v9 \
Part Pads SMD Layer 4 TO Part Holes Layer 4( y3 X5 m1 I- E* E3 e1 t* c. O
No Hazards.
; b# [9 _8 O* H9 c8 A* e: N* s2 y$ ^
Part Pads SMD Layer 4 TO Via Pads Layer 4) T& w% g( m; q1 e' a( _; q% @) ~
No Hazards.; C# c7 B, M2 p0 m B6 L
5 U }( j6 x+ I' Z' l0 a9 y Part Pads SMD Layer 4 TO Via Holes Layer 47 N) v: G4 X, [' G/ o. [
No Hazards.
1 z- d$ s( s: E W) ]6 C3 Q/ l5 J' l6 Z) ]$ S) c8 J
Part Pads Thru Layer 4 TO Part Pads Thru Layer 4
4 ^( }3 {' X. T0 E1 b6 x' M1 T No Hazards.' p: Q9 Q& j! s) {% s+ w
/ y5 r* a1 I2 F) I1 {! ]0 Z1 U Part Pads Thru Layer 4 TO Part Holes Layer 4
; M5 A4 C! K8 c; h2 Y. {! C No Hazards.2 [1 n& { q. z
7 c0 k4 @3 s% B0 P F! Y1 k
Part Pads Thru Layer 4 TO Via Pads Layer 4
) k8 p8 D& a q/ w No Hazards.; T( w) D8 _, L+ {; I; L( U" M
& K: ^* v/ @3 l9 u Part Pads Thru Layer 4 TO Via Holes Layer 4$ k( v, R1 e8 E+ \, e
No Hazards.
$ q4 p2 p3 e- ^; i- \9 N/ r# h
3 w4 }. ^1 w5 [' D Part Holes Layer 4 TO Via Pads Layer 4
8 u9 G3 H; _8 R% A2 ~ No Hazards.
8 }" `2 p g6 v ]; ?' ]
9 n/ F! w( j: A" F1 j7 e; g3 l$ _ Part Holes Layer 4 TO Via Holes Layer 4. ^& }1 {! q1 F8 P5 g) K
No Hazards.& C" p- w/ r. I3 S5 w: ^1 {3 L, a
2 G9 r r% `5 [: o Via Pads Layer 4 TO Via Pads Layer 4
. h* A0 U+ X" M No Hazards.
1 M1 w- u1 p( v3 q* G+ q8 }0 s [- y0 s& {# z& M+ _( q
Via Pads Layer 4 TO Via Holes Layer 40 N5 C3 S: o! a9 {6 V
No Hazards.
9 W) w6 `7 d. Y( E2 ?
3 L+ B8 J7 L2 a: r Via Holes Layer 4 TO Via Holes Layer 4
/ J2 t# E6 A& l- \5 ^/ W2 d% m No Hazards.
; W5 j5 O, K9 X
: j' \3 X- K5 ]1 m3 I J, l& R5 D/ T+ E; G
Total Hazards Found : 0, X6 a! l' d$ f+ ~1 { Y
8 F% R H, v# J+ M
& ?, U3 q1 ^) ~9 T# h9 I
2 B* A1 ]1 s* y# u$ M0 A4 N
9 q# K/ z) L I, f Planes Clearances And Rules1 a+ N l, I, u3 q! D( s) {
--------------------------- ^4 o4 I6 u3 m9 {1 l) l2 M
9 M3 j6 ^3 h/ ~; n" B
Positive Planes Layer 1 TO Part Pads SMD Layer 1
* J) H6 W. V: ?6 H0 i1 d No Hazards.3 E, E/ o3 V3 p1 Y4 Y2 Q" a7 E% R
6 Y& f( w+ F& [. k' r/ F2 ~1 s Positive Planes Layer 1 TO Part Pads Thru Layer 1
0 L5 J( d& c n No Hazards.
4 Z7 B" M* W& r' G% d) H# N T2 [' M C' q
Positive Planes Layer 1 TO Part Holes Layer 1
( N6 y! u; a- v No Hazards.
