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作品名:[AD 6][2层]IP话机主板(DAP1902+IP173+DVFD8185AE1ABC)PCB源文件 : w5 _+ F6 L' R6 w
文件描述 1. 作品用途:IP话机主板 2. 软件版本:AD 6 3. 层数:2层板 4. 用到的主要芯片:DAP1902+IP173+DVFD8185AE1ABC 5. PCB尺寸:93.5mm*83mm 2 c4 e/ q% m" z8 s( f0 M
作品截图如下: 顶层截图:
; M7 H2 ^" X2 x. h f! k底层截图: 全层截图: 8 F* y, s% }/ b" P# m6 p& L2 N: M$ A* ^
叠层信息截图如下:
' Z( i) y: Y4 l3 x' F' XBOM: Comment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | Comment | | ESCENE | 1 | 0.1U | C1, C3, C4, C7, C8, C12, C13, C14, C30, C31, C32, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C44, C45, C46, C47, C48, C49, C50, C51, C54, C55, C56, C57, C59, C60, C61, C64, C66, C68, C71, C76, C93, C94, C115, C116 | 0402 | 45 | 100pF | C2, C5, C6, C78, C79, C81, C82, C83, C84, C85, C89 | 0402 | 11 | 100u | C9, C25, C28, C96, C120 | 6*7 | 5 | 22u | C10, C16, C20, C21 | 0805 | 4 | 15pF | C11, C15 | 0402 | 2 | 47u | C17 | 6*7 | 1 | 10u | C18, C22, C23 | 0805 | 3 | 10pF | C24, C26 | 0402 | 2 | 220nF | C27 | 0402 | 1 | 20p | C29 | 0402 | 1 | 1u | C52, C58, C67 | 0603 | 3 | 2.2nF | C65 | 0402 | 1 | 27pF | C69 | 0402 | 1 | 22pF | C70, C74 | 0402 | 2 | 56nF | C72, C73 | 0402 | 2 | 330pF | C75, C77 | 0402 | 2 | 220pF | C92, C95 | 0402 | 2 | 220p | C97 | 0402 | 1 | 390p | C103, C104, C105, C106 | 0603 | 4 | 2.2u | C201 | 6*7 | 1 | 390p | C230 | 0402 | 1 | LED | D1, D3 | 0603-LED | 2 | 1N5820 | D201, D202 | DO-214AB | 2 | HEADER 3X2 | H1 | 3X2IDC2.54MM | 1 | 4 HEADER | H101, H102 | JACK4PW | 2 | RJ45 | H103, H104 | LW8P8C | 2 | Header 10 | H105 | 10X1IDC2MM | 1 | CON18 | H106 | 18X1IDC2MM | 1 | SPK | H107 | CON2A | 1 | CON3 | H108, H109 | MIC_PHONE_CON3 | 2 | DC +5V | H110 | DC-005C | 1 | CON6 | H111 | USB-111B | 1 | 2.2uH/3A | L1 | INDUCTOR_SMD3 | 1 | 6.8uH | L2 | L350_SMD | 1 | MLB-321611 | L3 | 1206 | 1 | 2SB1386 | Q1 | SC-62 | 1 | BC848A | Q201 | SOT-23 | 1 | BCW68G | Q202 | SOT-23 | 1 | 1K | R1, R30, R34, R38, R39, R44, R48, R63, R68, R267 | 0402 | 10 | 100K | R3, R4, R6, R26 | 0402 | 4 | 2.2K | R7, R10, R61, R69, R264 | 0402 | 5 | 4.7k | R8, R11, R19, R24, R25, R32, R56, R57, R58, R59, R80, R89, R90, R91, R92, R93 | 0402 | 16 | 470K | R9 | 0402 | 1 | 33 | R12, R14, R15, R16, R17, R18, R28, R37, R40, R41, R45, R75, R201, R202, R203, R204, R205, R206 | 0402 | 18 | 100 | R13 | 0603 | 1 | 3.3K | R20, R21, R22, R23, R35, R43, R66, R266 | 0402 | 8 | 10K | R27, R29, R36, R67, R265 | 0402 | 5 | 0 | R31, R42, R268 | 0603 | 3 | 470 | R33 | 0402 | 1 | 430K | R46 | 0402 | 1 | 330K | R47 | 0402 | 1 | 6.19K 1% | R51 | 0402 | 1 | 0 | R60, R70, R71, R72, R73, R74 | 1206 | 6 | 390 | R62, R64 | 0402 | 2 | 10k | R94 | 0603 | 1 | 300 | R95, R156, R157, R158, R159, R160 | 0402 | 6 | 49.9 | R118, R119, R120, R122, R123, R124, R125, R126 | 0603 | 8 | 75 | R171, R172, R173 | 0603 | 3 | HR601680 | T1, T2 | SO-16W | 2 | LM1117MPX-3.3 | U1 | SOT-223 | 1 | DVFD8185AE1ABC | U2 | TFBGA196 | 1 | IP173 | U3 | QFN64 | 1 | DAP1902 | U4 | QFN68 | 1 | PAM2301 | U5 | SOT23-5 | 1 | HY57V281620HCT | U6 | TSOP-II54 | 1 | ES93 | U7 | SO-8 | 1 | W25Q64BV | U8 | SOIC8 | 1 | IP_POE | U101 | IP_POE200 | 1 | 25MHz | X1 | XT_SMT | 1 | 13.824Mhz | X2 | XT_SMT | 1 | ) ?4 O! R O+ P+ B
附件: 原理图和PCB源文件如下:
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