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Hi all,3 l7 L$ a6 k$ D" f1 M! A
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I am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried core Via (L2-L3)
7 W% j# I% S6 F% j, qBlind via size 60 um drill / 100um pad , Via length 40um
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Buried Core via size 100um drill / 200um pad , via length 150um
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Anyone knows the Current carrying capacity of above mentioned blind and buried core via ?
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What is the general Via wall thickness in substrate?
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Thanks in Advance
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发表于 2019-1-10 21:53
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支持！
反对！
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