LMPA thermal cycling

Taio

THERMO-MECHANICAL TEST
PURPOSE:
, x8 O, j4 @2 a5 ?- Z2 `5 zThe thermo-mechanical tests evaluate possible failure mechanisms caused by differences in
( q& b4 @( _/ Z4 sthe thermal expansion coefficient of the different materials used in the board assembly
REFERENCE STANDARD:
+ @3 Y9 R' e( V6 p9 q& VThe test was run according to JEDEC standard JESD-A104 condition G (Temperature
, O+ Z/ c/ E  P& e1 ECycling). Temperature ramp rate is 11oC/minute.
RESULT:
 After 500 cycles:
o SnBiAg1 solder alloy
 64 units in temperature cycling
 One early failure seen after 10 cycles. Expect this is an early failure. No
% t0 }- T! R1 ~additional failures noticed till 500 cycles.
8 ?/ j. x. U# N' o4 @o LMPA-Q solder alloy
 64 units in temperature cycling
- I# |" K6 |# Z: j3 G8 d# l7 z) z+ w No failures noticed till 500 cycles.
o LMPA-Z solder alloy
$ m0 [* N: ]0 s' w 64 units in temperature cycling
; o6 G+ d/ h7 N# V* W No failures noticed till 500 cycles
# o, \1 j- p* |7 ^! t

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