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[书籍]Digital Techniques for High-Speed Design
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& H. z1 Y9 e" K$ m9 g目录' s+ b: s4 G& n1 j2 E7 c& S
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I. INTRODUCTION.
+ E" z h! I) y# b$ U1. Trends in High-Speed Design. 4 t$ h& @; ?# ]
2. ASICs, Backplane Configurations, and SerDes Technology. ! L5 f9 `0 Z# T" ]$ Z( g0 u
3. A Few Basics on Signal Integrity.
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& }7 p: Y8 L* [0 [. LII. SIGNALING TECHNOLOGIES AND DEVICES. $ l1 M7 w0 u) D! Q% s
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+). ( S4 z8 {& i1 i# Y, O* r
5. Low Voltage Differential Signaling (LVDS).
- A2 H* y! L! v6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
) b! }% n! H/ N7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
/ `) `6 q% R8 S6 R8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm). " t& v2 E* A6 y/ R+ b
9. Current-Mode Logic (CML).
4 K' Q5 f: ~4 N7 d2 S, i R10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. : R2 l# ?3 T* @! ` H
11. Fiber-Optic Components.
1 n- H$ P" e2 d, K! w12. High-Speed Interconnects and Cabling.
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' J3 K+ C' e% B, s( UIII. HIGH-SPEED MEMORY AND MEMORY INTERFACES. . \6 n2 K* h. q, F' u/ l4 `
13. Memory Device Overview and Memory Signaling Technologies. - L5 s) j! P! z0 Q
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation. 5 r* e) E- ^+ _' A% ^. S1 j
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
g6 a$ E/ e) [2 G16. Quad Data Rate (QDR, QDRII) SRAM.
. S, V1 O1 u/ f6 p17. Direct Rambus DRAM (DRDRAM).
0 U- P, g. H# A% P18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR. : r, V& ^; s' K/ n6 j% p
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IV. MODELING, SIMULATION, AND EDA TOOLS.
$ x7 D- O2 l7 u19. Differential and Mixed-Mode S?Parameters. 1 |; y1 i! {5 s
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. * o8 b/ [ e. d0 w8 c
21. Modeling with IBIS. 4 i. d% i4 V( h( |- i
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.
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, y. @" ?# g# @) G( i) n, kV. DESIGN conceptS AND EXAMPLES. 6 w# \( s4 q7 T' k; w3 I
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.
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Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
% u. {' M1 H: d5 X24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
4 p- p& d8 E, q+ I5 k25. Designing with LVDS. & }* d5 u# Q- R# J2 S+ _! t
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers. ' t- F# N' X y- t- e5 r; z% m* O
27. WarpLink SerDes System Design Example.
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3 d3 t7 U4 K$ e6 w/ JVI. EMERGING PROTOCOLS AND TECHNOLOGIES. ! Y* Z* A6 V( F( l! I# a
28. Electrical Optical Circuit Board (EOCB). ) T1 L/ ^9 o Z6 Y
29. RapidIO.
5 d+ }, B" R& V2 O' d30. PCI Express and ExpressCard. 6 w2 Q$ N4 O9 Z$ a/ }0 T
4 f' t0 z- p4 N" NVII. LAB AND TEST INSTRUMENTATION. 6 \( E$ l2 O4 a! D1 n% u
31. Electrical and Optical Test Equipment. ' N8 @# m0 u, p3 j
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[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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