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DRC - (Final DRC)
. q# u1 r* ?4 L' K1 Q! F5 T' A -----------------
0 w' V1 M) S/ Z9 j
" r+ C" x J; }! D8 a$ m4 W 08:00 AM TuESDay, September 09, 2008
( e, s( |- l, j0 W/ l Job Name: D:\prj\080906\PCB\22V1.0.pcb, s# B. y8 B' S- {# H Y
8 k$ ]) A) `% F b3 x$ e9 v5 T y: I1 ~/ H _7 h# h
---------+ j+ o! [% C, D/ S% M# a2 ^- A
PROXIMITY5 P! T# B% |7 _- n
---------
' R* b% W ]: s9 m% w$ R: X3 \( y 6 s5 [* C# Q: I
Use DRC Window : NO$ P) l0 \7 Z4 V# m
- @2 ]; ~3 v0 {, A, F4 P7 S
! o, I8 @ A) P6 F& J8 [
Disable Same Cell Pad-Pad Checks : NO
2 i" @0 g! a% k8 ]8 |# K& ^
: m% X7 q/ t- B$ R$ o3 s9 b( G+ x& n6 r6 Y, p
Enable Same Net Pad-Pad Checks : NO9 {+ j0 B4 N1 e* b: b
& A5 S- E7 b4 x0 q, j% c. v
" a' p ^6 S2 k6 G( p) _ Layers Specifed To Check : Layer 1
, F3 [7 ]1 H3 p7 ^3 k Layer 2: b5 J3 Q8 s: f6 F
6 |2 ?; V* ]& h9 A
6 q: j$ |8 E" x) }# t7 o) W$ o, s% T8 L+ L7 j& b5 g: K
4 A3 G, j" h' ^8 ^
Net Class Clearances And Rules
+ l; A7 G5 \7 B' u. V ------------------------------
' ^4 o% J) n2 O4 w9 j: r! Q% ?1 A9 d% v9 S
>> Components Top TO Components Top, D8 r) d7 g1 Q* K
Hazards Found : 48 i% G9 r( ~5 V) G, R
7 ^& O) `! M: ^* L1 G4 l Traces Layer 1 TO Traces Layer 19 P4 E) E; X* A" O
No Hazards.0 m, G$ q% U s2 U, G& S
, V# d4 U2 V5 T3 D/ H
Traces Layer 1 TO Part pads SMD Layer 1
, ^; i8 {" J5 E5 h e No Hazards.( P+ _2 i9 U: u# J% o% R2 s& y
! y( x& C6 T9 o( T, m# n# ~ Traces Layer 1 TO Part Pads Thru Layer 1& f5 R: Y/ i; Z4 V) G
No Hazards.
- j3 K9 S- t$ C/ p$ {
% Q5 u7 U2 R. _# [- z Traces Layer 1 TO Part Holes Layer 1
' n/ z6 A. S% X9 c, U No Hazards./ p, j+ j% M! I- _: T
8 W1 N! u P o5 x0 G
Traces Layer 1 TO Via Pads Layer 1! `/ O4 Y8 X. h- Q1 T
No Hazards.6 ^% m- P' |& p! f
4 S% E1 F) W: i/ _8 ?8 ^
Traces Layer 1 TO Via Holes Layer 1
& u, S3 R& L3 P0 Z4 z No Hazards.5 Y2 N5 i0 W- L- A
2 a2 A# M/ V+ N% i, V8 c k
Part Pads SMD Layer 1 TO Part Pads SMD Layer 1 i0 r) z/ G; X3 C, k
No Hazards.
( i c! y1 @, O# T3 u
8 j! x' z" p+ G/ ~ Part Pads SMD Layer 1 TO Part Pads Thru Layer 1
! c) }3 v |6 I( g3 Q No Hazards.
