[allegro16.6][2层]TI蓝牙模块评估板（CC2650+SFM）pcb文件

shyw559 · 发表于 2019-12-20 18:07

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[allegro16.6][2层]TI蓝牙模块评估板（CC2650+SFM）pcb文件

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文件描述：

1. 作品用途：TI蓝牙模块评估板

2. 软件版本：allegro16.6

3. 层数：2层

4. 用到的主要芯片：CC2650+SFM

5. PCB尺寸：40.9*46.9 mm

作品截图如下：

全层截图：

叠层阻抗信息：

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BOM：

Bill of Material Report (Condensed)
SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS	QUANTITY	REFDES
名称	类型	属性	类别	数量	位号
ANTENNA_DN007AN	ANTENNA_DN007_ANTENNA_DN007AN_2	2.4GHz	IC	1	A1
CAPC1005X60L	CAPACITOR_CAPC1005X60L_2.2UF_CA	2.2uF	IC	1	C2
CAPC1005X60L	CAPACITOR_CAPC1005X60L_100NF_CA	100nF	IC	6	C3; C4; C5; C9; C10; C20
CAPC1005X60L	CAPACITOR_CAPC1005X60L_1PF_CAPC	1pF	IC	2	C11; C21
CAPC1005X60L	CAPACITOR_CAPC1005X60L_DNM_CAPC	DNM	IC	5	C12; C15; C22; C23; C24
CAPC1005X60L	CAPACITOR_CAPC1005X60L_1.2PF_CA	1.2pF	IC	1	C13
CAPC1005X60L	CAPACITOR_CAPC1005X60L_12PF_CAP	12pF	IC	4	C14; C16; C17; C18
CAPC1005X60L	CAPACITOR_CAPC1005X60L_1UF_CAPC	1uF	IC	1	C19
CAPC1005X60L	CAPACITOR_CAPC1005X60L_6.8PF_CA	6.8pF	IC	1	C31
CAPC1608X90L	CAPACITOR_CAPC1608X90L_4.7UF_CA	4.7uF	IC	2	C6; C8
CAPC1608X90L	CAPACITOR_CAPC1608X90L_100NF_CA	100nF	IC	1	C7
FID100X115	FIDMARK_FID100X115_FIDU_1MM	FIDU_1MM	IC	6	FIDU1; FIDU2; FIDU3; FIDU4; FIDU5; FIDU6
FIL_BLM18HE152SN1DL	FILTER_2PIN_FIL_BLM18HE152SN1DL	BLM18HE152SN1	IC	1	FL1
HUSTSAN_SMA10V21TGGAN	CONN_COAX_1+4_HUSTSAN_SMA10V21T	SMA-10V21-TGG	IC	1	J1
INDC1005X60L	INDUCTOR_INDC1005X60L_2.4NH_IND	2.4nH	IC	2	L11; L21
INDC1005X60L	INDUCTOR_INDC1005X60L_2NH_INDC1	2nH	IC	2	L12; L13
INDC2012X150L	INDUCTOR_INDC2012X150L_10UH_IND	10uH	IC	1	L1
OSCCC250X320X80-4L	XTAL_TSX_3225_V1_OSCCC250X320X8	24MHz	IC	1	Y2
QFNFC50P700X700X80-49CL	IC_RF_CC26XX_QFN48_V2_QFNFC50P7	CC2650	IC	1	U1
RESC1005X40L	RESISTOR_RESC1005X40L_100K_RESC	100k	IC	1	R1
RESC1005X40L	RESISTOR_RESC1005X40L_0_RESC100	0	IC	1	R12
SAMTEC_SFM11002AN	CONN_HEADER_2X10_P_S_SAMTEC_SFM	SFM-110-02-S-D-A-K-TR	IC	2	P1; P2
TP150_90H	TEST_POINT_TP150_90H_TP_0.9MM_P	TP_0.9mm_PTH	IC	1	DIO22
XTAL_FC-135N	CRYSTAL_XTAL_FC-135N_32.768KHZ_	32.768kHz	IC	1	Y1