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[AD 10][6层]BeagleBone Black开发板设计(TPS65217C+SN74LVC1G06DCK+TL5209)原理...

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发表于 2019-12-26 10:11 | 只看该作者 |只看大图 回帖奖励 |倒序浏览 |阅读模式

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作品名:[AD 10][6层]BeagleBone Black开发板设计(TPS65217C+SN74LVC1G06DCK+TL5209)原理图和PCB源文件
文件描述
1. 作品用途:BeagleBone Black开发板设计
2. 软件版本:AD 10
3. 层数:6 层
4. 用到的主要芯片:TPS65217C+SN74LVC1G06DCK+TL5209
5. PCB尺寸:86.5mm*54.1mm
作品截图如下:
顶层截图:
底层截图:
全层截图:
叠层信息截图如下:
BOM:
Comment(属性)Designator(位号)Footprint(封装)Quantity(数量)
10uF, 10V
C1, C2, C4, C7, C8, C9, C10, C11,  C12, C13, C14, C15, C39, C40, C55, C62, C77, C95, C96, C118, C122, C126,  C133, C153
805
24
0.1uf, 6V3
C3, C20, C27, C28,  C29, C30, C31, C33, C35, C36, C37, C38, C41, C42, C43, C44, C45, C46, C47,  C48, C49, C50, C51, C52, C53, C54, C56, C57, C58, C59, C60, C61, C63, C64,  C65, C66, C67, C68, C69, C70, C71, C72, C73, C74, C75, C76, C78, C79, C80,  C81, C82, C83, C84, C85, C86, C87, C88, C92, C93, C94, C97, C98, C99, C100,  C101, C102, C103, C105, C106, C107, C108, C109, C110, C111, C112, C113, C114,  C115, C116, C117, C119, C120, C121, C124, C127, C128, C129, C130, C131, C132,  C135, C145, C147, C149, C150, C152, C154, C155, C158, C159
402
100
2.2uF, 6V3
C16, C17, C18, C125,  C144, C146, C148, C151
402
8
470pF, 50V
C19, C136
402
2
18pF, 50V
C21, C22, C25, C26
402
4
1uF, 10V
C24, C89, C90, C91,  C104, C134
402
6
1nF, 50V
C32, C123
402
2
100uF, 6V3
C34
RD205SMD_250D
1
15pF, DNI
C137, C138, C139,  C140
402
4
0.022uF,10V
C141
402
1
30pF, 50V
C142, C143
402
2
47pF, 6.3V
C156, C157, C160,  C161, C162, C163, C164, C165, C166, C167, C168, C169, C170, C171, C172, C173
402
16
598-8170-107F
D1, D2, D3, D4, D5
LED_0603
5
IP4283CZ10-TT
D6, D7
TSSOP10
2
RB751V40,115
D8
SOD323
1
150OHM800mA
FB1, FB2, FB3, FB4,  FB5, FB7
SM-7351-IND-0805
6
0.1 Ohm, 0805
FB8
SM-7351-IND-0805
1
HEADER 6
J1
SIP6
1
2.2uH, 2.6A
L1, L2, L3
2520
3
PJ-200A
P1
CONN3-PWR-PJ102A
1
CTI JTAG,DNI
P2
HEADER10X2_SMD
1
USB-A Conn. -  87520-xx1xx
P3
USB_A_SH
1
mini USB-B
P4
USB5MINI_4SHIELDED_SMD-5
1
WE_7499010211A
P5
RJ45-7499010211A
1
10118241-001RLF
P6
CONN19_HDMI
1
FEMALE HEADER  2x23
P8, P9
HEADER23X2
2
MOLEX  502570-001
P10
SD-MICRO-SCHA5B0300
1
DMC56404
Q1, Q2
SMINI6-F3-B
2
100K, 1%
R1, R56, R65, R66,  R67, R68, R76, R77, R78, R79, R80, R82, R83, R84, R85, R86, R87, R88, R89,  R94, R95, R165
402
22
1.5K, 1%
R3, R4, R97, R112,  R113, R114, R119, R146, R147
402
9
0R, 1%
R5, R6, R7, R8, R19,  R20, R27, R49, R50, R51, R137, R142, R149, R159, R160, R161, R162
402
17
0R, 1%, DNI
R9
402
1
470K, 5%
R10
402
1
280K, 1%
R11
402
1
820, 5%
R12, R71, R72, R73,  R74
402
5
10K, 1%
R14, R52, R53, R54,  R96, R98, R100, R101, R102, R103, R104, R105, R106, R107, R108, R109, R110,  R111, R115, R116, R117, R118, R135, R145, R148, R150, R151, R152, R153, R154,  R155, R156, R157, R158
402
34
1M, 1%
R17
402
1
33, 0402
R18, R21, R28, R45,  R46, R47, R48, R167
402
8
49.9, 1%
R22, R120, R121,  R122, R123
402
5
4.75K, 1%
R23, R24, R25, R26,  R163, R164
402
6
100K, 1%, DNI
R55, R57, R59, R69,  R81, R90, R91, R92, R93
402
9
100K, 1%,DNI
R58, R60, R61, R62,  R63, R64, R70
402
7
100
R75
402
1
240, 1%
R99
402
1
10, 1%,DNI
R124
402
1
100, 1%
R125, R126, R127,  R128, R129, R131, R133, R134, R138, R139
402
10
470, 5%
R130, R132
402
2
0.1, 0805
R136
805
1
0R, 1%,DNI
R140
402
1
1M, 1%,DNI
R141
402
1
10, 1%
R143
402
1
12.1K, 1%
R144
402
1
27K, 1%
R166
402
1
PTC_RXEF010
RT1
POLYSW200-5638-310
1
KMR231GLFS
S1, S2, S3
SW4SMD_63X161LS
3
TPS65217C
U2
U_48_RSL
1
SN74LVC1G06DCK
U3
DCK5_2P15X1P4
1
TL5209
U4
SO8-25X75
1
IC_AM335X_ZCE_1
U5
AM33XX_15X15
1
SN74LVC1G74DCTR
U6
SOP8_DCT
1
24LC32A
U7
SOT23-5
1
TPS2051 (DGN)
U8
DGN-16X60
1
TPD4S012
U9, U10
U_6_DRY
2
TDA19988
U11
QFN64S9X9P5
1
MT41K256M16HA  -125:E
U12
BGA96_T9_P8_9X14
1
eMMC, 2GB
U13
BGA153_P14_P5_11P5X13
1
LAN8710A
U14
QFN32_5X5MM_EP3P3MM
1
SN74LVC2G241
U15
U_8_DCU
1
32.768kHz
Y1
XTAL4_126-216SMD
1
24MHz
Y2
XTAL150SMD_125X196
1
25.000MHz
Y3
XTAL150SMD_125X196
1
24.576MHz
Y4
OSC4_61X65LS_79X98SMD
1
附件:
原理图和PCB源文件如下:
. k2 U/ W* l% A0 K: t0 [
[AD 10][6层]BeagleBone Black开发板设计(TPS65217C+SN74LVC1G06DCK+TL5209)原理图.zip (2.54 MB, 下载次数: 1)

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