静电领域的主要术语名词广义认知：electrostatics, electrostatic charge, ESD

Copper_Hou

就半导体制造为代表的微电子产业而言，“Electrostatics”才是比较全面涵盖静电相关的技术性问题，相比之下“ESD”涉及的范围只是一部分。

Definitions Review

Electrostatics: Electrostatics is the study of electric charges at rest. (referred to IEEE digital library)

Electrostatic charge: also called as static electricity. it refers to electric charge at rest. (referred to glossary document of ESD ADV1.0)

ESD: Electro-Static Discharge, it refers to the rapid, spontaneous transfer of electrostatic charge induced by a high electrostatic field. (Note: Usually, the charge flows through a spark between two bodies at different electrostatic potentials as they approach one another). (referred to glossary document of ESD ADV1.0)

Relations and Differences

Based on the above definitions, electrostatics is the broadest term to cover all aspects related with electric charges. And the plasma processes in microelectronics manufacturing industries could be also included.

The industrial problems induced by electrostatics usually are caused by the movements of electric charges by the influence of the high electric fields.

Regarding the term of ESD, it is just one branch in electrostatics which is one kind of particular case of rapid transfers of electric charges by high electric fields.

The Broad sense of the industrial Problems of electrostatics in microelectronics manufacturing industries

To the broad sense to look into nowadays microelectronics manufacturing industries, the industrial problems caused by electrostatics could involve ESA, ESD, EFM and PID.

-The problem of ESA (Electro-Static Attraction) group usually includes particle contaminations, process deviations by the effects of ESA.

-The problem of ESD (Electro-Static Discharge) group usually refers to the microelectronic device failure caused by ESD events.

-The problem of EFM (Electric Field induced ions migration) group usually occur in the field sensitive microelectronics devices while the ions migrate within devices under the influence of the high electric fields. EFM usually induce problems of CD (Critical Dimensions) failures or electrical leakage of microelectronics.

-The problem of PID (Plasma process Induced Damage) group usually refers to the insulating dielectrics (such as gate oxide layer, interlayer) failures caused by plasma effects.

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解决ESD问题要对设备进行分类，以做到不同类型设备不同处理方式:
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一类设备:金属结构设备，金属外壳接大地。包括两中情况:·一种是通过系统接地线接大地;·另一种是通过电源内的PE线接大地。
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二类设备:金属结构设备，外壳不接大地。如MP3播放器等。

三类设备:塑胶结构设备