Solutions:4 ]2 J2 B" M0 w# l) \7 d
(1)Closely spaced adjacent planes for the power and ground distribution with as thin a dielectric between them as possible , {$ M( o5 ~+ o: I9 y. ~* |! h(2)Low-inductance decoupling capacitors4 }4 M1 B' o8 m* f
(3)Multiple, very short power and ground leads in packages& l, e& J( H* u: } j
(4)On-chip decoupling capacitance