; @2 m: n" {) W2 J* ]
- R; y" C0 m/ _+ Z Part Pads SMD Layer 1 TO Part Holes Layer 1' _$ z( I0 ] [$ G2 u) [( A# p" Y
No Hazards.
t3 V% B2 o1 M9 B& W
- I; a" K! n# W' S Part Pads SMD Layer 1 TO Via Pads Layer 1: d1 z1 H9 C1 O' h. N+ z
No Hazards.. d2 L" @$ r0 ?+ Y5 F4 S: m
7 f% G0 C& ~0 {& { Part Pads SMD Layer 1 TO Via Holes Layer 1
: [# O$ p& r: y8 ]$ o/ ^0 J No Hazards.- Y. J Q$ v3 p3 J
* H% z2 a' q2 s
Part Pads Thru Layer 1 TO Part Pads Thru Layer 1
M+ a% O w S; ~8 z( ^9 L No Hazards.& e$ e9 m; x) P% \
5 G$ I+ Y. C/ Z4 G
Part Pads Thru Layer 1 TO Part Holes Layer 1
9 E7 L, S" ^& L# O& u9 T; V) Z$ ` No Hazards.
, H: t* I1 E2 p- g8 D% R
5 L- c5 o6 j+ Y/ ?, R Part Pads Thru Layer 1 TO Via Pads Layer 1- S3 c: e$ S: d: D1 E5 c$ n: s. N
No Hazards.
* ~# D3 j4 b9 ~* K; a/ ?$ g, z& R: H! K/ l5 F9 O. ?. n
Part Pads Thru Layer 1 TO Via Holes Layer 1
$ l: H' ^) d- S: M- u I% H No Hazards." ]: s" D6 ?1 B& H4 R) l
* c9 F+ q9 k4 k/ M3 k* h2 C Part Holes Layer 1 TO Via Pads Layer 1
0 k/ }3 ]% O% G. j! r& S" f No Hazards.- B4 v; C$ y& X
# `! p- \6 b. g" G" M1 b' J- J2 y Part Holes Layer 1 TO Via Holes Layer 1
2 j/ C( }; J. o1 s0 z0 w2 N No Hazards.0 W" @6 i/ x2 w/ a+ c* a
* h5 x9 ~9 m9 N/ F+ J1 U Via Pads Layer 1 TO Via Pads Layer 1
8 i$ C0 E8 Y. s7 m* P1 o No Hazards.
# T# P( J4 ]$ L6 C
|; }5 D+ F7 x; L6 B" s' a Via Pads Layer 1 TO Via Holes Layer 1% I7 M; C1 |) ]! M
No Hazards.
( T4 f# @) {) e. [& j' s5 D0 [- p- r4 ^
Via Holes Layer 1 TO Via Holes Layer 1
3 |5 ]2 a' e" R9 H1 f) i7 b No Hazards.
2 g$ J' V+ ^; j9 z; J% J# a! k# z8 ^
0 J! y! `' _6 B6 B6 j Traces Layer 2 TO Traces Layer 2
8 C. @% j& o2 q No Hazards.
, [; w: |4 J" n
% \) {9 u' r% B/ y; O. t Traces Layer 2 TO Part Pads SMD Layer 20 I5 Z. u# \+ Z! l
No Hazards.+ G" i9 _" q h& C4 K) I
' m3 l. ?3 E; E0 k
Traces Layer 2 TO Part Pads Thru Layer 2
! D* @5 d1 r( H No Hazards.
1 e1 k$ x+ f# ]/ p. v; b. K
% w4 P: O- p l Traces Layer 2 TO Part Holes Layer 2
0 a2 D: M5 k* h- C0 {4 u( w No Hazards.
" o5 n1 Q+ `# N$ f! e8 S/ _6 f
! y/ C5 z. H0 D' t! z/ S Traces Layer 2 TO Via Pads Layer 2
* B% h- U1 }# r- ]' W No Hazards.3 w6 P R0 l: i1 V
3 g% t! ^$ l5 R$ e. b
Traces Layer 2 TO Via Holes Layer 2
% [8 i* j |5 a8 }# Y: \! O1 R No Hazards.
- U Y5 l/ P; F, w# W& w/ r& ]
1 r6 R4 d2 ]) x+ ^+ Y; X- I6 P; a& R Part Pads SMD Layer 2 TO Part Pads SMD Layer 2
/ P& [& r- u* ^; l3 Q5 } No Hazards.1 H6 l) k. i Z; ?' v9 Y
2 Y% c5 G7 b$ C/ ^$ q4 M Part Pads SMD Layer 2 TO Part Pads Thru Layer 2$ t S3 q! B1 M- m! ^2 G
No Hazards.