* f0 U+ g# }( e6 K; I% \
! z% e7 d. E7 r: S n5 b' s& H Positive Planes Layer 1 TO Positive Planes Layer 1
& ~( `$ X. g. J- c; H% | No Hazards.
, L6 K: o2 U, C4 z' ?% _# R( b2 q, {3 g
Positive Planes Layer 1 TO Route Border' ^2 ?3 {9 p* m: b3 A, a
No Hazards.- r' m$ a! R" s
+ n& e9 E; ]6 c/ O6 T2 ~; \. w1 m Positive Planes Layer 1 TO Traces Layer 1+ G: b0 W4 W# i
No Hazards.
# D, b$ t) p |- h0 ]* G* w2 t; D( m/ J7 z- H; M' x
Positive Planes Layer 1 TO Plane Obstructs Layer 1
0 n. k+ I) m& q6 X$ X8 B No Hazards.
1 s+ x V8 w8 W E# b
" O( e+ a6 e8 V2 q( q* P Positive Planes Layer 1 TO Via Pads Layer 1; O1 f8 o% l" B+ H0 M
No Hazards.
0 C Y. ?1 S' o" M, ~& l9 t4 ~
0 ` v1 d: }7 W, L( C" e Positive Planes Layer 1 TO Via Holes Layer 1
# ~1 `+ i# |* j! T+ c No Hazards.
7 z5 W M$ ^- F3 A: g; @, N$ \. n% o+ d
Positive Planes Layer 2 TO Part Pads Thru Layer 2' r) w0 U- l9 m0 f! A, w: ]
No Hazards." N! d! v6 z' l# ?" V
5 k) A# J6 f) y4 U. w. u
Positive Planes Layer 2 TO Part Holes Layer 2
) [+ J, H' t) {8 _- j: S0 d No Hazards.
3 \! B8 s C; v$ j9 t
. K+ q& i* F: y# V8 D5 g Positive Planes Layer 2 TO Route Border0 `1 g* N/ d- d2 v
No Hazards. ~7 d& P( H" H. l
$ |, [1 O7 p5 k: ? Positive Planes Layer 2 TO Via Pads Layer 2$ x1 `- l% h1 `7 M" L! L
No Hazards.
0 [1 w! \$ O/ p: W, }0 [$ ^. ?1 C$ F1 i
Positive Planes Layer 2 TO Via Holes Layer 2
# q% C' ^1 u4 f$ Q No Hazards.0 F( p5 X7 n$ v' A
5 A" J' w" q4 {( ^4 s6 n/ j! J' `$ c Positive Planes Layer 3 TO Part Pads Thru Layer 36 {8 f8 x; U6 _- L" q0 o
No Hazards.8 X, @% P' y) ^
2 P/ f8 ]! I8 K0 O- @2 X Positive Planes Layer 3 TO Part Holes Layer 3 U9 O! k9 P: \
No Hazards.
/ J4 p7 ]- a7 Y' H7 Y/ k6 j, n* ^; C5 a0 {
Positive Planes Layer 3 TO Positive Planes Layer 3! m8 J4 t% M# F7 A+ |
No Hazards." ]1 j5 W1 G$ b' D+ q1 u7 t
& A* r6 a3 [0 Q, P
Positive Planes Layer 3 TO Route Border Z O: U% I9 m, C# I' s
No Hazards.+ v! P5 H/ G" [/ ~8 Y% g
8 J# I1 g4 s8 f- [
Positive Planes Layer 3 TO Traces Layer 3
u7 T F: Z0 s ]+ F- c: G No Hazards.! `. D8 p, p6 {, D5 e' Y
# m- [) z0 |# e) Z8 c; {8 s
Positive Planes Layer 3 TO Trace Obstructs Layer 3/ S1 }( ]! Z! K: T3 B$ T: u
No Hazards.
# }, \: L9 T4 Q: E( S1 L+ W( Z5 k: D
, s+ q$ W I, k* U0 K Positive Planes Layer 3 TO Via Pads Layer 3
% m5 {4 T8 \& E2 ^7 _- r No Hazards.
