介绍一下全志A13芯片处理器的相关参数

mytomorrow

7 B4 M2 f, {8 G. }( lA13处理器是一种基于ARM Cortex-a8的平板处理器，它对于性能更高(ManyCore Lite)、功耗更低、系统整体更低的android平板来说更具竞争力。正如Android4.0.3的大脑一样，A13使得多任务处理更加顺畅，应用程序加载得更快，你触摸到的任何东西都会立即响应。更重要的是，eLQFP176中有A13Kage与音频编解码，和2分R-TP集成。

A13芯片特点：

  z) L6 E  E1 B  d' BCPU
 ARM Cortex-A8 Core
; T. ?, F0 X( A& U ARMv7 Instruction set plus Thumb-2 Instruction Set
' Q% s- t- C4 j$ ?8 C 32KB Instruction Cache and 32KB Data Cache
 256KB L2 Cache
5 D, W! N0 F) m/ @  l. r NEONTM SIMD Coprocessor
. H% S% u6 b" W. { Jazelle RCT Acceleration

GPU
4 k8 d) h7 S0 E5 Q# E3D Graphic Engine
8 `* V6 F0 z2 a; E3 i0 m5 R---Support Open GL ES 1.1/ 2.0 and Open VG 1.1
9 x" p" d8 k3 N8 D3 ?
  `8 L# d: `# ^2 }) I9 h/ zVideo Engine
Video Decoding (FULL HD)
, t2 M8 ]* a1 W9 {---Support multi-format video decoding, including VP6/8, AVS, H.264, H.263, MPEG-1/2/4, etc
---Up to 1080p@30fps resolution in all formats
Video Encoding
, u/ r$ o- ^; @& e2 J/ n. I9 X, \---Support encoding in H.264 MP format
---Up to 720p@30fps resolution
1 c3 {# n- s) `! P
* S: N( ?' w! x9 N4 M4 MDisplay Processing Ability
) A" U$ I$ B7 y' l1 M
7 @) M+ d; }! y5 CFour moveable and size-adjustable layers
* ~6 y3 z0 A0 F* e  ~+ |4 kSupport multi-format image input
Support image enhancement processor
' N5 P1 M. ~; ]3 d! t0 NSupport Alpha blending /anti-flicker
6 b- m' L/ ?# o0 d; u# _Support Hardware cursor
: B. ^# t; M: _3 a. i  HSupport output color correction (luminance / hue / saturation etc)
5 ~  z# i) a9 H$ n2 k$ ?
8 a; s4 W' H9 [( P% D9 uDisplay Output Ability
! _/ i8 c6 M+ J4 Y* ?7 @1 ULCD inteRFace (CPU / Sync RGB )
8 p/ S; e2 P" e: B
" A! Q" W  z1 D, T" |  D' f: c1 jImage Input Ability
7 p6 z& v: d- O( C9 @8 PSupport 8bit CMOS sensor parallel interface
Support CCIR656 protocol for NTSC and PAL
  z3 Z8 h$ p: P) r1 G
Memory
16-bit SDRAM controller
0 Q  c( p9 \* @( S, R% J---Support DDR2 SDRAM and DDR3 SDRAM
& }: p4 f; ^2 F1 s---Memory Capacity up to 512MB
8-bit NAND Flash Controller with 2 CE and 2 RB signals
---Support SLC/MLC/TLC NAND
7 d( [8 f! P4 b+ |8 x& T) f6 y; P---64-bit ECC

+ u1 w2 [) f0 w, I, uExternal Peripherals
) {1 f- ~2 R8 l. Y6 AOne USB 2.0 OTG controller for general application and one USB EHCI/OHCI controller for host application
& p7 S- _/ ^9 P6 f4 wTwo High-speed memory controllers supporting SD version 2.0 and eMMC version 4.3
Four UARTs(all with Infrared data Association[IrDA])
Three SPI controllers(master/slave mode)
Three Two-Wire Interfaces(TWI)
& ^, }) x, {5 x$ {! W+ q9 [IR controller supporting CIR remoter
, v# E; N4 S# F9 n6 J' d; }  o6-bit LRADC for line control
1 ?% D/ M9 Q: C1 ?9 c) m; {# ~, OInternal 4-wire touch panel controller with pressure sensor and 2-point touch
9 m* i) `4 p2 n3 B9 cInternal 24-bit Audio Codec for 2-Ch headphone and 1-Ch microphone

System Peripherals
/ U+ P6 i7 G4 A+ f& Z- C8 channels normal DMA and 8 channels dedicated DMA
  t! D9 q' U, F; X5 f2 GInternal 48K SRAM on chip
6 asynchronic timers, 2 synchronic timers, 1 watchdog, and 2 AVS counters
( D: O5 I1 K' ]0 i0 z
Package
 eLQFP176 package

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7 P4 D2 R7 d4 l% t% f2 V1 j& Y) GA13方框图



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