7 V9 i7 ~8 a. ~# m4 @3 _! v9 }% Y4 {0 j7 j: e5 X4 @. [: Z) J' J
Part Pads SMD Layer 2 TO Part Holes Layer 2- t7 v, T& O+ v0 i( {/ a4 r9 n( G
No Hazards.
9 ]: e, f. [& _1 @% B4 h* g7 o# L3 g
Part Pads SMD Layer 2 TO Via Pads Layer 2
. W, @3 K0 v5 F; F4 ^) K9 @ No Hazards.' \1 R* F- @; Z. \+ b1 N
7 {6 p w! L- X! c6 N/ I* A
Part Pads SMD Layer 2 TO Via Holes Layer 2
8 ^, O# o3 ^6 I2 N No Hazards., S4 t# _! s d2 e
! \; t8 ^: b, V, j# p
Part Pads Thru Layer 2 TO Part Pads Thru Layer 2
) G" Y, [' i) f2 I5 b No Hazards. b7 a$ t) j P/ j& m
8 \* ^$ m# V: D$ u; m8 S l) ] Part Pads Thru Layer 2 TO Part Holes Layer 2
5 H4 K7 q: p3 J6 R No Hazards.
# V @5 N7 y! T% ?2 k/ H7 c9 F( i2 t4 G4 B) A/ f
Part Pads Thru Layer 2 TO Via Pads Layer 2% M7 \+ m# ]! G
No Hazards.9 i" |: T' B5 O2 Z; K; e: w
R5 A3 m: [, z+ L5 H2 m# ? Part Pads Thru Layer 2 TO Via Holes Layer 2
9 w) Y" ?9 t9 p No Hazards.' Y2 @) _, N% N8 X8 o% u
! {9 X* O# {; E: G+ j
Part Holes Layer 2 TO Via Pads Layer 21 v* j+ d0 u7 u2 g' }/ w' C# J- o
No Hazards.2 \. E& P+ Y/ j$ m' h0 u* K9 S7 |
. _9 ?5 a' N0 }/ y Part Holes Layer 2 TO Via Holes Layer 2
& c. q3 ]% ^$ `1 h No Hazards.9 M& z4 M6 N8 C6 @8 Q- [
. a( v4 m& k& o3 e/ F$ _3 R
Via Pads Layer 2 TO Via Pads Layer 23 X% c3 s8 Q0 J0 _! X, {3 P, G
No Hazards.
! `; N2 M* C8 R# y. G8 T2 H" r$ e
) z! a! `9 o- r; Z$ O; @) e Via Pads Layer 2 TO Via Holes Layer 2
, P6 n7 ?2 V6 d4 s, L3 i No Hazards." r0 p2 {" `7 r" I
# O' m( f7 p/ e Via Holes Layer 2 TO Via Holes Layer 2
" K1 x2 x; d3 x5 \7 d+ s4 s V5 | No Hazards.& S* Y6 {3 _. u0 u# G
; V) A. v- F* D' X% I
. G- Q# U+ X5 k6 _" b3 d
Total Hazards Found : 4
. x1 t! j4 J6 G+ L
" f/ a: i1 _7 |: Q8 f/ K) W! F% Y" l/ R7 Z
& _% b+ b5 H; G
4 r! |# ?1 {% i Planes Clearances And Rules7 E4 ?5 y( k2 w3 j4 G
---------------------------+ _$ t2 w# R6 Z. p j( `
. J* ]; s% ?* I% g: b$ B Positive Planes Layer 1 TO Part Pads SMD Layer 1
P+ h( |2 k4 w' V- Q3 l: c No Hazards.
) A1 g1 h$ Z7 m5 h4 p, i, o5 K- W& Q7 r
Positive Planes Layer 1 TO Part Pads Thru Layer 11 ]: h e3 z2 [& P
No Hazards.
6 b8 G# J5 A4 m1 t: ?- Z
6 H ~- E( Z6 w0 T4 ^. L% _ Positive Planes Layer 1 TO Part Holes Layer 19 J8 M: N0 u# A7 ]- B) U% s' d
No Hazards.
