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PCB Stackup and Layer Order中:2 R( t/ J/ v; }# M; D1 D
Power supplies with high transient current should have their associated VCC planes close to the
+ \( e. W/ M1 q1 h; {; Ktop suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction
: }% v- `" t# V2 E; z6 q$ Rthat currents travel through VCC and GND vias before reaching the associated VCC and GND) @" H# o8 U4 F- R$ D
planes. As mentioned in the previous section, every VCC plane should have a GND plane
8 m: W0 B7 J6 T; e- N9 ]) kadjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents3 _$ r& {0 x& B' y# a
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the4 A8 x! M) _2 M; W
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC" w3 _" r% N* n: T5 m C+ x# i5 h
and GND planes are considered as a pair.$ l5 M! f& d5 ^: E; t1 P, t
這裡面,說的VCC,GND層到底所何放置?8 o+ f3 C2 ?: a( `8 Y6 p- ^
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发表于 2007-12-28 17:23
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