EDA365欢迎您登录!
您需要 登录 才可以下载或查看,没有帐号?注册
x
作品名:[AD 10][8层] TMS320C6713BGDPA200+DS26C31TM做的一个无线板子PCB和原理图: C$ Z$ i% q b' F
% y9 D/ i* I& g, d; z2 m' g
文件描述
2 X7 A; l) r4 H" T: J1. 作品用途:无线板子( Z* o* ]& l2 r" _
2. 软件版本:AD 10/ ^( L- T( k# ~0 I9 K
3. 层数:8层板, ^; \; h' @, t4 I z! O# Q
4. 用到的主要芯片:TMS320C6713BGDPA200+DS26C31TM+XC4VLX25-10SF363I+TPS70302PWP
) |2 {4 t, W, G; Y" \: p5. PCB尺寸:75.5mm*87mm
, c9 M1 @8 g4 o) m8 W) h* _. \, p* P
作品截图如下:5 D; o5 B9 v6 a, M
顶层截图:2 S8 w5 t& V# E* y3 b
1 i! O1 ^! A, b2 i( I" y! s
5 ?7 T% {' k8 `& @. J: e底层截图:
4 B, @8 v: I! J+ _& p
; p8 Y* j# F7 L; Y( [& `
2 u7 }5 U7 | [5 L' E2 R' W全层截图:
+ ?7 |$ L! U) q8 a' C
2 e: d/ C4 W( `9 R/ F1 H
! z6 ` K/ g6 Z
叠层信息截图如下:" }; L5 |# }* L( w* J( E( |* i3 i" f
5 G/ ^; I+ V% x% f6 ]
& R3 I( K) Q" t) VBOM:
, e$ P+ x3 E9 ^! A6 v( i: L) `Comment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | 10uF | C1, C7, C8, C11, C12 | 1210-3225 | 5 | 1uF | C2, C15, C16, C99 | 1608[0603] | 4 | 10uF | C3, C4 | 6-0805_N | 2 | 0.22uF | C5, C6, C9, C10 | 1608[0603] | 4 | 0.1uF | C14, C18, C19, C20, C21, C22, C24, C25, C26, C27, C28, C29, C31, C32, C33, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C44, C51, C52, C53, C54, C55, C56, C57, C58, C59, C60, C61, C62, C63, C64, C65, C66, C68, C69, C70, C71, C72, C73, C74, C75, C76, C77, C78, C79, C80, C81, C82, C83, C85, C86, C87, C88, C92 | 1608[0603] | 63 | 0.01uF | C17 | 1608[0603] | 1 | IN4007 | D1 | DO-41 | 1 | SMBJ40(C)A | D2 | SMB | 1 | 68uH | L1 | LGC2ADO1608 | 1 | 33uH | L2 | LGC2ADO1608 | 1 | RF JTAG | P1 | HDR1X6 | 1 | Header 9 | P1-2 | HDR1X9 | 1 | Header 7X2 | P2 | SMD_Head_2*7_1.27 | 1 | MHDR1X3 | P2-3 | PIN3 | 1 | Header 3X2 | P3 | HDR2X3 | 1 | Header 15 | P5-2 | HDR1X15 | 1 | Header 2 | P6, P7 | HDR1X2 | 2 | 1/0.5A | R1 | 3216-1206 | 1 | 4.7K | R2, R5, R15, R21, R22, R23, R24, R25, R26, R29, R30, R31, R32, R33, R34, R35, R36, R37, R50, R51, R52 | 1608[0603] | 21 | 30.1K | R3, R6, R10, R12 | 1608[0603] | 4 | 31.6K | R4 | 1608[0603] | 1 | 147 | R7 | 1608[0603] | 1 | 51.1K | R8, R11 | 1608[0603] | 2 | NC | R9, R13, R18, R19, R20 | 1608[0603] | 5 | 1K | R14, R27, R66, R83, R84, R87, R88, R89, R91, R92, R94 | 1608[0603] | 11 | 10K | R16, R17, R28, R62, R64, R65, R70, R71, R72, R73 | 1608[0603] | 10 | 33 | R38, R39, R40, R41, R42, R43, R44, R45, R46, R47, R48, R49, R53, R54 | YC164 8P4R-0603 | 14 | 0 | R55, R56, R57, R58, R59, R60 | 1608[0603] | 6 | 33 | R61, R63 | 1608[0603] | 2 | 470 | R81, R82, R95, R96 | 1608[0603] | 4 | 330 | R85, R86, R90, R93 | 1608[0603] | 4 | 33Ω/50V | RV1 | 0805-2012 | 1 | TMS320C6713BGDPA200 | U1 | 6713 BEIYONG | 1 | MHF2805S | U1-1 | MHF2805S | 1 | TPS70302PWP | U1-2, U1-3 | TPS70302-TSSOP24 | 2 | SM29LV160 | U2-2 | SM29LV160 | 1 | MAX706TMJA | U3 | CERDIP-8 | 1 | XCF08PVO48C | U4 | VO48_N | 1 | DS26C31TM | U5 | CLCC-20 | 1 | DS26C32ATM | U6 | CLCC-20 | 1 | AX8052F151 | U7 | AX8052F151 | 1 | LT1763-1.8 | U8 | PDFN-12 | 1 | MT48LC8M32B2 | U9 | TSOP-86 | 1 | XC4VLX25-10SF363I | U10 | SF363 | 1 | 50M | XO1, XO2 | 7050 | 2 | 5 J( N6 X0 J3 V0 C( ]4 E2 k
附件:
3 n3 [9 ?$ _: g, y" [7 [) |原理图和PCB源文件如下:
$ H( g+ C ?( P
4 R |2 k6 D# c1 ?5 F4 t, T# }1 W& J* ?+ p$ C$ R
|