# C+ {6 ]6 f; x! q
9 {! V, q' b& Z2 K) i Positive Planes Layer 1 TO Positive Planes Layer 1/ L/ ~! }5 ^3 G+ a. @
No Hazards.
8 y( n: e# j% a3 H6 H: s7 g8 D
; ]5 V. o* K; r8 J) e) k1 M) \! b! x Positive Planes Layer 1 TO Route Border4 A8 v* M P& e8 }- `# F9 O
No Hazards./ [4 y7 ~6 y: b0 l) T4 ^
9 \: s o; t( W. K8 J ~2 `
Positive Planes Layer 1 TO Traces Layer 1
! K' A4 [7 h- M8 z6 a2 q& U8 K No Hazards.
; _7 b& T% Y, H( M) d& H6 m( `- Y; W* ?5 G# Q Z8 ~
Positive Planes Layer 1 TO Via Pads Layer 1
; o8 K. ?( J' a No Hazards.
u; b( ^! d$ ?4 b$ y9 {6 [) p, N
Positive Planes Layer 1 TO Via Holes Layer 15 T! n3 q( w0 _: {
No Hazards.! l& D, T: e: D6 Q: b
3 o$ K! q, I; N( R Positive Planes Layer 2 TO Part Pads SMD Layer 2' w2 o' M7 {4 ^- |
No Hazards.
& L2 c: z* q$ y
' g( d) c% `, [ Positive Planes Layer 2 TO Part Pads Thru Layer 2
+ b$ q9 L2 M4 H. U/ {+ E# L7 e No Hazards.
; Q% \ H W7 p. I4 M8 r9 h
7 v7 y4 r- Z7 h- ^# n8 q Positive Planes Layer 2 TO Part Holes Layer 2
# h+ i- o4 x3 f: p1 M% l( W No Hazards.5 k, w+ v6 o5 v! W, A' n
' E I/ o/ [6 k4 C* q
Positive Planes Layer 2 TO Route Border, P. {) l5 u0 ^. t( U- m! e9 z
No Hazards.) o0 z. G* T/ A% l6 j; {- c
2 I) E4 i5 ]7 ~( L8 F+ ? Positive Planes Layer 2 TO Traces Layer 2
5 ?8 Z$ d1 c, `' g5 L. { d4 ^ u No Hazards.
4 T) Y r& p5 V2 N5 d! b; M
# g/ }* u) e+ [0 T Positive Planes Layer 2 TO Via Pads Layer 2
' f. d/ \' ]) k1 ~ No Hazards.
6 h4 K# e. Y4 ~ O
. |" J4 B z+ {4 L0 o Positive Planes Layer 2 TO Via Holes Layer 20 \7 K8 ^/ z$ N% {# l% L
No Hazards.
5 t) h i, ^" H) [1 C7 z1 l1 ]6 i8 E1 x: x3 `& P. _9 c# {
- `# B9 x4 I! |$ p) {
Total Hazards Found : 0
5 ~0 P3 V2 N6 Y: i& ^8 J) |1 K$ t2 K5 _- F3 Y) P# O' ~ K1 N |
$ c0 G9 k* ^( X) `$ G+ e) ?9 i! L# D* F7 p$ `5 {# x
4 [( k7 z4 c8 a Non-Net Class Element To Element Clearances And Rules! f* `. Z, G4 x/ ^" y j5 K" \
-----------------------------------------------------0 S, k% s/ w; T4 N# H! c
9 X" r8 ?2 a1 U Route Border TO Via Pads Layer 1 Clearance: 0mm, D1 W2 d2 t: e) E
No Hazards.
! |9 d3 n; F3 r8 c$ G9 I
1 j# L8 @) a' l) s4 e+ K+ k Route Border TO Traces Layer 1 Clearance: 0mm
F+ ` i, o& h/ ` No Hazards.
& g& A/ f3 Q$ ] B6 T) _9 p. X- u& N7 x# J& f1 M
Part Pads SMD Layer 1 TO Route Border Clearance: 0mm
9 r/ J& T7 ` I, ?* ?% X No Hazards. m0 p/ Z4 Y3 p. F% t, G
: w& `3 G1 ?$ c% \# I: q& v/ d
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm4 }( U# ^8 ` j( s3 c' V/ {
No Hazards.