, W1 E4 B- d- A8 W& B3 T, T
3 H) p# t. I) g" y$ d* [ Positive Planes Layer 3 TO Via Holes Layer 3
) \: q+ A/ N( C/ D No Hazards. ^# S+ ?& m' ?+ U7 B( b. e4 u
# i0 F0 U3 f p1 o F* d Positive Planes Layer 4 TO Part Pads SMD Layer 45 Q2 J* u! Z1 R9 E& V9 V
No Hazards.
" G0 |2 f. R0 O3 }/ T/ W7 V
( I, T4 l7 n: z7 P( }, j Positive Planes Layer 4 TO Part Pads Thru Layer 4
( t+ y' J7 L5 y4 ~8 I; l No Hazards.9 R- W3 J! `) _: |
: ~) D5 l9 A- B0 N Positive Planes Layer 4 TO Part Holes Layer 4
! a9 ]2 _( Y; A5 i; Z& [, g) j! }" C No Hazards.' g1 u* \' A" b( W) [' O5 A
3 g# W+ B/ y& R6 ~# h# }& V
Positive Planes Layer 4 TO Positive Planes Layer 4
$ X7 T, Y1 _ \ No Hazards.0 k g' O+ ]0 J
1 A/ O. a) N8 d5 _0 i2 d
Positive Planes Layer 4 TO Route Border6 \: w. h0 R6 k, t. J8 ^* [) C% C2 |
No Hazards.+ ~, ^- @6 H' M0 ~, Q' `5 S
+ j9 C' S# j( l% H: g
Positive Planes Layer 4 TO Traces Layer 42 e% p1 c1 H0 m" N! Z, n# v
No Hazards.# u4 U1 M- k! H8 ]4 @% s% \" ^5 ?
' L% m2 U( K. _% ] V
Positive Planes Layer 4 TO Plane Obstructs Layer 4
9 @0 P6 I$ m& F2 T) E; k3 J; I% ^% G No Hazards., H. s) @+ a3 u0 T! C
6 Z: f0 d) A) s- G# j' u
Positive Planes Layer 4 TO Via Pads Layer 44 i% t6 [0 A, W; u6 k" ]% a; O7 J
No Hazards.
# r) g" ^6 Q& ?; e; ~! r$ z, n+ ^$ J! W& L2 D8 z
Positive Planes Layer 4 TO Via Holes Layer 4
4 f/ {, o. V6 |/ ~4 }" b No Hazards.: l, s* y2 ~" v6 y$ D
J" h7 H- Q( Q: v" e" |4 y- q8 U+ B) x6 Y5 M
Total Hazards Found : 0 a8 {, r; o2 A, Z% D) Y
4 \, ~* @8 b7 v' W0 @" o! m0 E* _
; d0 \! ~$ f9 B9 \7 b% z- O9 p+ C; G
% Z4 M: ^- X4 P5 G' h6 Q Non-Net Class Element To Element Clearances And Rules
) @3 e/ ~7 h }( q: _ -----------------------------------------------------, Z5 k- o7 a, w2 U& t! @4 ^
8 T( W( r3 X& a$ h( c! S Route Border TO Via Pads Layer 1 Clearance: 0mm
6 l/ ]0 Y( t" v) W2 q+ E w No Hazards.' W3 ?+ q7 p5 r7 a) X, f. e
1 S' h1 Q: ^/ X/ |0 } Route Border TO Traces Layer 1 Clearance: 0mm8 Q9 }& c* A" B: V
No Hazards.
, c6 e8 m1 l" o: @) X" H. C' c7 X+ F; B4 a* `/ ?
Part Pads SMD Layer 1 TO Route Border Clearance: 0mm
5 r0 }) i7 h9 s4 j$ i- m; M No Hazards.' b% M" L8 L: f! }! l
( z7 P8 F0 ~! a- f# m, t4 J
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm0 q. A& k. H- ^& S+ S2 M0 g% W* o( i9 v
No Hazards.
