[allegro16.6][2层] 一个小系统参考板（KE06Z128VLK4_LFP_0+CH340G+TJA1041）原理...

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; P& r8 [! g( X" |[allegro16.6][2层] 一个小系统参考板（KE06Z128VLK4_LFP_0+CH340G+TJA1041）原理图和pcb文件
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1. 作品用途：一个小系统参考板
# T9 W4 x0 Y! ]; s6 n: S; r4 j6 s2 K2. 软件版本：allegro16.6
! c8 u: C; z: ~9 _3. 层数：2层
4. 用到的主要芯片：KE06Z128VLK4_LFP_0+CH340G+TJA1041
1 _7 ^6 V$ {( X! ~, r5. pcb尺寸： 3937.008*3937.008 MIL
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作品截图如下：
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. I6 M, @) N$ _2 k2 H- T0 B/ H顶层截图：
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底层截图：

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全层截图：
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Bill of Material Report (Condensed)
SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS	QUANTITY	REFDES
名称	类型	属性	类别	数量	位号
603	CAP_NP_0603_DISCRETE_22PF	22PF	DISCRETE	2	C16; C17
603	CAP_NP_0603_DISCRETE_0.1UF	0.1UF	DISCRETE	5	C19; C21; C23; C31; C34
603	CAP_NP_0603_DISCRETE_1.0UF	1.0UF	DISCRETE	5	C20; C22; C24; C32; C33
603	CAP NP_0603_0.1UF	0.1uF	IC	15	C36; C37; C39; C40; C43; C45; C46; C47; C48; C49; C50; C51; C52; C54; C59
603	CAP NP_0603_4.7UF	4.7uF	IC	1	C38
603	CAP NP_0603_22PF	22pF	IC	2	C41; C42
603	CAP NP_0603_100PF	100pF	IC	5	C53; C55; C56; C57; C58
603	RES_0603_DISCRETE_1.0M	1.0M	DISCRETE	1	R33
603	R_0603_100K	100k	IC	1	R63
603	R_0603_91K	91K	IC	3	R64; R66; R67
603	R_0603_10K	10K	IC	16	R65; R68; R69; R70; R71; R72; R73; R74; R75; R76; R77; R78; R79; R80; R81; R83
603	R_0603_4.7K	4.7K	IC	1	R82
805	CAP NP_0805_10UF	10uF	IC	2	C35; C44
805	INDUCTOR_0805_INDUCTOR	INDUCTOR	IC	1	L1
CON2X10_2P54_TH	CONN_HDR_10X2_CON2X10_2P54_TH_I	CON_2X10	IO	1	J2
CON5_USB_B_UBB_120	USB_MINI_B_SKT_0_CON5_USB_B_UBB	USB_MINI_B_SKT_0	IO	1	J6
CON_SKT2X8_TH	HDR_2X8_M_CON_SKT2X8_TH_IO_CON	CON 2X8	IO	1	J16
DC_3P	PHONEJACK STEREO_DC_3P_PHONEJAC	PHONEJACK STEREO	IC	1	J5
DO_214AC	BAT54/SOT_0_DO_214AC_BAT54	BAT54	IC	1	D1
DO_214AC	BAT54/SOT_1_DO_214AC_BAT54	BAT54	IC	1	D2
DO_214AC	BAT54/SOT_3_DO_214AC_BAT54	BAT54	IC	1	D6
DO_214AC	BAT54/SOT_2_DO_214AC_BAT54	BAT54	IC	1	D7
HEADER2X10_2_54	JTAG_0_HEADER2X10_2_54_JTAG	JTAG	IC	1	U9
HEADER2_2_54	LED_HEADER2_2_54_LED	LED	IC	3	D3; D4; D5
HEADER2_2_54	FUSE_HEADER2_2_54_FUSE	FUSE	IC	1	F1
HEADER2_2_54	CONN_HDR_2_HEADER2_2_54_IO_CONN	CONN_HDR_2	IO	3	J11; J12; J15
HEADER3_2_54	CONN_HDR_3_HEADER3_2_54_IO_CONN	CONN_HDR_3	IO	3	J7; J8; J14
HEADER12_2	CONN FLEX 12_HEADER12_2_12864	12864	IC	1	J9
LQFP80_0P65_14X14MM	KE06Z128VLK4_LFP_0_LQFP80_0P65_	KE06Z128VLK4_LFP_0	IC	1	U13
SO8	TJA1021_SO8_TJA1021	TJA1021	IC	1	U11
SOIC_8X7_9MM	W25Q32_SOIC_8X7_9MM_W25Q32	W25Q32	IC	1	U8
SOIC_8_6MM	24C02_SOIC_8_6MM_24C02	24C02	IC	1	U7
SOIC_14	TJA1041_SOIC_14_TJA1041	TJA1041	IC	1	U10
SOP_16	CH340G_SOP_16_CH340G	CH340G	IC	1	U6
SOT23_6	MP2359_SOT23_6_MP2359	MP2359	IC	1	U12
SOT_223	LM117_0.3_SOT_223_LM117_3.3	LM117_3.3	IC	1	U5
SW2_0306	SW2P_0_SW2_0306_IC_SW2P_0	SW2P_0	IC	4	SW2; SW3; SW4; SW5
TPAD_030	TESTLOOP_TPAD_030_IO_TPAD_030	TPAD_030	IO	3	TP1; TP2; TP3
XTAL_5_08	XTAL_XTAL_5_08_XTAL	Xtal	IC	2	Y2; Y3

附件：
原理图和PCB文件如下：

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