' q6 y) S7 [0 A9 g2 Z: F7 x3 B1 j. j: Y/ v# b8 r" P; j- l0 X9 u
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm
# h# A! Q# k/ T6 Z No Hazards.
1 P1 H& u. X; M1 W% W8 B& X. n
. X! h& Z5 t: v# I Board Outline TO Via Holes Layer 1 Clearance: 0mm8 L/ i5 r- D1 b7 k7 l' [; f4 e8 I
No Hazards.
2 j9 B: Z8 B8 _
0 a3 m' A4 d" X. i+ h% P% ^5 m5 k c1 T Board Outline TO Via Pads Layer 1 Clearance: 0mm
' `* k7 t: b% g0 m No Hazards.
2 S4 ?8 M9 Z; r" J" y3 ]! S' R6 l# O. W: p: n( N
Board Outline TO Part Holes Layer 1 Clearance: 0mm
- N- n7 ]7 I: E, ?0 ? No Hazards.
& m/ T7 T; Y3 ?2 I( `: i, `- K7 G* K: y3 V# i
>> Board Outline TO Placement Outlines Top Clearance: 0.15mm
; o# J& N, B& j Hazards Found : 2+ \# [7 o0 @) ^# |
# \. [" J7 |# T' m. c8 f" l Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm
' ?+ J2 Z6 V% }2 y No Hazards.
8 h, K ?3 `3 N5 w( ~, q! V$ v. S
0 ?3 J. u0 \! ^ Board Outline TO Traces Layer 1 Clearance: 0mm
5 C9 o/ F% q3 ?' `4 H5 U No Hazards.
) I9 `* r, A# o. k2 S: K6 T
. c9 J. ]: r" T Route Border TO Via Pads Layer 2 Clearance: 0mm
$ ^9 Z# m, P7 Y1 _3 Y2 |- C No Hazards.! R/ o* A( K6 E7 ?; a2 D
( O. L+ ]" j P0 ~8 Z
Route Border TO Traces Layer 2 Clearance: 0mm
' G8 e- n# c3 a* J+ Y/ Y: S6 z* x/ \ No Hazards.1 Y; |) ^5 X5 N& X: ?+ s
6 U& t% e! g% s
Part Pads SMD Layer 2 TO Route Border Clearance: 0mm& q9 h0 t7 w6 W, @# ]% C. S2 ]
No Hazards.
8 A/ P( n! {+ G! v1 i3 |, o5 C% C; n) x
Part Pads Thru Layer 2 TO Route Border Clearance: 0mm
t) w3 d9 ] h6 ?0 a p/ u. U No Hazards.
, n1 h1 j7 n9 }. B8 d
" M* W: e2 g* g Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm3 Q5 G" S9 I @0 [6 m
No Hazards., h8 l) I g; n% P$ A. k
- X2 j8 q0 R z+ S Board Outline TO Via Holes Layer 2 Clearance: 0mm# F0 t! Y4 q- [) d6 A. Z
No Hazards.0 q0 G, [& t2 h: @9 x
1 w% V& a; P. |" R/ u' {# C# r
Board Outline TO Via Pads Layer 2 Clearance: 0mm& u* W! I# B/ |8 `, D
No Hazards.
0 Z/ l' \6 e, A
5 Q% Q; }' d- H, f- H Board Outline TO Part Holes Layer 2 Clearance: 0mm
4 T8 k& i( p- r' x! S8 E2 k) u No Hazards.
8 g# n. W) c; X$ l5 t$ C3 j% o" d5 r, n0 D
Board Outline TO Placement Outlines Bottom Clearance: 0.15mm
- G6 V! G8 H5 i4 v9 { No Hazards.; t- h. X. v, V
0 A3 f- [7 c5 ]6 m! ^% I Board Outline TO Part Pads SMD Layer 2 Clearance: 0mm2 j6 B; n$ x, I% n" v# _
No Hazards.