/ }: m" M6 x& N2 R0 Q& s9 w c$ e7 T7 g; p8 ? R( g
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm
3 V, j+ F) v1 Z5 a$ ?, ? No Hazards.
$ s6 o4 g5 K7 B) O. R2 _( b+ p. _. K' j) S% @0 |8 ?6 H
Board Outline TO Via Holes Layer 1 Clearance: 0mm
0 w$ I# X6 ?. [, T3 ] No Hazards.( ~" ^2 K7 m: A0 {: X& J4 K4 U
" D+ h& G0 P# W3 T ~8 t
Board Outline TO Via Pads Layer 1 Clearance: 0mm! \- C, ~8 E2 M, K+ X' E
No Hazards.
3 a$ _" ?& C- U- Y: ?, r; l- J+ N0 |
Board Outline TO Part Holes Layer 1 Clearance: 0mm' H/ \! t+ |1 s- ~! g" O! H
No Hazards.
- H; d9 K; Q7 f" D2 e% c9 n3 E, s S) n+ x
Board Outline TO Placement Outlines Layer 1 Clearance: 0.25mm; h& h0 ]: d$ h1 R/ Z4 f3 d- ]
No Hazards.( B5 _9 I: P; d! A
& d) N6 U3 c# P3 S1 Y9 Q Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm
# K! P- ]7 R0 W No Hazards.
3 S5 k& Z, k7 E: r: ?* ]) R/ f! I2 e6 o* ~7 R% A+ x/ i. L
Board Outline TO Traces Layer 1 Clearance: 0mm8 B+ P/ x/ _4 m5 F" x
No Hazards.
' s* V5 U( o0 d& x4 Z
/ `' k3 @$ c6 Y3 S$ `- T Route Border TO Via Pads Layer 2 Clearance: 0mm
, d6 h3 d" f; l0 R% Z7 a: |1 A! @ No Hazards.3 W0 z: r7 M5 k
4 S& V! G, Z: y$ S" Z) u7 \0 M Part Pads Thru Layer 2 TO Route Border Clearance: 0mm! t& v; C% _4 m) t5 _' p- F( I
No Hazards.& L' n3 B, Z4 A4 H" G% J
' T$ W, A t6 x' l; [
Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm3 j3 h5 q: J4 J; d7 n; w0 y
No Hazards./ f. T8 U2 n: _. z% R0 v( k6 S8 Y
4 Q9 M+ n3 I, g. P* [ Board Outline TO Via Holes Layer 2 Clearance: 0mm
$ P. B$ I! g+ N( d- T7 s0 b/ m No Hazards.
. G% z8 U/ L8 C# N% E
( Z+ W, L; c) u2 Q Board Outline TO Via Pads Layer 2 Clearance: 0mm
& O% G* T- V0 E6 K! ]3 R No Hazards.
- v; M2 K+ a7 c! T# m& l
- _. q/ V5 N+ z9 l* I" F1 A Board Outline TO Part Holes Layer 2 Clearance: 0mm
: `2 J9 b* e. E* O; B) S& Y d1 @ No Hazards.. I: s1 N6 \" r2 _( L( I- U$ g
$ m x% l2 U1 J; Q7 K2 `; F# O; A% m
>> Via Obstructs Layer 3 TO Via Pads Layer 3 Clearance: 0mm% ^" m+ Y- }, }& m3 _8 A- f; u
Hazards Found : 66 D8 K- u, [$ M3 D
* w5 C( G0 G) n/ w- ]
>> Via Holes Layer 3 TO Via Obstructs Layer 3 Clearance: 0mm
+ n ], n |3 @! x% x6 \ Hazards Found : 6 H6 m6 Z6 W& q0 _$ K# u' J
$ m6 A' N5 q" S$ y" \$ P5 J >> Traces Layer 3 TO Trace Obstructs Layer 3 Clearance: 0mm
, N2 Z" g0 u4 t6 V, I- R/ p+ o. X Hazards Found : 16 S' i0 \6 F: K5 H$ D
1 ?, n4 @: d1 V* ]) H/ B
Route Border TO Via Pads Layer 3 Clearance: 0mm
" Q! _4 z2 d: Y No Hazards.
