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作品名：[AD 16][2层]多通道模拟信号采集板（LTC2051HVIMS8）PCB源文件" T0 E X, x) ?6 z4 g
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文件描述2 N1 h" ?! c" Z v2 K- ]
1. 作品用途：多通道模拟信号采集板6 k0 e' n, C# Z9 u, R. m: F
2. 软件版本：AD 16
6 D$ w+ V* C6 o4 Y3. 层数：2层板
9 |* S& f) x4 v% F- n u4 ~# r: K5 J4. 用到的主要芯片：LTC2051HVIMS87 S8 s/ O6 `: \) W) v$ Q5 B% m/ v
5. PCB尺寸：55mm*47mm) k, y5 W* K( O
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作品截图如下：
+ x! e2 O- w) {- b# W; m顶层截图：8 W. n+ b# L H+ s" z
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* R& _0 n8 g$ F底层截图：
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全层截图：: k' g# u8 m. y/ g
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叠层信息截图如下：, w% P" D$ C3 I' r6 {0 s8 X3 s' a
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BOM：& X9 Y0 W& B2 M: C( \/ d5 ~3 f5 g
| Comment（属性） | Designator（位号） | Footprint（封装） | Quantity（数量） | | 104 | C1, C2, C3, C4, C5, C6, C7, C9, C10, C12, C13, C17, C19, C20, C23, C24, C26, C39, C43, C44 | CC1608-0603 | 20 | | 105 | C8, C15, C18, C22, C27 | CC1608-0603 | 5 | | 103 | C11, C14, C16, C37, C38 | CC1608-0603 | 5 | | 22pf | C21, C25 | CC1608-0603 | 2 | | 273 | C28, C36 | CC1608-0603 | 2 | | 562 | C30, C31, C32, C33, C34, C35 | CC1608-0603 | 6 | | 106 | C40, C41, C42 | CC2012-0805 | 3 | | 1N4007 | D1 | SMA | 1 | | MBR340 | D2 | CR2012-0805 | 1 | | 10K | R1, R19, R30, R40, R47, R49, R50, R51, R52 | CR1608-0603 | 9 | | 510K | R2, R3, R4, R5, R6, R7, R8, R9, R17 | CR1608-0603 | 9 | | 33K | R10, R11, R12, R13, R14, R15 | CR1608-0603 | 6 | | 68K | R16 | CR1608-0603 | 1 | | 200K | R18 | CR1608-0603 | 1 | | 62K | R20 | CR1608-0603 | 1 | | 100R | R21, R22, R23, R24, R25, R26, R27, R28, R36, R37, R41, R42, R44 | CR1608-0603 | 13 | | 47R | R29 | CR1608-0603 | 1 | | 20K | R31 | CR1608-0603 | 1 | | 120R | R32 | CR1608-0603 | 1 | | 3K | R33, R34, R35, R38, R46, R48 | CR1608-0603 | 6 | | 1K | R39 | CR1608-0603 | 1 | | 10R | R43 | CR1608-0603 | 1 | | 100R | RA1, RA2 | RA1206 | 2 | | LTC2051HVIMS8 | U1, U2, U3, U4, U5 | 8uMAX | 5 | | ZA50DB3-22.1184MHz | U6 | ZA50 | 1 | | MAX485EESA | U7 | SO8 | 1 | | C8051F340 | U8 | TQFP-48 | 1 | | ADUM1200BR | U9 | SO8 | 1 | | SGM2019-3.3YN5G/TR | U10 | SOT-23-5 | 1 | | USBLC6-2SC6 | U11 | SOT23-6 | 1 | | CY7C68013A-56PVXC | U12 | SSO-G56 | 1 | | AT24C64CN-SH | U13 | SO8 | 1 | | ADM660ARZ | U14 | SO8 | 1 | | JA100-24MHz | Y1 | XTAL | 1 |
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附件：6 w, T7 c( h* D1 U$ z1 H, ]
PCB源文件如下：
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发表于 2020-2-19 14:59
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