; p4 d' w" s8 f: C( M$ U# P
# H8 v `: a2 j- g# t Board Outline TO Traces Layer 2 Clearance: 0mm
9 Q) W% h5 E7 N+ L7 K" T No Hazards.
, E7 W& _* ?: Y) e6 Z7 B3 {1 @
_1 q2 Y7 v2 ~; S E. x# |: Q3 d x' D9 Q
Total Hazards Found : 21 V' a, g. ~6 }7 e6 `0 _
3 A L, [& D$ O# v
2 l0 Z" t9 z/ V' D
# f! A. `; R/ X6 \* ^- I) R
Total Proximity Hazards Found : 6
$ I- n2 |- b _& D Z* a/ h; a. {. @ m. {1 f& l, Y0 z* c4 W) e7 ]" g: E. i
3 N4 ]1 x9 q. k
0 v4 U$ y. G. o3 m7 n$ J+ p3 a: a1 D$ S: m4 r4 I( F" ^
----------------------------
' m" L2 }0 E1 ?3 h- E; T CONNECTIVITY & SPECIAL RULES
1 h+ D! y7 J2 ~5 J) P7 X, @3 U ----------------------------
& R- ^$ h7 H2 [4 l, J# c; z7 m# b. w* T
4 y* Q" f6 I6 [" g9 U, b Check For Unplaced Parts : YES
, C( [% G5 B- q7 p" \8 `4 T& K No Hazards.! A5 ^ m( P5 V) q6 K( ^( E! p
S! D Z+ l+ a/ g+ I" m
( i" a8 [1 S% i: w Check For Missing Parts : YES
5 g! E2 I+ m& h No Hazards.$ R& I' x+ g q0 o
% ~/ w5 a. n* w$ o* l
* p" q* S D: Y$ [* F0 ^. l* f
Check Trace Hangers : YES0 O& c6 g! q, y' W: {" `2 z9 E: u
No Hazards.# d" S& c( m5 k0 V* n/ R2 `
) z/ o) e. Q) n5 h, `3 f! ~
5 T# r) G/ `1 u: _2 v3 a
Check Trace Loops : YES9 ?2 w0 S n9 j0 Z5 H# t9 C
No Hazards.
- \& j& r) w; s7 y, r- |. W
! B' z7 ^; v+ n3 K' Y
/ S$ v+ _# ?( z: S* N3 s Check Trace Widths : YES1 }3 S0 F$ l+ e5 l0 p
Hazards Found : 122
* E4 F& W! z& i, R, L+ n; I- H9 b) G, |2 b' Q+ H8 \1 e& ^7 m
" r# _4 \* A y* G) E' Y Check Single Point Nets : YES
- O; F. E0 n& h. X9 x* \8 s* \ Hazards Found : 1( p: B2 T8 P$ Z0 {7 Q9 T$ s- C# [- s
* R- u( P5 B2 P7 T3 M/ s
7 `+ T& m4 C6 ~/ O/ d Check NonPlane Unrouted/Partially Routed Nets : YES" ~ `4 t, A$ i2 j5 G1 T% M" V, ~
No Hazards.! `. l; W1 r" h. f
3 E& h b! R& g/ E7 ?
3 D6 {7 S* I) A
Check Plane Unrouted/Partial Routed Nets : YES
. {8 p- q7 {% a3 h C No Hazards.
7 R+ o& f0 P- `! q: \4 K& K1 X. ^3 r" A6 [6 Y- X7 m0 C
5 X! s' \) f' B: M: Z4 V Check Routed Plane Pins : YES; `! s, h0 h' P0 b1 T' f
No Hazards.
- {. n- Z \# b% |/ w' H7 u; {- P
# [- b- v3 Y+ N( W8 c4 J4 X) c$ F/ c. m. l* [3 k2 ?+ |+ K
Check Plane Islands : YES
5 ?9 F7 B y8 a7 Q9 f: @, Z" H No Hazards.
+ [- S9 p& g' l7 q# d! ]
$ o; r q G/ ]6 t, K! ^! P2 J0 w& n2 n. I, b8 s7 [8 l! O* j5 S
Check Dangling Vias/Jumpers : YES8 J: `: h6 @1 `' {, B! n/ J$ d
No Hazards.) _" s3 w1 I/ b# I8 R
/ t' V- _% G& H! R
# g) u7 m! p* h4 ]8 b/ K" [ Check Unrouted Pins : YES
. a5 }" D3 C' L% `" p3 U! L No Hazards.