0 e( t. h% O) K% x. t7 \* N: ~
) {$ O* k" L# ^ Route Border TO Traces Layer 3 Clearance: 0mm
6 J2 U k( q" w& C/ e t No Hazards.
" p# T: L0 {) {* ~' J8 R6 }/ @/ Y- \1 T- d9 {2 ]& W" O
Part Pads Thru Layer 3 TO Route Border Clearance: 0mm' A: y3 ^ H2 Y0 y" z# r
No Hazards./ x) {- o: y3 }. o9 N- E
% f& }8 l7 A! W# j" i7 j0 h
Board Outline TO Part Pads Thru Layer 3 Clearance: 0mm
9 Y% g. V8 j0 |# }0 ]+ P7 w% @* q No Hazards.& O1 F" K- j/ q* v9 w3 ?3 u
: j+ x- h$ Z# v
Board Outline TO Via Holes Layer 3 Clearance: 0mm( Q4 x' j4 J1 N2 s0 n, U7 a
No Hazards.
8 r! J) y7 Y/ T( }7 Q1 m+ p$ s8 e7 z1 i" ^
Board Outline TO Via Pads Layer 3 Clearance: 0mm
2 X( R$ |( y8 y( }( [$ ^- O No Hazards.9 H# A" |2 N9 x, q$ ~- O! E4 b8 U
9 O8 t0 {8 L6 ? E; W1 c' A/ t
Board Outline TO Part Holes Layer 3 Clearance: 0mm
3 u1 K9 C9 s9 k- i) q# } No Hazards.
9 d# X( r& A6 G8 _, E( v, z" w; e( B) ^5 Z! V
Board Outline TO Traces Layer 3 Clearance: 0mm; I5 D6 @; j$ o3 }
No Hazards.# u; A( P2 u c( E$ j4 J7 V
9 J \% k" I* J5 c, [6 f+ ~ Route Border TO Via Pads Layer 4 Clearance: 0mm2 P* K! P6 a' @
No Hazards.
7 Y) a& u- |& O/ P: g: B: ]- v" j& t. d/ G3 y2 X$ E
Route Border TO Traces Layer 4 Clearance: 0mm' @6 l ?! Q" c. T
No Hazards.+ c' n& I, i; s! u
$ c1 A& [5 G) y6 D3 O Part Pads SMD Layer 4 TO Route Border Clearance: 0mm+ J0 x) f0 {# `, H% |
No Hazards.
6 |6 `* J: M0 x* R1 t! o+ {! f; t* l: [+ q& O# a: q
Part Pads Thru Layer 4 TO Route Border Clearance: 0mm: H2 i2 w- e1 p0 M% d
No Hazards.
0 {* E' i3 Z2 o" c) L: g# }+ {; |4 u F- _
Board Outline TO Part Pads Thru Layer 4 Clearance: 0mm
! H2 N4 J& g3 [9 J6 r1 v( o No Hazards.
7 \# C) P# j) k& M
/ N8 J( t( O0 L$ x% X Board Outline TO Via Holes Layer 4 Clearance: 0mm; B% k/ O7 r6 w$ Y4 R
No Hazards.- g4 N' O; {3 G/ O0 w$ w: l& S
% l" z6 v7 O( n! w4 K' Y# ?
