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PCA DFM and DFT GUIDE
% p1 j7 I. w. K1 A F: G1. Purpose This document defines Fabrication, Assembly and ICT/FBT Testability Guidelines for PCB (Printed Circuit Board) and PCA (Printed Circuit Assembly) for Foxconn CMMSG.. 2. Scope This document is to be used by Foxconn CMMSG Research and Design Department to assist in the design of Printed Circuit Boards for improving the manufacturability of the PCB Fabrication and the PCA Assembly. The information provided is only a guide and will not always be achievable based on Engineering requirements, Customer requirements and density of designs. 3. Reference Documents- t. I/ K0 _2 p7 S
3.1 Document Precedence The following order of precedence is defined should a conflict exist in the design requirements for a given product. 1. Customer Requirement 2. Design Requirements as Dictated by R&D Engineering 3. This Guideline 4. IPC Specifications . R1 q; E4 b9 `* c- h: |3 z
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发表于 2020-8-17 13:48
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