- u/ y# j3 L& X! x
/ A; a, N# R# d
) S5 z. b% T9 h0 ?' E2 F* K Check Routed Non-Plated Pins : YES' ]- [& H1 d% B$ r8 n4 `" ?
No Hazards.0 U" r0 |. r. z5 ?
/ L# f' ^' ^6 W3 o# y
8 l2 E& d, ?4 S Check Minimum Annular Ring : NO. a0 o7 V; A4 R% |9 z! y+ I9 {; G
/ o3 H& I0 v, h6 X3 l% Y& o
9 k. e9 D. q% W5 m7 ?
Check For Vias Under SMD Pads : YES
- a q' i8 z, ?! Y4 X* L f No Hazards.' V* v, i& b2 ~9 q) p! h
3 ~& Z/ w8 d/ }. X
. J/ t% J- ?; F4 v8 o, V! y Check For Vias Under Top Place Outlines : YES
/ E8 C# O3 h! h4 z* Z6 { Hazards Found : 52
+ _/ q/ c% F+ S+ H3 v: G
* n! U' R5 W ~* O1 a
# g9 i4 d4 Z$ {, e Check For Vias Under Bottom Place Outlines : YES& y2 E0 B$ H2 C1 F1 d
Hazards Found : 10' [8 i$ K; \, N( D& b# y
) a5 {! B+ ~7 H/ j% n Z9 z, |9 y! n- H$ l- j4 [, q
Check For Missing Conductive Pads : NO' e* q/ j: f8 S5 R% F/ r. w
( M% r9 Z, a4 w, E4 ^$ o! k
. I7 G. Y9 h5 i3 U1 n& x, I- v2 j
Check For Missing Part Soldermask Pads : NO
" `, Q) w2 p0 Z
! L# n3 q; \0 m) {4 N' L% G" V. N7 E- u0 ?, U
Check For Missing Via Soldermask Pads : NO
! A! M$ n( f1 Q! H
: q; [" \. {7 Y; I- V8 f! F3 a, p1 C
9 v( w& F3 B- H9 n* F Check For Missing Solderpaste Pads : NO, n( Z% g1 D, j0 D% s% F/ E
, N+ H; n8 M x& e7 K: _
9 d+ p. r) {# y* Y9 I5 B4 z8 ?0 C+ m. H- G4 V' D7 f
Total Connectivity/SpecialRules Hazards Found : 185
k" Z/ `$ e" `( ~7 u$ o* E" m) s" f- d3 Q
, `( l9 o/ J1 h& R/ y% G
& u) E4 ^4 F* |$ \2 ^2 Y; @
====================================================================! s! R8 ]% E0 N; z1 e# m1 z* E
: b* [) t( E# g9 j
7 |& P$ a- o1 |+ K; J# ^
9 Y0 c. ?, M( _ Total DRC Hazards Found : 191
X9 J0 u7 V' f& R P3 `& P3 C+ f' P3 _# g+ {/ d
8 j7 R0 `/ U1 l( q9 H) u
~6 M* z0 b% ?; o' k& B, {9 z- T 08:00 AM Tuesday, September 09, 2008
7 v% ~9 H J3 @; N* V
: s- g! {( C+ I C$ t ]$ U/ |: d# L
以上是我做的板子的DRC结果，
% G0 g4 `% i8 |" r* ?$ |& V Check For Vias Under Top Place Outlines : YES& s! [# e1 d# _4 X3 X1 e
Hazards Found : 52
2 n) C. V8 t3 ~4 Y U; @4 X
' @0 ]/ G0 u! r" m+ `2 e+ j0 b2 M! Z) Z6 Y
Check For Vias Under Bottom Place Outlines : YES
: v% i2 t& Q3 g0 Q Hazards Found : 107 o3 t7 B7 {! H7 f
; q! X# ^& E( U5 @/ ~
其中元件的放置框内打孔有报错，怎么能让它不报错呢？ |
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发表于 2008-9-9 10:18
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淘帖
支持！
反对！
楼主