Board Outline TO Via Pads Layer 4 Clearance: 0mm
4 \4 i* O1 U4 \, d1 ^& z8 J% ? No Hazards.( k! T% ]" B! \* b
% }. w$ A/ H" O8 o% V Board Outline TO Part Holes Layer 4 Clearance: 0mm( Y& t7 x7 H" d7 N/ `
No Hazards.; d3 {1 Y/ Y! N1 X3 \: K$ _2 _
6 t. V) N; q" e* q) O% h3 O. m Board Outline TO Placement Outlines Layer 4 Clearance: 0.25mm
( Y; Q4 I+ z5 R( a" H8 H4 H/ i No Hazards.2 l. f, E/ j6 l
4 S! f7 D. l+ B8 o+ o& M( C+ b" O Board Outline TO Part Pads SMD Layer 4 Clearance: 0mm1 G5 Z% i; {' @
No Hazards., j Z( _% x, U" u* T/ o% [
9 w6 f$ ~! b5 \9 x X Board Outline TO Traces Layer 4 Clearance: 0mm
7 g; _0 [) J, P0 E0 b3 l# L No Hazards.
# K. t- \" P$ Y( ~, i1 }9 z! }. z! `7 K1 c# ^
1 n9 a6 L1 _. d0 m
Total Hazards Found : 13
8 A' V1 T6 ~- q6 H" b- g% I" U; A
5 ]2 s! N7 F$ d
0 R Q: d) r' M! v- X" {0 }
4 R* _. p9 Y) u4 s* f7 c Total Proximity Hazards Found : 13
( m: @0 @# U7 \+ l B4 |( B6 H6 ?
+ u. ]6 v, w- S3 p- g
. c$ Y; M: B1 x7 v
) i+ l2 x* v7 @! M# T ----------------------------: d3 }9 g% r2 ?) f' N/ |. X" u7 X
CONNECTIVITY & SPECIAL RULES
: n# h1 _. F0 @ ----------------------------
6 i5 Q3 R* `4 n. r/ T( O3 t& s, c" h2 m; C% F
) P Y2 f* B! b: o! J' k& Q Check For Unplaced Parts : YES; C6 f* }3 C/ Q: {
No Hazards./ C, \# | }6 D3 y7 e2 b% C
) Y: O- i0 T$ j5 ~2 J( T
8 v1 T$ B7 A2 M1 E; q1 C6 M- a6 C0 ]
Check For Missing Parts : YES
* I0 y! S- _: c- L No Hazards.
( C. a4 f. V) I+ b& `" t& x! n. S: t' ?2 a6 o; y" v% N
# _6 ^2 s% k+ u$ ~ g6 J' q/ n
Check EP Component Hazards : YES% ?7 M8 W8 Y7 B
No Hazards.
' Z5 [( q+ W0 b! [; J# C
$ u# j( O$ P1 r; b$ a$ r" ~
( m; C, [* a( c! f% c0 _ Check Trace Hangers : YES
4 \5 e) R0 Y- S& P. Q8 } No Hazards.0 a9 [% a7 D( [
/ C4 @6 P' R9 e& B
5 f1 w+ [3 Y! S: O1 p, Q3 D% v Check Trace Loops : YES+ `$ S4 G* t6 K7 {& D U' i
No Hazards.
9 G! w0 j6 k3 d+ S/ g6 F- h5 k* W; j& t
0 j7 ~8 N0 p1 J. }/ ^2 w6 _ Check Trace Widths : YES9 w5 [% i- \0 f' `" c6 P: f6 p+ i
No Hazards." e- d9 x) m. ?
/ ~& H. l: [* e& y& I+ f# |, P" J
, E9 E1 L+ s0 B$ X4 p/ ^" B Check Single Point Nets : NO
! `9 a# M; p% f$ H o2 q8 Z
$ O8 ^% j6 z, } O9 Z
; b( N! G: v& W7 E" i0 j0 f$ [ Check NonPlane Unrouted/Partially Routed Nets : YES' i' ]# P: f: I: E) Y
No Hazards.
2 K& h& G% @ W; Y
$ q, I. ~- O7 r. R1 c
0 V: ~( b/ a# X Check Plane Unrouted/Partial Routed Nets : YES
- \. e9 r" e1 K! X: ^6 ^5 k No Hazards.4 b8 n" R x; g, a4 q
# l1 C1 W' J' h* V9 c
' N* T- n% t1 U G9 v Check Routed Plane Pins : YES
) k) }( R Q5 S+ W3 v No Hazards.0 c. I1 d1 v: N- h$ }( O+ v0 B: K
. S/ J7 M- q+ |4 ^$ {/ D& z1 A
% Z$ ?/ U L& [4 Y p4 c0 T% Q Check Plane Islands : YES/ f; a9 ]! B* D5 w
No Hazards.
