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［书籍］Digital Techniques for High-Speed Design
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' E# D0 Q: ]( S. L$ V目录
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I. INTRODUCTION.
W% u7 P9 V0 n* E2 y6 m/ b1. Trends in High-Speed Design.
1 T# P$ U) G- W3 J7 R' c. u2. ASICs, Backplane Configurations, and SerDes Technology. / x& S$ r: h- R
3. A Few Basics on Signal Integrity. / k. r+ o) Z4 m( S8 P( U
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II. SIGNALING TECHNOLOGIES AND DEVICES. 5 r$ I% b/ Q' I5 b
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
1 W% w" s% _# A/ j; S$ @; k5. Low Voltage Differential Signaling (LVDS).
! n7 y \; P6 G6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
0 \" ^1 u, w0 Q$ w7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
+ |% @0 E/ ?- p0 {5 k* N- q, ] j8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
% _9 F, o3 q; Z9 H E/ D9. Current-Mode Logic (CML). $ A: P" N& ?* r3 y: c3 y# ^
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. & b! _& i5 [1 s
11. Fiber-Optic Components.
8 g, G; {6 k6 I# F12. High-Speed Interconnects and Cabling.
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III. HIGH-SPEED MEMORY AND MEMORY INTERFACES. , Z6 b- D9 A& H# B3 a* [6 E% y
13. Memory Device Overview and Memory Signaling Technologies.
6 w6 O: j, a# ?! b- W# o5 [7 c" I14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. g& m, d o8 F) H2 v" _
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM. % `8 ^' M9 C5 Q+ N0 }* \
16. Quad Data Rate (QDR, QDRII) SRAM. 6 W2 O2 n5 o. v+ X. u6 c3 k
17. Direct Rambus DRAM (DRDRAM). 0 }$ Z$ ` b6 D, @4 u: O( `) L' A0 k
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
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2 ?) U) I8 r! a5 ^1 s4 nIV. MODELING, SIMULATION, AND EDA TOOLS. 2 ?; h r- \, f u3 f r
19. Differential and Mixed-Mode S?Parameters.
. P5 C7 u0 P9 _2 v20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
/ u2 u2 p& V% T( z21. Modeling with IBIS. # I$ g* Y, H! [& M8 s1 Z9 A8 _% ?
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout. 5 v0 l) R, R* g( B, r* z% O
+ m! q# U6 L# |2 wV. DESIGN conceptS AND EXAMPLES. 0 ]8 q8 ]( |1 T& O8 D
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. i( y! e9 o1 `( d6 e8 p
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Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. # I+ g! M8 v* M8 I+ ~, C
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers. * ?; r- q3 A# X3 t* p$ F7 V
25. Designing with LVDS.
$ h% k/ ~# c3 V$ E26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers. ' F" {- w! K1 {% s" m4 Q! V. \" L
27. WarpLink SerDes System Design Example.
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, c. J1 {: y4 C2 T# TVI. EMERGING PROTOCOLS AND TECHNOLOGIES. ' _ C( E2 [, q9 w0 _; }! T6 G# L# w
28. Electrical Optical Circuit Board (EOCB).
% f4 o1 a; T2 @29. RapidIO.
6 }5 x5 I, J% x( ~" j/ t+ T3 W7 c30. PCI Express and ExpressCard. * ^2 u5 w3 y r% t% t, b
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VII. LAB AND TEST INSTRUMENTATION. 3 [4 Z# ]' a3 B: h
31. Electrical and Optical Test Equipment. ( @+ }2 u1 G* W* L
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[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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