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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5. ^6 d: x8 u; }9 z! a
1.1 半导体三极管及其开关特性..................................................................................... 51 T- X9 L6 h7 w5 Q/ V1 U. Q8 R
1.2 MOS 管的开关特性......................................................................................................7* U* ~6 L; ~, x7 i
2、逻辑电平简介.................................................................................................................... 8
1 U/ T k6 x1 U+ J/ x( k5 x7 J3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
" W9 G5 V7 p1 f6 x; g% N3.1:逻辑电平的一些概念............................................................................................... 10
3 l6 Z# a5 \8 y N3.2:常用的逻辑电平....................................................................................................... 11! W7 B$ [; U9 R% l8 X2 Q" {
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11
/ j0 a$ e1 K1 H- m4、TTL 和CMOS 逻辑器件.................................................................................................... 13
( H+ R& U# x# v; n7 |1 Y4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13/ j/ d2 c/ q0 I: [: ]
4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
! M1 O7 p0 o' `2 q, J4 d4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13- K8 t7 ^! J. v8 h
4.4:包含特殊功能的逻辑器件....................................................................................... 14
; ^, E0 q3 `" D3 q0 ^, u7 y0 y4.5:逻辑器件的使用指南............................................................................................... 15: y5 ?+ u- ], |$ e' `, [
5、TTL、CMOS 器件的互连.................................................................................................. 16
0 q, o2 i% ]1 R& |" B7 F% Z6 j5.1:器件的互连总则.......................................................................................................16$ u+ l4 u& V" {) m5 Z
5.2:5V TTL 门作驱动源..................................................................................................19
8 F3 q# L7 S0 I$ y7 Y9 j+ P1 k+ d5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19
; D) K! J. D1 ~, y5.4:5V CMOS 门作驱动源................................................................................................ 19
5 W3 w0 y4 E3 E z+ {! v5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
6 ^) _" ?0 U. z6、ECL 器件的原理和特点................................................................................................... 20" \* {7 N% M: ]$ Y) g
6.1:ECL 器件的原理........................................................................................................20
/ |. t' F1 V8 \3 P6 P7 K6.2:ECL 电路的特性........................................................................................................21. b. s6 |0 T' e7 O3 E0 e
6.3:ECL 器件的使用原则................................................................................................ 22
; |& A# L+ F. p3 W- |3 [9 j7、GTL 器件的原理和特点................................................................................................... 23
8 B" ^7 c+ ?8 p7.1:GTL 器件的特点和电平............................................................................................ 23
: a0 ~- O* @( o- b6 I$ r `3 k7.2:GTL 信号的PCB 设计................................................................................................ 24
, s, y3 G' H: r7 {: Z+ z7.3:GTL 信号的测试........................................................................................................25
: b0 ~& O4 \8 U4 j7.4:GTL 信号的时序........................................................................................................25
7 j; _/ s; L8 B8 H8 HSTL 电平......................................................................................................................... 25$ d! Q/ o* o0 J! g5 m
8.1 基本定义..................................................................................................................... 25
' w& h1 V( V r% |- J' N, L1.2 HSTL 分类.................................................................................................................... 26
! g& [9 d( E. b8.3 HSTL 特点及SSTL .....................................................................................................26
2 {& d$ h# K' Q# k3 B- H0 i$ B9 PECL、LVPECL 电平........................................................................................................... 27; [( h, g9 ^6 B* Z) W" N9 {
9.1:PECL/LVPECL 器件的原理和特点............................................................................27
8 p& m [, a) x$ {6 g) \: B9.2. PECL/LVPECL 电平输出结构................................................................................... 27: ?3 q) h$ _$ V _7 K8 I$ t4 p! g
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
3 |: ^$ j) p4 r+ w& y0 K G$ ?' N10 CML 电平......................................................................................................................... 30
" e* ~2 n0 H' T1 I1 [10.1. CML 接口输出结构............................................................................................... 301 J5 K2 _% s8 @! ^& d6 z
10.2 CML 接口输入结构...................................................................................................30
7 d- \/ f( ~4 E( o10.3 CML 电平的输出门和输入门的特点: ....................................................................31
4 m* z! D; S' h' Z5 e11. LVDS 器件的原理和特点.......................................................................................... 32+ L4 G/ \" M# x4 X
11.1:LVDS 器件简介........................................................................................................32
6 a1 K' Q& P$ U. u11.2 LVDS 器件的工作原理.............................................................................................. 33" c6 o: Y; Q- u7 N. A3 r, `" h
11.3 LVDS 输入输出结构.................................................................................................33
; s9 j$ W1 \ k; ^5 s11.4 LVDS 电平的特点...................................................................................................35* e9 B/ X& N' C, J z
12. CML LVPECL LVDS 简单比较及互连......................................................................... 358 v* y( d2 W r) g( \
12.1 CML LVPECL LVDS 简单比较..............................................................................35) C$ L) u3 ^7 A9 j. {1 u
12.2 CML LVPECL LVDS 的互连综述..........................................................................38
3 I6 k! v! e1 {" H$ V7 O12.3 LVPECL 的互连........................................................................................................39
' o# W' e8 y4 T8 A12.4 LVDS 的互连............................................................................................................441 I6 Z$ A) X5 m7 J, m
12.5 CML 的互连..............................................................................................................457 q, ]9 Z* B, [
附录:.................................................................................................................................... 47
( p7 N6 Z7 L' z附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47! n% S; B' ]6 w- G% [9 f% R
附录2. CMOS 门电路及其特点.................................................................................... 59 G8 Q" l8 R- w4 f' P
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