Solutions:6 Y) ], |+ }' e0 ^9 ~7 `3 x
(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible9 ]( I0 M4 p; y# A' I2 p
(2)Low-inductance decoupling capacitors B6 K$ i# O; w; z. f(3)Multiple, very short power and ground leads in packages f, \+ `* h l(4)On-chip decoupling capacitance