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[AD 10][6层]TI处理器PCM1864DBTR的音频处理板(PCM1864DBTR+LVC1G125+LVC1G126)...

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发表于 2020-1-16 17:25 | 只看该作者 |只看大图 回帖奖励 |倒序浏览 |阅读模式

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作品名:[AD 10][6层]TI处理器PCM1864DBTR的音频处理板(PCM1864DBTR+LVC1G125+LVC1G126)原理图和PCB源文件& o0 ^9 m! Z9 [& F8 R0 e; W
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文件描述6 e6 R% t; I2 |$ K: ~2 D/ [
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1. 作品用途:TI处理器PCM1864DBTR的音频处理板
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2. 软件版本:AD 103 @4 t* p# V5 ?* U
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3. 层数:6层板
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4. 用到的主要芯片:PCM1864DBTR+LVC1G125+LVC1G1260 v' y7 z1 G) A2 F; o
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5. PCB尺寸:半径:37.5mm
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作品截图如下:
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底层截图:
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全层截图:* Z* x, K8 z5 l* i9 Y$ `

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. G8 e( _, d$ p  |) _7 ^# [* x叠层信息截图如下:
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BOM:
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Comment(属性)Designator(位号)Footprint(封装)Quantity(数量)
GRM188R71C104KA01DC1, C2, C3, C4, C5, C6, C7, C17, C23, C25, C29, C31, C37, C390603L
14
GRM21BR71A106KE51KC8, C9, C10, C11, C12, C13, C14, C15, C16, C18, C19, C20, C21, C22, C30, C32, C33, C34, C35, C360805_KTR
20
GRM188R71C105KA12DC24, C26, C38, C400603L
4
GRM1885C1H180JA01DC27, C280603L
2
3.3VD1LED_LTST-C171
1
BIASAD2LED_SMLP12_BLUE
1
BIASBD3LED_SMLP12_BLUE
1
FiducialFID1, FID2, FID3Fiducial10-20
3
M3H1, H2, H3, H4BuildingFastener_MPMS_003_0005_PH
4
24438H5, H6, H7, H8Keystone24438
4
DNPJ1CONN_PEC04DAAN
1
Master/SlaveJ2Sullins_PBC02SAAN
1
USB-I2XJ3Sullins_PPPC082LJBN-RC
1
3.3V-USBJ4Sullins_PBC02SAAN
1
DSPJ5TSW-110-07-G-D
1
PBC02DAANJ6Sullins_PxC02DAAN
1
BIASAJ7Sullins_PBC02SAAN
1
BIASBJ8Sullins_PBC02SAAN
1
SPH1642HT5H-1MIC1, MIC2, MIC3, MIC4, MIC5, MIC6, MIC7, MIC8Knowles_SPH1642HT5H-1
8
MMBT2222AQ1, Q2SOT-23
2
RC0402FR-0749R9LR1, R2, R3, R4, R6, R7, R8, R9, R10, R11, R12, R13, R16, R17, R19, R21, R40, R41, R42, R43, R45, R46, R49, R50, R51, R52, R54, R55, R56, R57, R59, R60, R61, R620402L
34
ERJ-3EKF1002VR50603L
1
CRCW04022K21FKEDR14, R15, R27, R28, R29, R30, R36, R37, R38, R390402L
10
CRCW0402360RJNEDR180402L
1
ERJ-2RKF1000XR20, R530402L
2
CRCW06030000Z0EAR22, R23, R24, R25, R26, R31, R32, R33, R34, R35, R44, R480603L
12
CRCW04022K15FKEDR47, R580402L
2
SNT-100-BK-GSH1, SH2, SH3, SH4SNT-100-BK-G
4
GNDTP1TestPoint_50x20-TH
1
3.3VTP2TestPoint_50x20-TH
1
SCLTP3TestPoint_50x30-TH
1
SDATP4TestPoint_50x30-TH
1
GNDTP5, TP6, TP27, TP28, TP29, TP30, TP51, TP52, TP53, TP54TestPoint_50x30-TH
10
BIAS1TP7TestPoint_50x30-TH
1
BIAS2TP8TestPoint_50x30-TH
1
BIAS3TP9TestPoint_50x30-TH
1
BIAS4TP10TestPoint_50x30-TH
1
IN1+TP11TestPoint_50x30-TH
1
IN2+TP12TestPoint_50x30-TH
1
IN3+TP13TestPoint_50x30-TH
1
IN4+TP14TestPoint_50x30-TH
1
IN1-TP15TestPoint_50x30-TH
1
IN2-TP16TestPoint_50x30-TH
1
IN3-TP17TestPoint_50x30-TH
1
IN4-TP18TestPoint_50x30-TH
1
D1ATP19, TP20TestPoint_50x30-TH
2
D2ATP21, TP22TestPoint_50x30-TH
2
CLKATP23, TP24, TP25, TP26TestPoint_50x30-TH
4
BIAS5TP31TestPoint_50x30-TH
1
BIAS6TP32TestPoint_50x30-TH
1
BIAS7TP33TestPoint_50x30-TH
1
BIAS8TP34TestPoint_50x30-TH
1
IN5+TP35TestPoint_50x30-TH
1
IN6+TP36TestPoint_50x30-TH
1
IN7+TP37TestPoint_50x30-TH
1
IN8+TP38TestPoint_50x30-TH
1
IN5-TP39TestPoint_50x30-TH
1
IN6-TP40TestPoint_50x30-TH
1
IN7-TP41TestPoint_50x30-TH
1
IN8-TP42TestPoint_50x30-TH
1
D2BTP43, TP46TestPoint_50x30-TH
2
D1BTP44, TP45TestPoint_50x30-TH
2
CLKBTP47, TP48, TP49, TP50TestPoint_50x30-TH
4
PCM1864DBTRU1, U2DBT0030A_N
2
LVC1G125U3, U5, U7DCK0005A_N
3
LVC1G126U4, U6, U8DCK0005A_N
3
9B-24.576MEEJ-BY1TXC_9B
1

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" V  T2 D! D1 i6 O; Y) v9 V原理图和PCB源文件如下:- |% r* O5 ?, _: G
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