) l; V# S) O+ U) {7 t4 ^* j! a; R1 M r6 t8 E1 i0 k
4 @2 H6 ^1 G0 e
Check Dangling Vias/Jumpers : YES
$ D$ h: g. w7 p# E: L. d No Hazards.
+ @: A1 b1 w1 \7 C" @ x. x1 l N9 j
) A! g( O: B! Z6 ]5 k+ D
Check Unrouted Pins : YES
* {, x- x8 _( p( j" u- z No Hazards.
3 p- l+ M) B8 @4 A* O) B, ?' t2 ]& K; K5 ^ q3 J2 |% b1 I
' i/ u3 J1 i, u Check Routed Non-Plated Pins : YES/ c) A! V: o- r2 a$ i- E R
No Hazards.
" Z* T ^0 z/ C/ j
% U0 P9 u# ?; {1 h4 U" p* l: M) Q; s% I+ \& b+ O; o+ [
Check Minimum Annular Ring : NO
5 R5 r- J+ h2 T" `- z J1 P5 ?5 i3 ~
9 T6 P( A3 u2 M; g, g) P Check For Vias Under SMD Pads : YES+ x; r3 u N5 g" W2 N, Q
No Hazards.
$ ~+ f' \ z5 {) Z
* t+ d+ V$ L; D9 L, K1 y- e% s$ d0 o# p! ]
Check For Vias Under Top Place Outlines : YES
( P' q9 h% Y3 M$ x Hazards Found : 25
. Y, I+ W: J( h _3 b+ r, _8 J& w1 Y7 W+ x
) f' x* I$ m8 l6 W% ` Check For Vias Under Bottom Place Outlines : YES0 e/ @$ g3 W, Y; ^6 {% U
Hazards Found : 11
2 n# J* v# ]) y4 d( U
- \- ?$ [* W+ z& M4 w. v
. h2 j' i! f6 u& ? Check For Missing Conductive Pads : NO
- D" R$ \' z5 }! |3 Y- @7 |( Q I( G- D2 k+ K4 d
# D9 @: P2 t$ u8 v! j( _5 q
Check For Missing Part Soldermask Pads : NO- g1 y2 m# O' V' A; [
0 O- g* s" a5 ~* K. m
% O& F2 y% K; L0 W! ^ Check For Missing Via Soldermask Pads : NO4 L( @( }: v( F( I6 `
* K; F5 w% K l! l/ i
4 }& d8 x7 j' O! n- |) [' k
Check For Missing Solderpaste Pads : NO' b7 \; J5 d- d5 T! o/ t) [
$ b# h" u4 g7 l V7 n7 E# F% t4 \
! V- ?6 P5 _3 F, _6 E6 \
9 Q; j) A9 Y: F9 o; v
Total Connectivity/SpecialRules Hazards Found : 36& V- ^, j/ i9 u+ {" |7 u
" k( y8 J9 ]) c, p Z& j, j& v
e8 @" h: e2 Z' v, s1 j. U* W
2 H" o0 A$ z* `& h ====================================================================, M# [0 U- q. f5 H3 n1 s
) S) n j3 V5 n2 D; ^4 @0 c2 u
( Z+ T+ e* b$ l0 E$ r" r! W
2 S b8 g( ?8 B& s% s5 { Total DRC Hazards Found : 499 c* Y- l7 S; ~
& k3 Z- s8 L7 U2 u5 r8 v2 r
/ V y$ {" g' R. Y* H" w4 p
7 q! ^; Y/ l+ f& j- T+ S 04:46 PM Thursday, April 16, 2015 |
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发表于 2015-4-16 17:04
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