|
1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil
* B2 i6 B/ Z, I: @% G2)END LAYER与BEGIN LAYER一样设置5 J. C! Y4 R- x5 p9 e8 y- Q
2)DEFAULT INTERNAL尺寸如下( P) R# S0 ~, e
其中尺寸如下:
5 S2 o; t" j& G, {* t3 }! W _DRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL
4 T6 `* v- r, kRegular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil)
% f: F, I% p- [* }* SRegular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)/ G2 Y- m6 x3 R
Thermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍)+ G* X7 f, {+ n) h; z9 l
Anti Pad = DRILL_SIZE + 0.76mm /30MIL 4 S& i; I$ j& v( a9 i1 ^
SOLDERMASK = Regular_Pad + 0.15mm /6MIL
. M r& P: u, m3 J. g0 f5 H1 n- MPASTEMASK = Regular Pad (可以不要)- P" r& D: s+ m
•Flash Name: TRaXbXc-d + h* \5 |9 m$ ]. ^
其中:9 N' w/ l& g4 M6 R/ V, ^
a. Inner Diameter: Drill Size + 0.5mm/16MIL
- Q3 {$ D: o3 D I8 U |b. Outer Diameter: Drill Size + 0.76mm/30MIL* \4 r& z; V" a; H6 ?* G
c. spokes:
+ h( g4 J. o$ A# I$ B( q" j: p2 g0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
- k8 K0 T+ H% F, H- Q0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)
, z: ?, d& t, W( o/ f* v0 b1 q0 a0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm)
" T2 g+ H9 D$ c$ k0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm)
2 i6 U' H2 H" l+ p- [, p 1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上)
+ B" U, n1 b, ]* K8 E2 S7 j也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。8 p2 [7 w; i" o2 a/ x) z3 w6 I! K
|
|