LMPA thermal cycling

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THERMO-MECHANICAL TEST
. j& m5 ^2 F2 F3 d# C5 a/ \PURPOSE:
The thermo-mechanical tests evaluate possible failure mechanisms caused by differences in
' [# y' U2 l5 ]. e! }the thermal expansion coefficient of the different materials used in the board assembly
9 c/ k& O" K3 j4 O1 i$ n( \4 tREFERENCE STANDARD:
7 R1 a7 W1 b3 ]7 o0 Y5 \The test was run according to JEDEC standard JESD-A104 condition G (Temperature
; c8 R$ V0 O+ W" U7 \6 h" W, i5 p2 |Cycling). Temperature ramp rate is 11oC/minute.
% Y' I6 c, X) J: v2 YRESULT:
) P- n8 j3 u' I6 v0 L After 500 cycles:
o SnBiAg1 solder alloy
 64 units in temperature cycling
! L9 ?, R+ J+ E+ g- f One early failure seen after 10 cycles. Expect this is an early failure. No
additional failures noticed till 500 cycles.
o LMPA-Q solder alloy
2 N  {* G. e+ o 64 units in temperature cycling
 No failures noticed till 500 cycles.
# W6 s  E; G) V; \o LMPA-Z solder alloy
 64 units in temperature cycling
3 a; p6 b. d( m* i No failures noticed till 500 cycles

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