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1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil
3 \- e" A% |" q( I F2)END LAYER与BEGIN LAYER一样设置, K9 W( o1 D9 ?8 c
2)DEFAULT INTERNAL尺寸如下: ?. q) o, Q, e" T, l% g" Q
其中尺寸如下:/ v6 x2 \2 I# ~- F
DRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL & P/ V% t4 v8 W# {
Regular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil)
# \0 j$ B! N2 v0 ERegular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)
. M) z, P$ G* Y; z; P5 E* VThermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍)) K, @% e; ]$ D/ S
Anti Pad = DRILL_SIZE + 0.76mm /30MIL 0 T8 a7 G5 O' V. Y) U$ B
SOLDERMASK = Regular_Pad + 0.15mm /6MIL * B& N! N" @" T1 l5 m: Q: J" A" R& P
PASTEMASK = Regular Pad (可以不要)
$ A" `/ N( \: L0 P: a•Flash Name: TRaXbXc-d
- T9 [9 o' S# i4 \其中:7 b. u: H& O% t0 u" m
a. Inner Diameter: Drill Size + 0.5mm/16MIL
5 H& U( s" d( H! T9 m3 K( Y" O( ub. Outer Diameter: Drill Size + 0.76mm/30MIL2 t& A) Z* ^/ {5 G: O/ ?
c. spokes:
8 L' W. n3 R3 `' Y8 e7 @( r0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
x5 l" `- a( Z5 ]/ s# D0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)
5 s9 _- K+ f( d0 y' F, [0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm)
; b# _0 h, H: X0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm), c) F z5 ^" d' r7 I, ~4 K# V
1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上)# E% ~1 A! e6 f+ C4 H$ n3 {; }" m
也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。. Q2 F( ?3 \& z
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